Heat transfer device

US12009275B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12009275-B2
Application numberUS-202117381259-A
CountryUS
Kind codeB2
Filing dateJul 21, 2021
Priority dateJul 27, 2020
Publication dateJun 11, 2024
Grant dateJun 11, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat transfer device, comprising: a first heat conduction sheet, including two first rigid parts and a first bendable part, and two ends of the first bendable part are respectively and directly connected to the two first rigid parts; and a second heat conduction sheet, including two second rigid parts and a second bendable part, and two ends of the second bendable part are respectively and directly connected to the two second rigid parts; wherein the two first rigid parts of the first heat conduction sheet are thermally coupled to the two second rigid parts of the second heat conduction sheet, respectively, and the first bendable part includes at least one first nonlinear section, such that the first bendable part is longer than the second bendable part, wherein the at least one first nonlinear section forms undulation when the heat transfer device is at an unfolded state, and the undulation of the at least one first nonlinear section disappears when the heat transfer device is at a folded state. 2. The heat transfer device according to claim 1 , wherein the at least one first nonlinear section extends to form a recess, and the recess faces a direction away from the second heat conduction sheet. 3. The heat transfer device according to claim 2 , wherein when the heat transfer device is at an unfolded state, the two first rigid parts are at a reference plane, and the at least one first nonlinear section is between the reference plane and the second heat conduction sheet. 4. The heat transfer device according to claim 2 , further comprising: a third heat conduction sheet, including two third rigid parts and a third bendable part, and the third bendable part is connected between the two third rigid parts; wherein the first heat conduction sheet is between the second heat conduction sheet and the third heat conduction sheet, the two first rigid parts are thermally coupled to the two third rigid parts, the third bendable part includes at least one third nonlinear section, and the at least one third nonlinear section is in the recess. 5. The heat transfer device according to claim 4 , wherein a number of the at least one third nonlinear section is greater than a number of the at least one first nonlinear section. 6. The heat transfer device according to claim 4 , wherein the at least one first nonlinear section includes a first ladder structure, the at least one third nonlinear section includes a plurality of third ladder structures, a maximum width of the third ladder structure is smaller than the maximum width of the first ladder structure, and the third ladder structures is accommodated in the first ladder structure. 7. The heat transfer device according to claim 1 , further comprising: a third heat conduction sheet connected between the first heat conduction sheet and the second heat conduction sheet, the third heat conduction sheet further includes a disconnection part, the disconnection part is between the first bendable part and the second bendable part. 8. The heat transfer device according to claim 7 , further comprising: a fourth heat conduction sheet, located at a side of the first heat conduction sheet away from the third heat conduction sheet, the fourth heat conduction sheet is thermally coupled to the two first rigid parts, the fourth heat conduction sheet includes a plurality of fourth nonlinear sections, the at least one first nonlinear section extends to form a recess to accommodate the fourth nonlinear sections. 9. The heat transfer device according to claim 1 , further comprising: a thermal conductor fixedly connected between one of the two first rigid parts and one of the two second rigid parts. 10. The heat transfer device according to claim 1 , wherein one of the two first rigid parts and one of the two second rigid parts soldered together. 11. A heat transfer device, comprising: a first heat conduction sheet, including two first rigid parts and a first bendable part, the first bendable part is connected between the two first rigid parts; and a second heat conduction sheet, including two second rigid parts and a second bendable part, the second bendable part is connected between the two second rigid parts, a third heat conduction sheet connected between the first heat conduction sheet and the second heat conduction sheet, the third heat conduction sheet further includes a disconnection part, the disconnection part is between the first bendable part and the second bendable part, wherein the two first rigid parts of the first heat conduction sheet are thermally coupled to the two second rigid parts of the second heat conduction sheet, respectively, and the first bendable part includes at least one first nonlinear section. 12. A heat transfer device, comprising: a first heat conduction sheet, including two first rigid parts and a first bendable part, the first bendable part is connected between the two first rigid parts; and a second heat conduction sheet, including two second rigid parts and a second bendable part, the second bendable part is connected between the two second rigid parts; wherein the two first rigid parts of the first heat conduction sheet are thermally coupled to the two second rigid parts of the second heat conduction sheet, respectively, and the first bendable part includes at least one first nonlinear section, such that the first bendable part is longer than the second bendable part, wherein the at least one first nonlinear section is detached from a reference plane extended along the first heat conduction sheet, and wherein the at least one first nonlinear section includes a ladder structure in a shape of isosceles trapezoid, wherein the at least one first nonlinear section forms undulation when the heat transfer device is at an unfolded state, and the undulation of the at least one first nonlinear section disappears when the heat transfer device is at a folded state.

Assignees

Inventors

Classifications

  • H10W40/226Primary

    characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

  • Heat sinks · CPC title

  • with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste · CPC title

  • Flexible elements · CPC title

  • the conduits for one heat-exchange medium being formed by spaced plates with inserted elements (F28D9/0012, F28D9/0025, F28D9/0081, F28D9/04 take precedence) · CPC title

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What does patent US12009275B2 cover?
A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second ri…
Who is the assignee on this patent?
Asustek Comp Inc
What technology area does this patent fall under?
Primary CPC classification H10W40/226. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 11 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).