Display panel including anti-crack structure within chamfered recess, manufacturing method thereof and display device

Patent metadata

Field	Value
Publication number	US-12004407-B2
Application number	US-202117297361-A
Country	US
Kind code	B2
Filing date	Apr 23, 2021
Priority date	Apr 16, 2021
Publication date	Jun 4, 2024
Grant date	Jun 4, 2024

Abstract

A display panel, a manufacturing method thereof, and a display device are disclosed. For the display panel, an anti-crack structure is disposed in a chamfer between a driving circuit layer and a substrate. The anti-crack structure is in contact with a packaging layer to reduce an angle from the contact plane of the anti-crack structure and the packaging layer to the plane in which a light-emitting layer is located, so that the packaging layer is smoothly disposed, the risk of the fracture of the packaging layer is lowered, and the failure of the display panel is avoided.

First claim

What is claimed is:

1. A display panel comprising a display area and an electronic component disposition area, wherein the display panel comprises:
a substrate comprising a recess located in the display area and the electronic component disposition area, wherein the recess comprises a chamfer located in the display area;
a driving circuit layer disposed on one side of the substrate, wherein the driving circuit layer is disposed in the display area;
a light-emitting layer disposed on one side of the driving circuit layer away from the substrate;
a packaging layer disposed on one side of the light-emitting layer away from the driving circuit layer;
wherein the chamfer is defined between the driving circuit layer and the substrate, the chamfer is provided with an anti-crack structure, the anti-crack structure is in contact with the packaging layer, and the anti-crack structure is configured for reducing an angle from a contact plane of the anti-crack structure and the packaging layer to a plane in which the light-emitting layer is located, wherein the contact angle is less than 90 degrees, and wherein the packaging layer contacts the side surfaces of the driving circuit layer and the light emitting layer.

2. The display panel according to claim 1 , wherein the packaging layer extends from the light-emitting layer to the recess, and the packaging layer is disposed near the chamfer.

3. The display panel according to claim 1 , wherein the packaging layer extends from the light-emitting layer to the recess, and the angle from the contact plane of the packaging layer and the anti-crack structure to the plane in which the light-emitting layer is located is less than or equal to 90 degrees.

4. The display panel according to claim 3 , wherein the anti-crack structure is disposed in the display area, the angle from the contact plane of the packaging layer and the anti-crack structure to the plane in which the light-emitting layer is located is a right angle, and the contact plane of the packaging layer and the anti-crack structure is disposed at an interface between the display area and the electronic component disposition area.

5. The display panel according to claim 3 , wherein the anti-crack structure extends from the display area to the electronic component disposition area, and the angle from the contact plane of the packaging layer and the anti-crack structure to the plane in which the light-emitting layer is located is an acute angle.

6. The display panel according to claim 5 , wherein a thickness of the anti-crack structure is less than or equal to a distance between a bottom of the recess and a bottom of the driving circuit layer.

7. The display panel according to claim 5 , wherein a material of the anti-crack structure comprises an organic material, an inorganic material, and an organic material laminated layer which are doped with a liquid absorbent.

8. A display panel manufacturing method, comprising:
providing a substrate;
forming a driving circuit layer on the substrate, and etching the substrate to form a recess, wherein the recess is disposed in a display area and an electronic component disposition area, the recess comprises a chamfer located in the display area, and the driving circuit layer is disposed in the display area;
forming a light-emitting layer on the driving circuit layer, wherein the light-emitting layer comprises a first light-emitting layer located on the driving circuit layer and a second light-emitting layer located in the electronic component disposition area;
forming an anti-crack structure in the chamfer;
forming a packaging layer on the light-emitting layer, wherein the anti-crack structure is configured for reducing an angle from a contact plane of the anti-crack structure and the packaging layer to a plane in which the light-emitting layer is located, wherein the contact angle is less than 90 degrees, and wherein the packaging layer contacts the side surfaces of the driving circuit layer and the light emitting layer.

9. A display device, comprising:
a display panel comprising a display area and an electronic component disposition area, wherein the display panel comprises a substrate, a driving circuit layer, a light-emitting layer, and a packaging layer, wherein the substrate comprises a recess located in the display area and the electronic component disposition area, and the recess comprises a chamfer located in the display area; the driving circuit layer is disposed on one side of the substrate, and the driving circuit layer is disposed in the display area; the light-emitting layer is disposed on one side of the driving circuit layer away from the substrate, and the packaging layer is disposed on one side of the light-emitting layer away from the driving circuit layer; wherein the chamfer is defined between the driving circuit layer and the substrate, the chamfer is provided with an anti-crack structure, the anti-crack structure is in contact with the packaging layer, and the anti-crack structure is configured for reducing an angle from a contact plane of the anti-crack structure and the packaging layer to a plane in which the light-emitting layer is located;
an electronic component disposed in the electronic component disposition area.

10. The display device according to claim 9 , wherein the electronic component comprises an under-display camera.

11. The display device according to claim 9 , wherein the packaging layer extends from the light-emitting layer to the recess, and the packaging layer is disposed in the chamfer.

12. The display device according to claim 9 , wherein the packaging layer extends from the light-emitting layer to the recess, and the angle from the contact plane of the packaging layer and the anti-crack structure to the plane in which the light-emitting layer is located is less than or equal to 90 degrees.

13. The display device according to claim 12 , wherein the anti-crack structure is disposed in the display area, the angle from the contact plane of the packaging layer and the anti-crack structure to the plane in which the light-emitting layer is located is a right angle, and the contact plane of the packaging layer and the anti-crack structure is disposed at an interface between the display area and the electronic component disposition area.

14. The display device according to claim 12 , wherein the anti-crack structure extends from the display area to the electronic component disposition area, and the angle from the contact plane of the packaging layer and the anti-crack structure to the plane in which the light-emitting layer is located is an acute angle, wherein the contact angle is less than 90 degrees, and wherein the packaging layer contacts the side surfaces of the driving circuit layer and the light emitting layer.

15. The display device according to claim 14 , wherein the light-emitting layer comprises a first portion disposed in the display area and a second portion disposed in the electronic component disposition area, and the anti-crack structure contacts a side surface of the second portion of the light-emitting layer in the electronic component disposition area.

16. The display device according to claim 14 , wherein a thickness of the anti-crack structure is less than or equal to a distance between a bottom of the recess and a bottom of the driving circuit layer.

17. The display device according to claim 14 , wherein a material of the anti-crack structure comprises an organic material, an inorganic material, and an organic material laminated layer which are doped with a liquid absorbent.

18.

Assignees

• Wuhan China Star Optoelectronics Technology Co Ltd
• Wuhan China Star Optoelectronics Semiconductor Display Tech Co Ltd

Inventors

• Wang Junyuan

Classifications

• H10K59/65 Primary

  OLEDs integrated with inorganic image sensors · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/123 Primary

  Connection of the pixel electrodes to the thin film transistors [TFT] · CPC title

• H10K59/121 Primary

  characterised by the geometry or disposition of pixel elements · CPC title