Curable resin composition, composite member, and production method therefor

Patent metadata

Field	Value
Publication number	US-12012532-B2
Application number	US-201917267682-A
Country	US
Kind code	B2
Filing date	Aug 7, 2019
Priority date	Aug 30, 2018
Publication date	Jun 18, 2024
Grant date	Jun 18, 2024

Abstract

Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C8-18 alkylene chain and has a melting point from 160 to 250° C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.

First claim

The invention claimed is:

1. A curable resin composition comprising:
a polyamide-based resin;
a blocked polyisocyanate; and
an epoxy compound,
wherein the molar ratio of the amino groups to the carboxy groups of the polyamide-based resin is from 60/40 to 99.9/0.1,
the polyamide-based resin includes an amino group concentration from 20 to 300 mmol/kg and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570, in which a dried sample formed of the polyamide-based resin with a thickness of 0.125 is cooled in a desiccator, then a mass of the sample is measured, the sample is immersed in water of 23° C. for 24 hours, and then removed from the water, excess moisture is wiped off, and then the mass of the sample is measured, a ratio of the mass of the sample after wiping off the excess moisture to the mass of the dried sample being defined as the water absorption,
the quantitative proportion of the polyamide-based resin relative to the total amount of 100 mass % of the polyamide-based resin, the blocked polyisocyanate, and the epoxy compound is from 50 to 95 mass %,
the total number of moles of isocyanate groups of the blocked polyisocyanate is from 1.3 to 50 times relative to the total number of moles of the amino groups of the polyamide-based resin,
the molar ratio of the carboxy groups of the polyamide-based resin to the epoxy groups of the epoxy compound is from 0.01/1 to 0.5/1 in terms of the former/latter, and
the proportion of epoxy groups of the epoxy compound is from 0.1 to 1 mol relative to 1 mol of the amino group concentration of the polyamide-based resin.

2. The curable resin composition according to claim 1 , wherein the polyamide-based resin includes a C8-18 alkylene chain, and has an amino group concentration from 25 to 275 mmol/kg and a melting point from 160 to 250° C.

3. The curable resin composition according to claim 1 , wherein the polyamide-based resin has a proportion of a component having a C8-16 alkylene chain from 65 to 100 mol % relative to a total amount of components forming the polyamide-based resin, and has a water absorption of 0.75 mass % or less determined by the water absorption test specified by ASTM D570.

4. The curable resin composition according to claim 1 , wherein the polyamide-based resin has a proportion of a component having a C10-14 alkylene chain from 70 to 100 mol % relative to a total amount of components forming the polyamide-based resin, and has an amino group concentration from 50 to 250 mmol/kg and a melting point from 170 to 220° C.

5. The curable resin composition according to claim 1 , wherein the polyamide-based resin is a homo- or copolyamide resin that includes a component having at least one type of C11-13 alkylene chain selected from the group consisting of C11-13 lactams and C11-13 aminocarboxylic acids, at a proportion from 75 to 100 mol % relative to a total amount of components forming the polyamide-based resin, and has a water absorption of 0.65 mass % or less determined by the water absorption test specified by ASTM D570.

6. The curable resin composition according to claim 1 , wherein the polyamide-based resin has a water absorption of 0.3 mass % or less determined by the water absorption test specified by ASTM D570.

7. The curable resin composition according to claim 1 , wherein the blocked polyisocyanate has a glass transition temperature from 60 to 110° C., a melting point from 70 to 130° C., and a dissociation temperature from 120 to 200° C.; and the epoxy compound includes a bisphenol-type epoxy resin having a softening temperature of 75° C. or higher.

8. The curable resin composition according to claim 1 , wherein, per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.

9. The curable resin composition according to claim 1 , wherein isocyanate groups of the blocked polyisocyanate are present at an excess from 15 to 450 mmol/kg relative to amino groups of the polyamide-based resin, and a concentration of epoxy groups is from 3 to 35 mol % relative to a total number of moles of amino groups, isocyanate groups, and epoxy groups.

10. The curable resin composition according to claim 1 , wherein a total number of moles of isocyanate groups of the blocked polyisocyanate is from 1.5 to 40 times a total number of moles of amino groups of the polyamide-based resin, and the curable resin composition includes the blocked polyisocyanate at a proportion from 5 to 30 parts by mass, and the epoxy compound at a proportion from 5 to 30 parts by mass per 100 parts by mass of the polyamide-based resin.

11. A composite member in which an adhesive layer of the curable resin composition described in claim 1 is formed on a surface of a base material.

12. A molded composite member formed by molding or laminating a composition containing at least a thermoplastic resin onto the adhesive layer of the composite member described in claim 11 .

13. The molded composite member according to claim 12 , wherein the base material is a metal base material, and the thermoplastic resin includes a polyamide-based resin having a higher melting point than that of the polyamide-based resin of the curable resin composition.

14. A method of producing a composite member, the method comprising forming an adhesive layer by coating a surface of a base material with the curable resin composition described in claim 1 .

15. A method for producing a molded composite member by molding or laminating a composition including at least a thermoplastic resin onto the adhesive layer of the composite member described in claim 11 .

Assignees

• Daicel Evonik Ltd
• Honda Motor Co Ltd

Inventors

• Mutsuda Mitsuteru
• Iguchi Hirofumi
• Nakamura Toshiaki
• Sato Nao
• Tezuka Mutsuo
• Nakajima Yasufumi

Classifications

• C09J11/06

  organic · CPC title

• C08G18/80

  Masked polyisocyanates · CPC title

• C08G18/603

  Polyamides · CPC title

• C08G18/58

  Epoxy resins {(C08G18/42, C08G18/48 take precedence; reaction products of epoxy resins with at least equivalent amounts of compounds containing active hydrogen C08G18/6407, with at least equivalent amounts of amines C08G18/6415; polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen C08G18/003)} · CPC title

• B32B2605/00

  Vehicles · CPC title