Composite substrate, piezoelectric device, and method for manufacturing composite substrate

US12003227B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12003227-B2
Application numberUS-201917263872-A
CountryUS
Kind codeB2
Filing dateJul 29, 2019
Priority dateAug 1, 2018
Publication dateJun 4, 2024
Grant dateJun 4, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A composite substrate of the present disclosure is a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded, wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in the bonding surface region including the bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. The piezoelectric device of the present disclosure comprises the composite substrate. A method for manufacturing the composite substrate of the present disclosure comprises a step of preparing a piezoelectric substrate and a sapphire substrate, a step of heat-treating the sapphire substrate in a reducing atmosphere or in a vacuum, and a step of directly bonding the piezoelectric substrate to the sapphire substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded to each other, wherein a ratio of a number of oxygen atoms to a number of aluminum atoms in a bonding surface region including a bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. 2. A composite substrate according to claim 1 , wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in the bonding surface region of the sapphire substrate is less than a ratio of a number of oxygen atoms to a number of aluminum atoms in a bulk region of the sapphire substrate. 3. A composite substrate according to claim 1 , wherein a hydrogen concentration in the bonding surface region of the sapphire substrate is 1×10 16 atoms/cm 3 or less. 4. A composite substrate according to claim 1 , wherein the piezoelectric substrate comprises a piezoelectric material selected from lithium tantalate, lithium niobate, zinc oxide, and quartz crystal. 5. A piezoelectric device comprising the composite substrate according to claim 1 . 6. A piezoelectric device according to claim 5 , which is a surface acoustic wave device. 7. A method for manufacturing a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded to each other, comprising: preparing a piezoelectric substrate and a sapphire substrate, heat-treating the sapphire substrate in a reducing atmosphere or in a vacuum, and directly bonding the piezoelectric substrate and the sapphire substrate to each other, wherein a ratio of the number of oxygen atoms to the number of aluminum atoms in a bonding surface region including a bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. 8. A method for manufacturing a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded to each other, comprising: preparing a piezoelectric substrate, growing or heat-treating a sapphire crystal in a reducing atmosphere, preparing a sapphire substrate by cutting the sapphire crystal, and directly bonding the piezoelectric substrate and the sapphire substrate to each other, wherein a ratio of the number of oxygen atoms to the number of aluminum atoms in a bonding surface region including a bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5.

Assignees

Inventors

Classifications

  • of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title

  • for the manufacture of resonators or networks using surface acoustic waves · CPC title

  • of lithium niobate or lithium-tantalate substrates · CPC title

  • by laminating or bonding of piezoelectric or electrostrictive bodies · CPC title

  • Electricity · mapped topic

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What does patent US12003227B2 cover?
A composite substrate of the present disclosure is a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded, wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in the bonding surface region including the bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. The piezoelec…
Who is the assignee on this patent?
Kyocera Corp
What technology area does this patent fall under?
Primary CPC classification H03H9/02574. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 04 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).