Arrangement for electronic components
US-2021175144-A1 · Jun 10, 2021 · US
US11996349B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11996349-B2 |
| Application number | US-202117180939-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 22, 2021 |
| Priority date | May 11, 2020 |
| Publication date | May 28, 2024 |
| Grant date | May 28, 2024 |
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An inverter ( 1 ) for operating an electrical machine ( 10 ) has at least one power semiconductor ( 2 ) and a drain contact ( 5 ) arranged on an underside of the power semiconductor ( 2 ). The drain contact ( 5 ) is arranged in a coolant channel ( 6 ) for impingement by a coolant. Also proposed are a drivetrain ( 20 ) and a motor vehicle ( 100 ).
Opening claim text (preview).
What is claimed is: 1. An inverter for operating an electrical machine ( 10 ), comprising: at least one power semiconductor having opposite first and second sides; a drain contact arranged on the first side of the power semiconductor; a gate contact arranged on the second side of the power semiconductor; a source contact arranged on the second side of the power semiconductor; a plastic sheath enclosing the power semiconductor and enclosing portions of the drain contact, the gate contact and the source contact; a coolant channel surrounding the plastic sheath and surrounding parts of the drain contact, the gate contact and the source contact that project beyond the plastic sheath; and a cooling device communicating with the coolant channel and configured for pumping a coolant through the cooling channel and impinging on opposite sides of the drain contact, the gate contact and the source contact. 2. The inverter of claim 1 , wherein the inverter comprises a dielectric as coolant. 3. The inverter of claim 1 , wherein the drain contact comprises a cooling structure projecting into the coolant channel. 4. The inverter of claim 3 , wherein the cooling structure includes a lamellar structure. 5. The inverter of claim 3 , wherein the cooling structure includes a pin-fin structure. 6. The inverter of claim 1 , wherein the drain contact comprises a conductor rail. 7. The inverter of claim 1 , wherein the conductor rail comprises copper or aluminum. 8. The inverter of claim 1 , wherein at least one of the gate contact and the source contact comprise a conductor rail that comprises copper or aluminum. 9. The inverter of claim 1 , wherein the power semiconductor is an SiC semiconductor. 10. A drivetrain for a motor vehicle, comprising an electrical machine and the inverter of claim 1 . 11. A motor vehicle comprising the drivetrain of claim 10 .
Bond wires · CPC title
by flowing gases, e.g. forced air cooling · CPC title
by flowing liquids, e.g. forced water cooling · CPC title
Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title
the projecting parts being wire-shaped or pin-shaped · CPC title
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