Electronic devices with coherent fiber bundles and molded polymer

US11994760B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-11994760-B1
Application numberUS-202117410454-A
CountryUS
Kind codeB1
Filing dateAug 24, 2021
Priority dateSep 18, 2020
Publication dateMay 28, 2024
Grant dateMay 28, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic device may have a display, a display cover layer, and an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may be placed between the display and the display cover layer. A gap may separate the coherent fiber bundle from the display cover layer. Adhesive in the gap may attach the coherent fiber bundle to the display cover layer. Molded polymer may be coupled to a bent edge of the display, a portion of the display with backside contacts, or components coupled to the backside contacts or other portions of the display. The molded polymer may support the coherent fiber bundle relative to the cover layer. The molded polymer may be molded to an inner surface of the cover layer and may be used to receive fasteners or otherwise facilitate mounting of housing structures and components in the device.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device, comprising: a pixel layer configured to produce an image on a first surface and having backside contacts on an opposing second surface; a coherent fiber bundle that receives the image at an input surface and provides the image at an output surface; a component coupled to the backside contacts; and molded polymer coupled to the coherent fiber bundle, an edge of the pixel layer, and the component. 2. The electronic device defined in claim 1 further comprising a display cover layer having a first portion that overlaps the output surface and a second portion that forms a housing sidewall. 3. The electronic device defined in claim 2 wherein the molded polymer has an opening configured to receive a fastener. 4. The electronic device defined in claim 3 further comprising an electrical component that is attached to the molded polymer with the fastener. 5. The electronic device defined in claim 3 further comprising a housing rear wall that is attached to the molded polymer with the fastener. 6. The electronic device defined in claim 2 wherein the molded polymer has a portion molded to an inner surface of the housing sidewall. 7. The electronic device defined in claim 2 further comprising liquid adhesive in a gap between the output surface and the display cover layer. 8. The electronic device defined in claim 7 wherein a portion of the molded polymer protrudes into the gap. 9. The electronic device defined in claim 1 wherein the component comprises a component selected from the group consisting of: a printed circuit, an integrated circuit, and a connector. 10. The electronic device defined in claim 1 wherein the coherent fiber bundle has a notch and wherein the molded polymer comprises a portion in the notch. 11. The electronic device defined in claim 1 wherein the component has mating contacts that are electrically connected to the backside contacts. 12. The electronic device defined in claim 1 wherein the molded polymer is molded over the edge of the pixel layer and the component. 13. The electronic device defined in claim 12 , wherein the molded polymer is molded into a notch in the coherent fiber bundle. 14. An electronic device, comprising: a pixel layer configured to produce an image; a coherent fiber bundle having an input surface that receives the image and having a corresponding output surface on which the image is provided; a display cover layer that overlaps the coherent fiber bundle and that is separated by a gap from the output surface; liquid adhesive in the gap; and a molded polymer member coupled to the display cover layer and coupled to the coherent fiber bundle. 15. The electronic device defined in claim 14 wherein a portion of the molded polymer member protrudes into the gap. 16. The electronic device defined in claim 14 further comprising a fastener that is received within an opening in the molded polymer member. 17. The electronic device defined in claim 14 wherein the pixel layer has a bent edge that is at least partly embedded in the molded polymer member. 18. The electronic device defined in claim 14 further comprising a housing wall, wherein the molded polymer member has a portion attached to the housing wall. 19. An electronic device, comprising: a housing; a display in the housing that has an active area with an array of pixels configured to display an image and an inactive area without pixels at an edge of the display; a molded polymer member that covers at least the edge of the display; a coherent fiber bundle that receives the image at an input surface and that provides the received image to an output surface; a glass layer that overlaps the coherent fiber bundle; and an adhesive layer between the coherent fiber bundle and the glass layer.

Assignees

Inventors

Classifications

  • Passivation; Containers; Encapsulations · CPC title

  • with fibre bundle in form of plate · CPC title

  • in optical fibres · CPC title

  • Passivation; Containers; Encapsulations · CPC title

  • Cover glasses · CPC title

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Frequently asked questions

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What does patent US11994760B1 cover?
An electronic device may have a display, a display cover layer, and an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may be placed between the display and the display cover layer. A gap may separate the coherent fiber bundle from the display cover layer. Adhesive in the gap may attach the coherent fiber bundle to the display cover layer. Molded polymer may…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification G02F1/133331. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 28 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).