Packaging structure of flexible sensing strip for monitoring large deformation at deep position of sliding mass and monitoring method

US12007230B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12007230-B2
Application numberUS-202117401332-A
CountryUS
Kind codeB2
Filing dateAug 13, 2021
Priority dateJun 24, 2021
Publication dateJun 11, 2024
Grant dateJun 11, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A measurement unit module includes a printed circuit board (PCB) and electronic components being mounted on a front face of the PCB, a plurality of measurement unit modules are arranged at intervals in an extending direction of a stripped flat cable, the stripped flat cable is electrically connected to back faces of the plurality of PCBs in sequence to form a measurement unit cluster, the measurement unit cluster is packaged and molded by an extrusion technology of silica gel to form the flexible sensing strip, and the flexible sensing strip can be wound into a sensing strip reel. The packaging structure has the beneficial effects that connection integrity between the measurement unit modules is enhanced, connection strength is improved, and reliability of a flexible clinometer is improved. The flexible sensing strip can be wound into the sensing strip reel so as to be convenient to carry and convey.

First claim

Opening claim text (preview).

What is claimed is: 1. A packaging structure of a flexible sensing strip for monitoring large deformation at a deep position of a sliding mass, comprising a plurality of measurement unit modules and a stripped flat cable, wherein each of the plurality of measurement unit modules comprises a printed circuit board (PCB) and electronic components, the electronic components being mounted on a front face of the PCB, the plurality of measurement unit modules are arranged at intervals in an extending direction of the stripped flat cable, the stripped flat cable is electrically connected to back faces of the plurality of PCBs in sequence to form a measurement unit cluster, the measurement unit cluster is packaged and molded by an extrusion technology of silica gel to form the flexible sensing strip, and the flexible sensing strip is capable of being wound into a sensing strip reel; each of the plurality of measurement unit modules further comprises a plurality of pairs of interface bonding pads, each pair of interface bonding pads being symmetrically mounted on a front face and a back face of the PCB, through holes penetrating positions, corresponding to each pair of interface bonding pads, of the PCB, each pair of interface bonding pads having consistent electric properties, and the stripped flat cable being electrically connected to the interface bonding pads. 2. The packaging structure according to claim 1 , wherein the stripped flat cable comprises a cable core and a packaging sheath wrapped around the cable core, the packaging sheath at a position, corresponding to the interface bonding pad, of the stripped flat cable is scraped to expose the cable core, and the exposed cable core is electrically connected to the interface bonding pad. 3. The packaging structure according to claim 2 , wherein the cable core of the stripped flat cable is tinned. 4. The packaging structure according to claim 3 , wherein the exposed cable core and the interface bonding pad are welded by hot melting tin soldering. 5. The packaging structure according to claim 2 , further comprising a U-shaped conductive buckle, wherein the U-shaped conductive buckle is provided with a U-shaped connection portion and two clamping portions, the two clamping portions being bent outwards separately to form bent portions, and the bent portions penetrating the through holes to be buckled to the interface bonding pad on the front face of the PCB, and the exposed cable core is located on an inner side of the U-shaped connection portion. 6. The packaging structure according to claim 1 , further comprising a steel wire rope, wherein the steel wire rope and the stripped flat cable extend in an identical direction, and the steel wire rope is located on the back face of the PCB and packaged in the measurement unit cluster by the extrusion technology of silica gel. 7. The packaging structure according to claim 6 , wherein two steel wire ropes are located on two sides of the stripped flat cable separately. 8. The packaging structure according to claim 1 , wherein the electronic components comprise a micro electro mechanical system, a nine-axis sensor, a microprocessor, a controller area network (CAN) bus driver and a power management chip. 9. A monitoring method, based on the packaging structure of a flexible sensing strip for monitoring large deformation at a deep position of a sliding mass according to claim 1 , and comprising: S 1 , winding the flexible sensing strip into a sensing strip reel, and carrying same to a monitoring site; S 2 , unwinding the sensing strip reel, attaching the flexible sensing strip to a clamping steel strip to be embedded into a clamping groove of a clinometer pipe in a monitoring hole, and fixedly burying the flexible sensing strip in a sliding mass to undergo coupling deformation along with the sliding mass; and S 3 , supplying power to the flexible sensing strip by electrically connecting a solar power supply to the flexible sensing strip, and reading data, measured by the flexible sensing strip, of—the plurality of measurement unit modules by electrically connecting a controller to the flexible sensing strip, so as to automatically monitor deformation at a deep position of the sliding mass in real time.

Assignees

Inventors

Classifications

  • specially adapted for power drive units or power converters · CPC title

  • of the bending or flexing mode type · CPC title

  • Multiple connections subassemblies · CPC title

  • G01B7/20Primary

    formed by printed-circuit technique · CPC title

  • G01B5/30Primary

    for measuring the deformation in a solid, e.g. mechanical strain gauge · CPC title

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What does patent US12007230B2 cover?
A measurement unit module includes a printed circuit board (PCB) and electronic components being mounted on a front face of the PCB, a plurality of measurement unit modules are arranged at intervals in an extending direction of a stripped flat cable, the stripped flat cable is electrically connected to back faces of the plurality of PCBs in sequence to form a measurement unit cluster, the measu…
Who is the assignee on this patent?
Univ China Geosciences Wuhan
What technology area does this patent fall under?
Primary CPC classification G01B7/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 11 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).