Moisture-curing composition with good adhesive properties

Patent metadata

Field	Value
Publication number	US-12006450-B2
Application number	US-202017419130-A
Country	US
Kind code	B2
Filing date	Apr 2, 2020
Priority date	Apr 5, 2019
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

A moisture-curing composition that is liquid at ambient temperature and optionally highly viscous, containing: at least one polyether urethane polymer (P1) containing isocyanate groups and having a content of at least 80% by wt. 1,2-propyleneoxy units in the polyether segment, and at least one hydrophobic polymer (P2) containing isocyanate groups and being liquid at ambient temperature, obtained by reacting at least one monomeric diisocyanate and a hydrophobic diol having an OH-number ranging between 28 and 120 mg KOH/g, the polymers P1 and P2 being produced separately and said polymers P1 and P2 having a weight ratio ranging between 70/30 and 98/2.

First claim

The invention claimed is:

1. A moisture-curing composition which is liquid or pasty at room temperature, comprising
at least one polyether urethane polymer P1 containing isocyanate groups and having a content of at least 80% by weight of 1,2-propyleneoxy units in the polyether segment, and
at least one room temperature liquid, hydrophobic polymer P2 containing isocyanate groups, obtained from the reaction of at least one monomeric diisocyanate and a hydrophobic diol having an OH number in the range from 28 to 120 mg KOH/g,
wherein polymers P1 and P2 are prepared separately from one another and polymer P1 and polymer P2 are present in a weight ratio in the range from 70/30 to 98/2, and
wherein the hydrophobic diol for the preparation of polymer P2 is selected from the group consisting of dimer fatty acid-based polyester diols and poly(1,2-butylene glycol).

2. The moisture-curing composition as claimed in claim 1 , wherein polymer P1 has an NCO content in the range from 1% to 5% by weight.

3. The moisture-curing composition as claimed claim 1 , wherein the isocyanate groups of polymer P1 are derived from diphenylmethane 4,4′-diisocyanate.

4. The moisture-curing composition as claimed in claim 1 , wherein polymer P1 is obtained from the reaction of at least one monomeric diisocyanate and at least one polyoxypropylene diol or triol having an OH number in the range from 7.5 to 112 mg KOH/g and which is optionally ethylene oxide-terminated.

5. The moisture-curing composition as claimed claim 1 , wherein polymer P1 has a monomeric diisocyanate content of not more than 0.5% by weight.

6. The moisture-curing composition as claimed in claim 1 , wherein polymer P2 has an NCO content in the range from 1.5% to 6% by weight.

7. The moisture-curing composition as claimed in claim 1 , wherein the hydrophobic diol is an amorphous dimer fatty acid-based polyester diol.

8. The moisture-curing composition as claimed in claim 1 , wherein polymer P2 has a monomeric diisocyanate content of not more than 0.5% by weight and is obtained from the reaction of at least one monomeric diisocyanate and the hydrophobic diol in an NCO/OH ratio of at least 3/1, followed by removal of a majority of the monomeric diisocyanate by means of a suitable separation method.

9. The moisture-curing composition as claimed in claim 1 , wherein polymer P2 has a viscosity at 20° C. in the range from 10 to 1000 Pa·s, determined with a cone-plate viscometer having a cone diameter 25 mm, cone angle 1, cone tip-plate distance 0.5 mm, at a shear rate of 50 s −1 .

10. The moisture-curing composition as claimed in claim 1 , wherein at least one further constituent selected from meltable components, blocked amines, fillers, plasticizers, diisocyanate oligomers, catalysts and stabilizers is additionally present.

11. The moisture-curing composition as claimed in claim 10 , wherein it comprises
20% to 60% by weight of polymers P1,
0.5% to 10% by weight of polymer P2,
0% to 5% by weight of meltable component,
20% to 60% by weight of fillers,
0% to 35% by weight of plasticizers,
and optionally blocked amines, diisocyanate oligomers, catalysts or stabilizers.

12. The moisture-curing composition as claimed in claim 1 , wherein it comprises carbon black.

13. The moisture-curing composition as claimed in claim 1 , wherein it comprises less than 0.1% by weight of monomeric diisocyanates.

14. A method of bonding or sealing, comprising the steps of
(i) applying the moisture-curing composition as claimed in claim 1
to a first substrate and contacting the composition with a second substrate within the open time of the composition, or
to a first and to a second substrate and joining the two substrates within the open time of the composition, or
between two substrates,

(ii) curing the composition by contact with moisture.

15. An article obtained from the method as claimed in claim 14 .

Assignees

• Sika Tech Ag

Inventors

• Reimann Sven
• Kube Nicole
• Schlumpf Michael

Classifications

• C09J2475/00

  Presence of polyurethane · CPC title

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

• C08K3/04

  Carbon · CPC title

• C08G18/7671

  containing only one alkylene bisphenyl group · CPC title

• C08G18/4854

  Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group · CPC title