Device having an electroceramic component

US12010787B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12010787-B2
Application numberUS-202017635124-A
CountryUS
Kind codeB2
Filing dateAug 11, 2020
Priority dateAug 27, 2019
Publication dateJun 11, 2024
Grant dateJun 11, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A device including an electroceramic component having a first area and a second area, a potting compound at least partially surrounding the electroceramic component, and a sleeve-shaped housing which at least partially surrounds the potting compound. The housing has, in a first housing section that surrounds the potting compound in the first area of the electroceramic component, a material wherein the thermal conductivity of said material is greater than the thermal conductivity of a material of the housing in a second housing section. The housing in the second housing section surrounding the potting compound in the second area of the electroceramic component includes a non-conductive material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A device, comprising an electroceramic component having a first area and a second area, a potting compound which at least partially surrounds the electroceramic component, and a sleeve-shaped housing which at least partially surrounds the potting compound, wherein the housing comprises, in a first housing section which surrounds the potting compound in the first area of the electroceramic component, a material the thermal conductivity of which is greater than the thermal conductivity of a material of the housing in a second housing section, and wherein the housing comprises a non-conductive material in the second housing section which surrounds the potting compound in the second area of the electroceramic component. 2. The device according to claim 1 , wherein the first area of the electroceramic component is a low voltage area, and wherein the second area of the electroceramic component is a high voltage area. 3. The device according to claim 1 , wherein the non-conductive material is a plastic, Teflon, glass or ceramic. 4. The device according to claim 1 , wherein an outer surface of the sleeve-shaped housing facing away from the electroceramic component has a flat surface. 5. The device according to claim 1 , wherein the material of the housing in the first housing section is a metal, a metal alloy, a thermally good conducting plastic or a ceramic. 6. The device according to claim 1 , wherein the electroceramic component protrudes from the potting compound. 7. The device according to claim 1 , wherein the potting compound covers an end face of the electroceramic component in the second area facing away from the first area, wherein the potting compound is thinner on the end face than on lateral surfaces of the electroceramic component. 8. The device according to claim 1 , the device further comprising a vacuum chamber sealing a treatment space in which the device is arranged from an environment of the device, wherein a pressure reduced from atmospheric pressure or a vacuum is present in the treatment space. 9. The device according to claim 1 , the device further comprising a contact wire via which the electroceramic component is electrically contacted, wherein the contact wire has at least one bend. 10. The device according to claim 1 , the device further comprising a cover adjoining an end of the first housing section facing away from the second housing section. 11. The device according to claim 10 , wherein the potting compound covers an end face of the electroceramic component in the first area facing away from the second area, and mechanically decouples the electroceramic component from the cover. 12. The device according to claim 11 , wherein the contact wire extends through the cover and the at least one bend of the contact wire is arranged inside the cover. 13. The device according to claim 11 , wherein the cover comprises a material which is harder than the potting compound. 14. The device according to claim 1 , the device further comprising a capsule surrounding the second area of the electroceramic component. 15. The device according to claim 4 , wherein the capsule is filled with a process gas, and/or wherein inside the capsule a pressure is reduced with respect to atmospheric pressure, or wherein inside the capsule a vacuum is present. 16. The device according to claim 1 , the device further comprising terminals for electrical further contacting of the device, wherein the terminals are adapted to be detachably fixed by means of a bayonet connection, a clamp connection or a plug connection. 17. The device according to claim 16 , the device further comprising a spring element arranged to exert a force which contributes to a separation of the further contacting. 18. The device according to claim 1 , wherein the electroceramic component is a piezoelectric transformer. 19. Plasma generator comprising a device according to claim 1 , wherein the electroceramic component is configured to generate a non-thermal atmospheric pressure plasma.

Assignees

Inventors

Classifications

  • with electrical input and electrical output, e.g. functioning as transformers · CPC title

  • Non-thermal plasma · CPC title

  • at atmospheric pressure · CPC title

  • H10N30/88Primary

    Mounts; Supports; Enclosures; Casings · CPC title

  • Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins · CPC title

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What does patent US12010787B2 cover?
A device including an electroceramic component having a first area and a second area, a potting compound at least partially surrounding the electroceramic component, and a sleeve-shaped housing which at least partially surrounds the potting compound. The housing has, in a first housing section that surrounds the potting compound in the first area of the electroceramic component, a material wher…
Who is the assignee on this patent?
Tdk Electronics Ag
What technology area does this patent fall under?
Primary CPC classification H10N30/88. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 11 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).