Roll-bonded laminate and method for producing the same

US11999131B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11999131-B2
Application numberUS-201916977672-A
CountryUS
Kind codeB2
Filing dateMar 12, 2019
Priority dateMar 14, 2018
Publication dateJun 4, 2024
Grant dateJun 4, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 μm or more and 20 μm or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. A roll-bonded laminate formed by lamination of at least three layers, wherein: the roll-bonded laminate comprises a peelable carrier layer, an ultrathin metal layer, and a metallic foil, in this order; the peelable carrier layer comprises a carrier layer body and a peel layer, and the peelable carrier layer is laminated with the ultrathin metal layer via the peel layer; the thickness of the ultrathin metal layer is 0.5 μm or more and 20 μm or less; and a peel strength between the carrier layer and the ultrathin metal layer is in the range of 0.1 N/20 mm or more and less than 1 N/20 mm. 2. The roll-bonded laminate according to claim 1 , which has one or more intermediate layers comprising metal between the ultrathin metal layer and the metallic foil. 3. The roll-bonded laminate according to claim 1 , wherein the peel strength between the ultrathin metal layer and the metallic foil is greater than the carrier peel strength between the carrier layer and the ultrathin metal layer. 4. The roll-bonded laminate according to claim 1 , wherein the ultrathin metal layer is a layer of metal selected from the group consisting of copper, iron, nickel, zinc, tin, chromium, gold, silver, platinum, cobalt, titanium, and an alloy comprising any of these metals as a base. 5. The roll-bonded laminate according to claim 1 , wherein the metallic foil is a foil of metal selected from the group consisting of aluminum, iron, copper, nickel, magnesium, silver, gold, platinum, and an alloy comprising any of these metals as a base. 6. A method for producing a roll-bonded laminate, in which the roll-bonded laminate is formed by lamination of at least two layers and comprises an ultrathin metal layer and a metallic foil, and the thickness of the ultrathin metal layer is 0.5 μm or more and 20 μm or less, wherein the method comprises a step of peeling a carrier layer from the roll-bonded laminate according to claim 1 . 7. A roll-bonded laminate consisting of: an ultrathin metal layer as a single layer made by a wet film formation method or a dry film formation method; and a metallic foil as a single layer, wherein: the ultrathin metal layer and the metallic foil are laminated on each other by roll bonding; the ultrathin metal layer is a copper layer having a thickness of 0.5 μm or more and 20 μm or less; the metallic foil is a foil of metal selected from the group consisting of aluminum, iron, copper, nickel, magnesium, silver, gold, platinum, and an alloy comprising any of these metals as a base; and the standard deviation σ of the thickness of the ultrathin metal layer is less than 1 μm. 8. The roll-bonded laminate of claim 7 , wherein the ultrathin metal layer is a copper layer having a thickness of 1 μm or more and 7 μm or less.

Assignees

Inventors

Classifications

  • B32B15/01Primary

    all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title

  • B21B1/22Primary

    for rolling {plates, strips,} bands or sheets of indefinite length (B21B1/42 takes precedence) · CPC title

  • Joining superposed plates by locally deforming without slitting or piercing · CPC title

  • by means of a rolling mill · CPC title

  • one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11999131B2 cover?
The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal…
Who is the assignee on this patent?
Toyo Kohan Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B15/01. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 04 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).