Electronic switch module with oppositely-arranged power switches and discrete heat sinks

Patent metadata

Field	Value
Publication number	US-12010799-B2
Application number	US-201916449761-A
Country	US
Kind code	B2
Filing date	Jun 24, 2019
Priority date	Jun 28, 2018
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

An electronic module is provided including a circuit board defining a longitudinal axis and having a first surface and a second surface. A module housing is provided having a bottom surface and side walls extending from the bottom surface to form an open face through which the circuit board is received. Power switches configured as an inverter circuit to drive an electric motor are mounted on the second surface of the circuit board facing the bottom surface of the module housing, and a series of heat sinks are discretely mounted on the first surface of the circuit board facing the open face opposite the power switches. Potting material is disposed in the distance between the circuit board and the bottom surface of the module housing to cover the power switches. Thermal vias are disposed through the circuit board between corresponding ones of the heat sinks and the power switches.

First claim

The invention claimed is:

1. An electronic module comprising:
a circuit board defining a longitudinal axis and having a first surface and a second surface;
a module housing having a bottom surface and a plurality of side walls extending from the bottom surface to form an open face, the module housing receiving the circuit board through the open face and retaining the circuit board within the side walls substantially parallel to the bottom surface and at a distance from the bottom surface;
a plurality of power switches configured as an inverter circuit to supply power from a power supply to an electric motor and mounted on the second surface of the circuit board facing the bottom surface of the module housing, wherein the plurality of power switches comprises a plurality of high-side power switches disposed between a positive node of the power supply and the electric motor and a plurality of low-side power switches disposed between a negative node of the power supply and the electric motor;
a plurality of heat sinks discretely mounted on the first surface of the circuit board facing the open face, the plurality of heat sinks being arranged opposite the plurality of power switches and electrically coupled to drains of the plurality of power switches;
potting material disposed in the distance between the circuit board and the bottom surface of the module housing to cover the plurality of power switches;
a plurality of thermal vias disposed through the circuit board between corresponding ones of the plurality of heat sinks and the plurality of power switches to thermally and electrically couple the plurality of heat sinks and the plurality of power switches;
a main conductive track disposed on the first surface of the circuit board providing a mounting surface for three of the plurality of heat sinks corresponding to the high-side power switches, the main conductive track electrically coupling the three of the plurality of heat sinks corresponding to the high-side power switches to the positive node of the power supply;
a sliding member supported within the module housing and coupled to an actuator outside the module housing, the actuator causing movement of the sliding member in a direction substantially perpendicular to the longitudinal axis of the circuit board;
a first conductive body mounted on the first surface of the circuit board and including a terminal tab coupled to the positive node of the power supply;
a second conductive body mounted on the first surface of the circuit board in electrical contact with the main conductive track; and
a contact switch supported by the first conductive body and pivotably moveable by the sliding member to make contact with the second conductive body with movement of the actuator.

2. The electronic module of claim 1 , wherein the main conductive track includes an axial portion that extends along the longitudinal axis of the circuit board and on which three of the plurality of heat sinks are mounted, and a traversal portion arranged at a distance from the plurality of heat sinks in a direction traverse of the longitudinal axis of the circuit board.

3. The electronic module of claim 1 , further comprising a plurality of discrete conductive tracks being electrically-isolated and disposed on the first surface of the circuit board along a row substantially parallel to the longitudinal axis of the circuit board, the plurality of discrete conductive tracks providing mounting surfaces for three of the plurality of heat sinks corresponding to the low-side power switches.

4. The electronic module of claim 1 , wherein the second conductive body is mounted on the main conductive track.

5. The electronic module of claim 1 , wherein
the first conductive body includes a first pin received through a first through-hole of the circuit board to make electrical contact with a first conductive track on the second surface of the circuit board,
the second conductive body includes a second pin received through a second through-hole of the circuit board to make electrical contact with a second conductive track on the second surface of the circuit board, and
the electronic module further comprises a flyback diode mounted on the second surface of the circuit board and electrically connected between the first conductive track and the second conductive track.

6. An electronic module comprising:
a circuit board having a first surface and a second surface;
a plurality of power switches configured as an inverter circuit to supply power from a power supply to an electric motor, wherein the plurality of power switches comprises a plurality of high-side power switches disposed between a positive node of the power supply and the electric motor and a plurality of low-side power switches disposed between a negative node of the power supply and the electric motor;
a plurality of heat sinks comprising at least one first heat sink and a plurality of second heat sinks discretely mounted on the first surface of the circuit board;
a main conductive track disposed on the first surface of the circuit board, wherein the at least one first heat sink is mounted on the main conductive track and the plurality of high-side power switches is mounted on the second surface of the circuit board opposite the at least one first heat sink and the main conductive track; and
a plurality of discrete conductive tracks being electrically-isolated and disposed on the first surface of the circuit board along a row substantially parallel to the main conductive track, wherein the plurality of second heat sinks is mounted respectively on the plurality of discrete conductive tracks and the plurality of low-side power switches is mounted on the second surface of the circuit board opposite the plurality of second heat sinks and the plurality of discrete conductive tracks.

7. The electronic module of claim 6 , further comprising a module housing having a bottom surface and a plurality of side walls extending from the bottom surface to form an open face, the module housing receiving the circuit board through the open face and retaining the circuit board within the side walls substantially parallel to the bottom surface and at a distance from the bottom surface, wherein the plurality of low-side power switches face the bottom surface of the module housing.

8. The electronic module of claim 7 , further comprising potting material disposed in the distance between the circuit board and the bottom surface of the module housing to cover the plurality of power switches.

9. The electronic module of claim 6 , further comprising a plurality of thermal vias disposed through the circuit board between corresponding ones of the plurality of heat sinks and the plurality of power switches to thermally and electrically couple the plurality of heat sinks and the plurality of power switches.

10. The electronic module of claim 6 , wherein the main conductive track includes an axial portion that extends along a longitudinal axis of the circuit board and on which the at least one first heat sink is mounted, and a traversal portion arranged at a distance from the plurality of heat sinks in a direction traverse of the longitudinal axis of the circuit board.

11. The electronic module of claim 10 , further comprising a power contact switch partially mounted on the traversal portion of the main conductive track.

12. The electronic module of claim 6 , further comprising a first plurality of power switch conductive tracks disposed on the second surface of the circuit board opposite the main conductive track to provide mounting surfaces for the plurality of high-side power switches, and a second plurality of power switch conductive t

Assignees

• Black & Decker Inc

Inventors

• Lewis Joshua M
• Grove Michael D

Classifications

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H02P6/14

  Electronic commutators · CPC title

• H02M7/48

  using discharge tubes with control electrode or semiconductor devices with control electrode · CPC title

• H02K23/18

  having displaceable main or auxiliary brushes · CPC title