Carrier head having abrasive structure on retainer ring

Patent metadata

Field	Value
Publication number	US-12011803-B2
Application number	US-201916419256-A
Country	US
Kind code	B2
Filing date	May 22, 2019
Priority date	Dec 13, 2013
Publication date	Jun 18, 2024
Grant date	Jun 18, 2024

Abstract

The present disclosure, in some embodiments, relates to a polishing system. The polishing system includes a carrier head configured to enclose a wafer. The carrier head has a retainer ring configured to laterally surround the wafer and an abrasive structure that partially covers a lower surface of the retainer ring. A membrane support is surrounded by the retainer ring and defines one or more ports. One or more chambers are coupled to the one or more ports and are defined by the membrane support and a flexible membrane having a lower surface configured to contact the wafer.

First claim

What is claimed is:

1. A polishing system, comprising:
a carrier head configured to enclose a wafer, the carrier head comprising a retainer ring configured to laterally surround the wafer, wherein the retainer ring comprises a lower surface having a plurality of protrusions that form apexes and valleys;
a cushion member arranged between a lower surface of a housing and a topmost surface of the retainer ring, wherein the cushion member continuously extends along opposing outer sidewalls of the retainer ring and the topmost surface of the retainer ring;
a membrane support surrounded by the retainer ring and defining one or more ports extending between a top of the membrane support and a bottommost surface of the membrane support, wherein one or more chambers coupled to the one or more ports are defined by the bottommost surface of the membrane support and by interior sidewalls of a flexible membrane having a bottommost surface configured to contact the wafer, the flexible membrane further comprising an outermost sidewall that continuously extends from the bottommost surface of the flexible membrane to a topmost surface of the flexible membrane, the topmost surface of the flexible membrane being vertically below the bottommost surface of the membrane support and physically contacting the bottommost surface of the membrane support directly above one of the one or more chambers;
a conformal film covering bottoms and sidewalls of the plurality of protrusions; and
wherein the retainer ring, when viewed in cross-section, has segments disposed on opposing sides of the membrane support, the segments respectively comprising a symmetric structure having opposing outermost sidewalls that are coupled to opposing uppermost sidewalls of the retainer ring by horizontally extending surfaces of the retainer ring, the horizontally extending surfaces being vertically below the opposing uppermost sidewalls and above a top of the one or more chambers.

2. The polishing system of claim 1 , wherein the conformal film comprises a sidewall that vertically extends from below a bottom of a protrusion of the plurality of protrusions to a horizontally extending surface of the conformal film that is laterally between the protrusion and an adjacent protrusion, the sidewall extending along a straight line that is parallel to a sidewall of the protrusion.

3. The polishing system of claim 1 ,
wherein a bottom surface of the cushion member extends from directly over the horizontally extending surfaces to laterally past at least one of the opposing outermost sidewalls of the retainer ring.

4. The polishing system of claim 1 ,
wherein the retainer ring comprises sidewalls defining grooves having a substantially constant width, the grooves arranged along the lower surface of the retainer ring and extending radially outward from a point at a center of the retainer ring; and
wherein the grooves extend in a direction that is normal to an interior surface of the retainer ring facing the center of the retainer ring and an exterior surface of the retainer ring facing away from the center.

5. The polishing system of claim 1 , wherein the interior sidewalls of the flexible membrane have a maximum height that is less than maximum heights of the one or more chambers below the bottommost surface of the membrane support.

6. The polishing system of claim 1 , wherein the plurality of protrusions are triangular shaped protrusions separated from one another by a flat horizontal surface of the retainer ring, the triangular shaped protrusions and the flat horizontal surface forming a trapezoid shaped space separating adjacent ones of the triangular shaped protrusions as viewed along a cross-sectional view.

7. The polishing system of claim 1 , wherein the one or more chambers comprise different sized chambers.

8. A polishing system, comprising:
a polishing pad;
a carrier head configured to enclose a wafer, the carrier head comprising:
a membrane support having sidewalls forming one or more ports, wherein one or more chambers are coupled to the one or more ports and are formed by a bottommost surface of the membrane support and a flexible membrane having a lower surface configured to contact the wafer;
a retainer ring configured to surround the wafer and the membrane support, wherein the retainer ring, when viewed in cross-section, has first and second segments disposed on opposing sides of the membrane support, the first and second segments respectively comprising a symmetric structure having opposing outermost sidewalls that are respectively coupled to opposing uppermost sidewalls of the retainer ring by horizontally extending surfaces of the retainer ring, the horizontally extending surfaces being vertically below the opposing uppermost sidewalls and above a top of the one or more chambers; and
an abrasive structure configured to contact an upper surface of the polishing pad; and

wherein the abrasive structure comprises a lower surface having a plurality of protrusions that form apexes and valleys, wherein a conformal film covers bottoms and sidewalls of the plurality of protrusions, the conformal film having an outer surface that continuously extends along a line that is parallel to a sidewall of an overlying one of the plurality of protrusions and that covers the sidewall of the overlying one of the plurality of protrusions.

9. The polishing system of claim 8 , wherein the outer surface of the conformal film continuously extends along the line from vertically over the apexes of the plurality of protrusions to vertically below the apexes.

10. The polishing system of claim 8 , wherein the carrier head further comprises a housing continuously extending from over the membrane support to a bottommost surface that is laterally outside of the retainer ring, the bottommost surface being vertically between the horizontally extending surfaces and a top of the abrasive structure.

11. The polishing system of claim 8 , wherein the conformal film has linearly extending surfaces arranged along opposing sides of the plurality of protrusions, the linearly extending surfaces forming a triangular shaped outer perimeter of the conformal film.

12. The polishing system of claim 8 , wherein the conformal film has a substantially uniform thickness between outermost sidewalls of the conformal film.

13. The polishing system of claim 8 , further comprising:
a housing arranged over the membrane support and the retainer ring, wherein the housing continuously extends from over the retainer ring to along a side of the retainer ring facing away from the membrane support; and
one or more cushion members arranged vertically between a lower surface of the housing and a top of the retainer ring, wherein the one or more cushion members extend along and cover a part, but not all, of the opposing uppermost sidewalls of the retainer ring.

14. A polishing system, comprising:
a carrier head configured to enclose a wafer, the carrier head comprising:
a retainer ring configured to surround the wafer, wherein the retainer ring, when viewed in cross-section, has segments disposed along opposing sides of the carrier head, the segments respectively comprising a symmetric structure having opposing outermost sidewalls that are coupled to opposing uppermost sidewalls of the retainer ring by horizontally extending surfaces of the retainer ring, the horizontally extending surfaces being vertically between a top and a bottom of the retainer ring and above a top of one or more chambers;
an abrasive structure disposed along a lower surface of the retainer ring and being configured to contact an upper surface of a polishing pad, wherein t

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lin Chang-Sheng

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• B24B37/10

  for single side lapping · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title