Laser cutting system

Patent metadata

Field	Value
Publication number	US-11999014-B2
Application number	US-202017086946-A
Country	US
Kind code	B2
Filing date	Nov 2, 2020
Priority date	Nov 22, 2019
Publication date	Jun 4, 2024
Grant date	Jun 4, 2024

Abstract

A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.

First claim

What is claimed is:

1. A method comprising:
removing a portion of a workpiece including removing a first portion of a conductor from the workpiece with a first laser beam to form an exposed surface of the workpiece, wherein a second portion of the conductor is positioned along the exposed surface of the workpiece;
detecting plasma illumination caused by removal of the first portion of the conductor from the workpiece;
determining a position of the second portion of the conductor along the exposed surface of the workpiece based on the detected plasma illumination;
determining an angle relative to a normal to a major surface of the workpiece to emit a second laser beam based on the determined position of the second portion of the conductor; and
removing a portion of the exposed surface of the workpiece with the second laser beam, the second laser beam emitted or reflected at the angle relative to the normal to the major surface.

2. The method of claim 1 , wherein removing the portion of the exposed surface comprises cleaning the exposed surface.

3. The method of claim 2 , wherein cleaning the exposed surface comprises removing conductive particles from the exposed surface.

4. The method of claim 1 , wherein the second laser beam comprises a lower intensity than the first laser beam.

5. The method of claim 1 , wherein the first laser beam is emitted by a first emitter and the second laser beam is emitted by a second emitter.

6. The method of claim 1 , wherein the first laser beam is emitted by an emitter and the second laser beam is emitted by the emitter and the second laser beam is directed to the exposed surface by a mirror.

7. The method of claim 6 , wherein an angle of the mirror is controllable to change an angle of the second laser beam relative to the normal to the major surface of the workpiece.

8. The method of claim 1 , wherein the first laser beam is emitted at a first angle relative to the normal to the major surface of the workpiece and the second laser beam is emitted at a second angle relative to the normal to the major surface of the workpiece.

9. The method of claim 8 , wherein the first angle is no greater than 10 degrees.

10. The method of claim 1 , wherein removing the portion of the workpiece comprises disposing a recess in the workpiece.

11. The method of claim 1 , wherein removing the portion of the exposed surface of the workpiece comprises shaping the exposed surface.

12. The method of claim 1 , wherein removing the portion of the exposed surface of the workpiece comprises etching a recess at the conductor disposed on the exposed surface of the workpiece.

13. The method of claim 1 , wherein removing the portion of the workpiece comprises cutting the workpiece into one or more singulated electronic packages.

14. A system comprising:
an emitting device adapted to emit a first laser beam and a second laser beam;
a controller comprising one or more processors and operably coupled to the emitting device to control emission of the first and second laser beams, the controller adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device; and
an optical sensor adapted to detect plasma illumination, wherein the controller is further adapted to:
determine a position of a portion of a conductor positioned along the exposed surface of the workpiece based on plasma illumination emitted when the first laser beam contacts the conductor; and
determine an angle relative to a normal to a major surface of the workpiece to emit the second laser beam based on the determined position of the portion of the conductor.

15. The system of claim 14 , wherein the controller is further adapted to control the emitting device to emit the second laser beam at a lower intensity than the first laser beam.

16. The system of claim 14 , wherein the emitting device comprises:
a first emitter adapted to emit the first laser beam; and
a second emitter adapted to emit the second laser beam.

17. The system of claim 14 , further comprising a mirror, wherein the controller is further adapted to control the emitting device to direct at least one of the first and second laser beams to the mirror, wherein the mirror is adapted to direct the at least one of the first and second laser beams to the workpiece.

18. The system of claim 17 , wherein the controller is operably coupled to the mirror to control an angle of the mirror.

19. The system of claim 14 , wherein the controller is further adapted to control the emitting device to emit the first laser beam at a first angle relative to the normal to the major surface of the workpiece and the second laser beam at a second angle relative to the normal to the major surface of the workpiece.

20. The system of claim 19 , wherein the first angle is no greater than 10 degrees.

21. The system of claim 14 , further comprising a beam splitter, wherein the controller is further adapted to control the emitting device to emit the first and second laser beams simultaneously using the beam splitter.

Assignees

• Medtronic Inc

Inventors

• He Xiangnan
• Ruben David A
• Henschel Mark E
• Kim Chunho
• Wang Yongqian
• Toles Rodney D

Classifications

• B23K26/38 Primary

  by boring or cutting · CPC title

• B23K26/0643

  comprising mirrors · CPC title

• B23K26/082

  Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title

• B23K26/362

  Laser etching · CPC title

• B23K26/705

  Beam measuring devices · CPC title