Semiconductor device

Patent metadata

Field	Value
Publication number	US-11996354-B2
Application number	US-202318298160-A
Country	US
Kind code	B2
Filing date	Apr 10, 2023
Priority date	May 13, 2019
Publication date	May 28, 2024
Grant date	May 28, 2024

Abstract

A semiconductor device provided with first and second semiconductor element each having an obverse and a reverse surface with a drain electrode, source electrode and gate electrode provided on the obverse surface. The semiconductor device is also provided with a control element electrically connected to the gate electrodes of the respective semiconductor elements, and with a plurality of leads, which include a first lead carrying the first semiconductor element, a second lead carrying the second semiconductor element, and a third lead carrying the control element. The first and second leads overlap with each other as viewed in a first direction perpendicular to the thickness direction of the semiconductor device, and the third lead overlaps with the first and second leads as viewed in a second direction perpendicular to the thickness direction and the first direction.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a first semiconductor element including a first obverse surface and a first reverse surface that are spaced apart in a thickness direction, the first obverse surface being provided with a first drain electrode, a first source electrode, and a first gate electrode;
a second semiconductor element including a second obverse surface and a second reverse surface that are spaced apart in the thickness direction, the second obverse surface being provided with a second drain electrode, a second source electrode, and a second gate electrode;
a control element electrically connected to the first gate electrode and the second gate electrode;
a plurality of leads spaced apart from each other;
a first connection member having a first end joined to the first source electrode; and
a second connection member having a first end joined to the second drain electrode,
wherein the plurality of leads include a first lead opposed to the first reverse surface and on which the first semiconductor element is mounted, a second lead opposed to the second reverse surface and on which the second semiconductor element is mounted, and a third lead on which the control element is mounted,
the first lead and the second lead overlap with each other as viewed in a first direction perpendicular to the thickness direction,
the third lead overlaps with the first lead and the second lead as viewed in a second direction perpendicular to the thickness direction and the first direction,
the first lead includes a first die pad portion to which the first semiconductor element is joined and a first bonding portion to which a second end of the first connection member is joined,
the first bonding portion is located between the first semiconductor element and the second semiconductor element as viewed in the thickness direction, and
a second end of the second connection member is joined to the first bonding portion.

2. The semiconductor device according to claim 1 , wherein the first obverse surface has a first edge portion and a second edge portion that is farther away from the second semiconductor element than is the first edge portion, the first gate electrode being disposed at a location adjacent to the second edge portion in the first direction, and
the second obverse surface has a first edge portion and a second edge portion that is farther away from the first semiconductor element than is the first edge portion of the second obverse surface, the second gate electrode being disposed at a location adjacent to the second edge portion of the second obverse surface in the first direction.

3. The semiconductor device according to claim 2 , wherein the first drain electrode and the first source electrode have a band shape elongated in the first direction and are disposed side by side in the second direction.

4. The semiconductor device according to claim 3 , wherein the second drain electrode and the second source electrode have a band shape elongated in the first direction and are disposed side by side in the second direction.

5. The semiconductor device according to claim 4 , further comprising a third connection member having a first end joined to the first drain electrode,
wherein the plurality of leads further include a fourth lead to which a second end of the third connection member is joined, and
the fourth lead overlaps with both the first lead and the second lead as viewed in the first direction and is disposed opposite to the second lead with respect to the first lead in the first direction.

6. The semiconductor device according to claim 5 , wherein the first die pad portion and the first bonding portion are formed in one piece.

7. The semiconductor device according to claim 6 , further comprising a fourth connection member having a first end joined to the second source electrode,
wherein the second lead includes a second die pad portion to which the second semiconductor element is joined and a second bonding portion to which a second end of the fourth connection member is joined, and
the second die pad portion is closer to the first die pad portion than is the second bonding portion as viewed in the thickness direction.

8. The semiconductor device according to claim 7 , wherein the second die pad portion and the second bonding portion are formed in one piece.

9. The semiconductor device according to claim 7 , further comprising a fifth connection member having a first end joined to the control element,
wherein a second end of the fifth connection member is joined to the first bonding portion.

10. The semiconductor device according to claim 9 , wherein the second end of the fifth connection member is joined at a location between the second end of the second connection member and the second end of the third connection member in the first direction.

11. The semiconductor device according to claim 7 , further comprising a sixth connection member having a first end joined to the control element,
wherein the first gate electrode includes two first pad portions spaced apart from each other in the second direction, and
the second end of the sixth connection member is joined to one of the two first pad portions.

12. The semiconductor device according to claim 11 , wherein the two first pad portions are at a same level of electrical potential in the first semiconductor element.

13. The semiconductor device according to claim 11 , further comprising a seventh connection member having a first end joined to the remaining one of the two first pad portions, wherein the plurality of leads further include a fifth lead to which the second end of the seventh connection member is joined.

14. The semiconductor device according to claim 13 , wherein the first obverse surface has a third edge portion and a fourth edge portion that is closer to the third lead than is the third edge portion in the second direction as viewed in the thickness direction, the one of the two first pad portions being disposed at a location adjacent to the fourth edge portion, and
the remaining one of the two first pad portions is disposed at a location adjacent to the third edge portion as viewed in the thickness direction.

15. The semiconductor device according to claim 14 , wherein the fifth lead is arranged adjacent to the fourth lead in the second direction.

16. The semiconductor device according to claim 13 , further comprising an eighth connection member having a first end joined to the control element,
wherein the second gate electrode includes two second pad portions spaced apart from each other in the second direction, and
a second end of the eighth connection member is joined to one of the two second pad portions.

17. The semiconductor device according to claim 16 , wherein the two second pad portions are at a same level of electrical potential in the second semiconductor element.

18. The semiconductor device according to claim 16 , further comprising a ninth connection member having a first end joined to the remaining one of the two second pad portions,
wherein the plurality of leads include a sixth lead to which a second end of the ninth connection member is joined.

19. The semiconductor device according to claim 18 , wherein the second obverse surface has a third edge portion and a fourth edge portion that is closer to the third lead than is the third edge portion of the second obverse surface in the second direction as viewed in the thickness direction, the one of the two second pad portions being disposed at a loca

Assignees

• Rohm Co Ltd

Inventors

• Saito Koshun
• Sakairi Hiroyuki
• Matsuoka Yasufumi
• Yoshimochi Kenichi

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W70/481 Primary

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W70/465

  Bumps or wires · CPC title

• H10W70/411

  Chip-supporting parts, e.g. die pads · CPC title

• H10W72/07653

  changes in shapes · CPC title