Adhesive composition for semiconductor circuit connection and adhesive film containing the same

Patent metadata

Field	Value
Publication number	US-12006308-B2
Application number	US-201917047551-A
Country	US
Kind code	B2
Filing date	Oct 22, 2019
Priority date	Oct 23, 2018
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.

First claim

The invention claimed is:

1. A compound represented by Chemical Formula 1:

wherein, in the Chemical Formula 1,
R and R′ are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms or a cyclic hydrocarbon having 3 to 8 carbon atoms, wherein the alkyl group, the aryl group or the cyclic hydrocarbon optionally contains a heteroatom,
each x is independently 1 to 50,
each y is independently 1 to 100 and
each z is independently 1 to 4.

2. The compound of claim 1 , wherein R is hydrogen, x is 1 to 6, y is 8 to 10, and z is 1 to 4.

3. The compound of claim 1 , wherein R is hydrogen, x is 1, y is 10, and z is 2.

4. The compound of claim 1 , wherein R is hydrogen, x is 6, y is 8, and z is 2.

5. A method for preparing the compound of Chemical Formula 1 of claim 1 , comprising reacting a compound of Chemical Formula 2 with a compound of Chemical Formula 3:

wherein, in the Chemical Formula 3,
R and R′ are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms or a cyclic hydrocarbon having 3 to 8 carbon atoms, wherein the alkyl group, the aryl group or the cyclic hydrocarbon optionally contains a heteroatom, and
each z is independently 1 to 4.

6. The method of claim 5 , wherein in the Chemical Formula 3, R is hydrogen, R′ is a methyl group, and z is 1 to 4.

7. The method of claim 5 , comprising reacting 0.1 to 10 equivalent weights of the compound of Chemical Formula 3 with respect to 1 equivalent weight of the compound of Chemical Formula 2.

8. The compound of claim 1 , wherein the heteroatom is a halogen, O, N, S or P.

9. The method of claim 5 , wherein the heteroatom is a halogen, O, N, S or P.

Assignees

• Lg Chemical Ltd

Inventors

• Kim Youngsam
• Kim Junghak
• Kim Ju Hyeon
• Lee Kwang Joo

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C09J11/06

  organic · CPC title

• C09J7/30

  characterised by the adhesive composition · CPC title