Floating heat spreader for processing assembly

Patent metadata

Field	Value
Publication number	US-12007818-B2
Application number	US-202016867918-A
Country	US
Kind code	B2
Filing date	May 6, 2020
Priority date	May 6, 2020
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.

First claim

What is claimed is:

1. An automated driving system computer comprising:
a board;
one or more processors coupled to the board;
a first layer of a first thermal interface material applied on the one or more processors;
a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, the heat spreader having a shoulder extending therefrom;
a heat transfer component embedded in the heat spreader, the heat transfer component configured to collect heat from the first side of the heat spreader in contact with the first layer of the first thermal interface material applied on the one or more processors, and transfer the heat to the second side of the heat spreader;
a fastener disposed through the shoulder of the heat spreader, the fastener securing the heat spreader to the board;
a spring disposed around the fastener, wherein the spring presses against the shoulder of the heat spreader and thereby compresses the heat spreader against the one or more processors;
a bushing disposed between the fastener and the spring, wherein the bushing insulates the heat spreader to prevent heat from transferring to the fastener and the board, and wherein the bushing dampens energy transfer between the heat spreader, the fastener, and the board;
a second layer of a second thermal interface material applied on the second side of the heat spreader; and
a cold plate in contact with the second layer of the second thermal interface material.

2. The automated driving system computer of claim 1 , wherein the heat spreader is not in direct contact with the board.

3. The automated driving system computer of claim 2 , wherein the spring controls an amount of force of the heat spreader applies to the one or more processors.

4. The automated driving system computer of claim 1 , wherein the heat spreader is made of a conductive material.

5. The automated driving system computer of claim 4 , wherein the conductive material is copper.

6. The automated driving system computer of claim 1 , wherein the cold plate comprises one or more fluid channels.

7. The automated driving system computer of claim 1 , wherein the heat spreader further comprises one or more heat pipes coupled to or embedded in the heat spreader and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors.

8. The automated driving system computer of claim 1 , wherein the heat spreader further comprises one or more vapor chambers coupled to or embedded in the heat spreader and configured to collect heat from at least one of the one or more processors and transfer the heat away from the one or more processors.

9. The automated driving system computer of claim 1 , wherein the board, the one or more processors, the first and second layers, the heat spreader, and the cold plate are all contained in a chassis.

10. A method comprising:
coupling one or more processors to a board;
applying a first layer of a first thermal interface material on the one or more processors;
disposing a first side of a heat spreader on the first layer of the first thermal interface material, wherein the heat spreader has a shoulder extending therefrom, and a heat transfer component embedded in the heat spreader, the heat transfer component configured to collect heat from the first side of the heat spreader in contact with the one or more processors, and transfer the heat to a second side of the heat spreader;
disposing a spring around a fastener;
disposing a bushing between the fastener and the spring, wherein the bushing insulates the heat spreader to prevent heat from transferring to the fastener and the board, and wherein the bushing dampens energy transfer between the heat spreader, the fastener, and the board;
securing the heat spreader to the board by disposing the fastener through the shoulder of the heat spreader, wherein the fastener secures the heat spreader to the board, and wherein the spring presses against the shoulder of the heat spreader and thereby compresses the heat spreader against the one or more processors;
applying a second layer of a second thermal interface material on the second side of the heat spreader; and
disposing a cold plate on the second layer of the second thermal interface material.

11. The method of claim 10 , wherein the heat spreader is not in direct contact with the board.

12. The method of claim 11 , wherein the spring controls an amount of force of the heat spreader applies to the one or more processors.

13. The method of claim 10 , wherein the heat spreader is made of a conductive material.

14. The method of claim 13 , wherein the conductive material is copper.

15. The method of claim 10 , wherein the cold plate comprises one or more fluid channels.

16. The method of claim 10 , wherein the heat spreader further comprises one or more heat pipes coupled to or embedded in the heat spreader and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors.

17. The method of claim 10 , wherein the heat spreader further comprises one or more vapor chambers coupled to or embedded in the heat spreader and configured to collect heat from at least one of the one or more processors and transfer the heat away from the one or more processors.

18. The method of claim 10 , wherein the board, the one or more processors, the first and second layers, the heat spreader, and the cold plate are all contained in a chassis.

Assignees

• Gm Cruise Holdings Llc

Inventors

• Cao Robert
• Stefanoski Zoran
• Schlotterbeck Brian
• Tang Wen-Chieh
• Lo Roger

Classifications

• G05D1/227

  Handing over between remote control and on-board control; Handing over between remote control arrangements · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• G05D1/0088

  characterized by the autonomous decision making process, e.g. artificial intelligence, predefined behaviours (using knowledge based models G06N5/00) · CPC title

• H05K7/20245

  by natural convection; Thermosiphons · CPC title