Eyewear with RF shielding having grounding springs

Patent metadata

Field	Value
Publication number	US-12010825-B2
Application number	US-202217694860-A
Country	US
Kind code	B2
Filing date	Mar 15, 2022
Priority date	Mar 15, 2022
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

A shield can for an electronic eyewear device is described that reduces RF signals emanating from the electronic eyewear device. The shield can is attached to a ground plate of the electronic eyewear device using leaf springs on a side of the shield can. The leaf springs do not add to the stack-up thickness of the shield can assembly and provide a balanced force against the ground plate. The shield can is attached to a printed circuit board and encompasses radio frequency (RF) electronic components to prevent RF signals emanating from the RF electronic components. The leaf springs have a pair of fingers providing the balanced mechanical point force. A conductive pressure sensitive adhesive is also provided to secure a top surface of the shield can to the ground plate along with a thermal paste.

First claim

What is claimed is:

1. Electronic eyewear device, comprising:
a ground plate;
a printed circuit board (PCB) having electronic components;
a head-mounted frame supporting the ground plate and the PCB;
a shield can encompassing the electronic components, the shield can having a side wall extending between the ground plate and the PCB; and
a leaf spring coupled to the side wall and engaging the ground plate, wherein the leaf spring has protrusions that engage the ground plate, wherein the leaf spring has a spring arm that couples the leaf spring to the side wall and extends laterally from the side wall, the spring arm configured to create a bias force of the protrusions against the ground plate.

2. The electronic eyewear device of claim 1 , wherein the side wall extends perpendicular to a surface of the ground plate.

3. The electronic eyewear device of claim 1 , wherein the leaf spring has a pair of symmetric leaf fingers, wherein each of the leaf fingers includes a protrusion configured to engage the ground plate.

4. The electronic eyewear device of claim 1 , wherein the electronic components include radio frequency (RF) components and wherein the shield can is grounded to the ground plate.

5. The electronic eyewear device of claim 1 , further comprising a conductive pressure sensitive adhesive (CPSA) disposed between the shield can and the ground plate.

6. The electronic eyewear device of claim 1 , wherein the shield can is comprised of folded sheet metal.

7. A shield can configured to be disposed between a printed circuit board (PCB) having electronic components and a ground plate, the shield can having a side wall configured to extend between the PCB and the ground plate, a conductive pressure sensitive adhesive (CPSA) between the shield can and the ground plate, the shield can having a leaf spring coupled to the side wall and biased to engage the ground plate when the shield can is coupled to the ground plate, wherein the shield can is configured to reduce emanation of radio frequency (RF) signals generated by the electronic components from within the shield can.

8. A method of using an electronic eyewear device, the electronic eyewear device having a ground plate, a printed circuit board (PCB) having electronic components; a head-mounted frame supporting the ground plate and the PCB, a shield can extending between the ground plate and the PCB, the shield can having a side wall extending between the ground plate and the PCB, and a leaf spring coupled to the side wall and engaging the ground plate, wherein the leaf spring has protrusions engaging the ground plate, wherein the leaf spring has a spring arm that couples the leaf spring to the side wall and extends laterally from the side wall, the spring arm configured to create a bias force of the protrusions against the ground plate, the method comprising:
grounding the shield can to the ground plate, the shield can encompassing the electronic components; and
reducing an emanation of RF signals from the electronic eyewear device with the shield can, the RF signals generated by the electronic components from within the shield can.

9. The method of claim 8 , wherein the side wall extends perpendicular to the ground plate.

10. The method of claim 1 , wherein the leaf spring has a pair of symmetric leaf fingers, wherein each of the leaf fingers include a protrusion configured to engage the ground plate.

11. The method of claim 1 , wherein the leaf spring does not create any openings in an upper surface of the shield can.

12. The method of claim 8 , wherein the electronic components are radio frequency (RF) components, wherein the shield can is grounded to the ground plate and is configured to reduce RF signals emanating from the electronic components such that the shield can is an RF shield.

13. The method of claim 8 , further comprising a conductive pressure sensitive adhesive (CPSA) disposed between the shield can and the ground plate.

14. The method of claim 8 , wherein the shield can is comprised of folded sheet metal.

15. A method of coupling a shield can between a printed circuit board (PCB) having electronic components and a ground plate, the shield can having a side wall and a leaf spring extending from the side wall between the PCB and the ground plate, comprising:
coupling the shield can to the PCB such that the shield can encompasses the electronic components;
coupling the shield can to the ground plate such that the leaf spring is biased against the ground plate; and
disposing a conductive pressure sensitive adhesive (CPSA) between the shield can and the ground plate.

Assignees

• Okoli Chukwubuikem Marcel
• Olgun Ugur
• Steger Stephen Andrew
• Snap Inc

Inventors

• Okoli Chukwubuikem Marcel
• Olgun Ugur
• Steger Stephen Andrew

Classifications

• G02B2027/0178

  Eyeglass type (eyeglass details G02C) · CPC title

• H05K9/0035

  with retainers mounted beforehand on the PCB, e.g. clips · CPC title

• H05K9/0039

  Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing (printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218) · CPC title

• H05K9/0037 Primary

  Housings with compartments containing a PCB, e.g. partitioning walls · CPC title

• H05K9/0032

  having multiple parts, e.g. frames mating with lids · CPC title