Vacuum injection molding for optoelectronic modules

Patent metadata

Field	Value
Publication number	US-11996505-B2
Application number	US-201917294749-A
Country	US
Kind code	B2
Filing date	Nov 27, 2019
Priority date	Dec 10, 2018
Publication date	May 28, 2024
Grant date	May 28, 2024

Abstract

Manufacturing optoelectronic modules includes supporting a printed circuit board substrate ( 27 ) on a first vacuum injection tool ( 24 ). The printed circuit board substrate ( 27 ) has at least one optoelectronic component mounted thereon and has a solder mask ( 40 ) on a surface ( 46 ) facing away from the first vacuum injection tool ( 24 ). The method includes causing the first vacuum injection tool ( 24 ) and a second vacuum injection tool ( 22 ) to be brought closer to one another such that a surface ( 46 ) of the second vacuum injection tool ( 22 ) is in contact with the solder mask ( 40 ). Subsequently, a first epoxy ( 100, 20 ) is provided, using a vacuum injection technique, in spaces ( 104 ) between the upper tool ( 22 ) and the solder mask ( 40 ).

First claim

What is claimed is:

1. A method comprising:
supporting a printed circuit board substrate on a first vacuum injection tool, the printed circuit board substrate having at least one optoelectronic component mounted thereon and having a solder mask on a surface facing away from the first vacuum injection tool;
causing the first vacuum injection tool and a second vacuum injection tool to be brought closer to one another such that a surface of the second vacuum injection tool is in contact with the solder mask; and
subsequently providing a first epoxy, using a vacuum injection technique, in spaces between the second vacuum injection tool and the solder mask;
wherein the printed circuit board substrate covers an area of at least 0.4 times an area of the first vacuum injection tool on which the printed circuit board substrate is supported; and
wherein the printed circuit board substrate and the first vacuum injection tool have an x-dimension and a y-dimension and wherein each of the x-dimension and the y-dimension of the printed circuit board substrate is smaller than a corresponding x-dimension and y-dimension of the first vacuum injection tool.

2. The method of claim 1 including replicating features of the second vacuum injection tool into a second epoxy to form a respective optical element over each of the at least one optoelectronic components.

3. The method of claim 2 wherein the replicating occurs as a result of causing the first vacuum injection tool and a second vacuum injection tool to be brought toward one another such that a surface of the second vacuum injection tool is in contact with the solder mask.

4. The method of claim 2 wherein the second epoxy is transparent to a wavelength of light that the at least one optoelectronic component is operable to sense or emit.

5. The method of claim 2 wherein the first epoxy is non-transparent to the wavelength of light.

6. The method of claim 1 wherein causing the first and second vacuum injection tools to be brought toward one another includes causing a planar surface of the second vacuum injection tool that faces toward the first vacuum injection tool to be brought into contact with the solder mask.

7. The method of claim 1 wherein the printed circuit board substrate includes an inlet hole through which the first epoxy flows during the vacuum injection technique.

8. The method of claim 7 wherein the printed circuit board substrate includes an outlet hole through which some of the first epoxy flows during the vacuum injection technique.

9. The method of claim 8 wherein, during performance of the vacuum injection technique, the inlet and outlet holes are aligned, respectively, with corresponding inlet and outlet holes in the first vacuum tool.

10. The method of claim 9 wherein, during performance of the vacuum injection technique, the printed circuit board substrate is attached to the first vacuum injection tool by a double-sided tape.

11. The method of claim 10 wherein the double-sided tape has inlet and outlet holes, wherein, during performance of the vacuum injection technique, the inlet and outlet holes of the double-sided tape are aligned, respectively, with the inlet and outlet holes in the first vacuum tool and the inlet and outlet holes in the printed circuit board substrate.

12. The method of claim 1 wherein, as a result of providing the first epoxy in the spaces between the second vacuum injection tool and the solder mask, part of the first epoxy defines a baffle laterally surrounding a respective aperture for light to, or from, each of the at least one optoelectronic components to pass.

13. The method of claim 1 wherein the second vacuum injection tool has a surface that defines outwardly-facing chamfered side edges for the first epoxy.

14. The method of claim 1 wherein the first vacuum injection tool has a surface that is substantially square-shaped with chamfered comers.

15. The method of claim 1 wherein, during performance of the vacuum injection technique, the printed circuit board substrate is surrounded laterally by a spacer.

16. The method of claim 15 wherein the spacer has chamfered comers.

17. The method of claim 1 wherein each of an x-dimension and a y-dimension of the printed circuit board substrate is at least 10% smaller than corresponding x- and y-dimensions of the first vacuum injection tool.

18. The method of claim 1 wherein the printed circuit board substrate has a square shape having a side dimension A and the first vacuum injection tool has a square shape having a side dimension C, wherein the dimension A is two-thirds the size of dimension C.

19. The method of claim 1 wherein a carrier glass is provided to support the printed circuit board substrate.

Assignees

• Ams Sensors Singapore Pte Ltd

Inventors

• Wang Ji
• Leong Kam Wah
• Yu Qichuan
• Gubser Simon
• Teoh Yoong Kheng

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/854 Primary

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title

• H10H20/853

  characterised by their shape · CPC title