Synthetic modular housing with embedded cooling body

US12004330B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12004330-B2
Application numberUS-202217817827-A
CountryUS
Kind codeB2
Filing dateAug 5, 2022
Priority dateAug 6, 2021
Publication dateJun 4, 2024
Grant dateJun 4, 2024

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a module housing made of plastic, in particular a thermosetting polymer, with an embedded cooling element and at least one screw sleeve, which has a collar with an exposed mounting surface with which the module housing can be mounted on a support functioning as an external heat sink. The cooling element and the at least one screw sleeve form a monolithic element with which heat can be conducted from the cooling element to the support via at least the mounting surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A module housing, comprising: a cooling element and at least one screw sleeve, wherein the at least one screw sleeve has a collar with a mounting surface with which the module housing can be mounted on a support and function as an external heat sink, wherein the cooling element and the at least one screw sleeve form a monolithic element, wherein the at least one screw sleeve is configured such that heat is conducted from the cooling element to the support via at least the mounting surface, and wherein the mounting surface is raised in relation to an outer surface of the cooling element, forming a space between the cooling element and the support, such that when the module housing is mounted on the support, only the mounting surface bears on the support. 2. The module housing according to claim 1 , wherein the at least one screw sleeve includes only one screw sleeve. 3. The module housing according to claim 1 , wherein the at least one screw sleeve is completely connected to the cooling element over a height of the cooling element along a cylindrical axis of the at least one screw sleeve, and wherein a cross section of a monolithic connection between the cooling element and the at least one screw sleeve is configured for thermal discharge along the height of the cooling element. 4. The module housing according to claim 1 , wherein the at least one screw sleeve is connected over its width with the cooling element, which corresponds to at least an outer diameter of the at least one screw sleeve, and a cross section of a monolithic connection between the cooling element and the at least one screw sleeve is configured for thermal discharge along a width of the cooling element. 5. The module housing according to claim 1 , wherein the mounting surface is circular. 6. The module housing according to claim 5 , wherein the mounting surface has an outer diameter that is at least twice the size of an inner diameter of the mounting surface. 7. The module housing according to claim 1 , wherein the module housing is made of plastic. 8. An electrical assembly comprising a module housing according to claim 1 . 9. A motor vehicle that has a control comprising an electrical assembly that has a module housing according to claim 1 . 10. The module housing according to claim 7 , wherein the plastic is a thermosetting polymer.

Assignees

Inventors

Classifications

  • Bolts or screws · CPC title

  • Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title

  • Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12004330B2 cover?
The invention relates to a module housing made of plastic, in particular a thermosetting polymer, with an embedded cooling element and at least one screw sleeve, which has a collar with an exposed mounting surface with which the module housing can be mounted on a support functioning as an external heat sink. The cooling element and the at least one screw sleeve form a monolithic element with wh…
Who is the assignee on this patent?
Zahnradfabrik Friedrichshafen
What technology area does this patent fall under?
Primary CPC classification H05K7/20854. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 04 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).