Method and apparatus for adjusting metal wiring density

Patent metadata

Field	Value
Publication number	US-11989499-B2
Application number	US-202217647619-A
Country	US
Kind code	B2
Filing date	Jan 11, 2022
Priority date	Jul 6, 2021
Publication date	May 21, 2024
Grant date	May 21, 2024

Abstract

Embodiments of the present application provide a method and an apparatus for adjusting metal wiring density. By detecting metal wiring density in each of metal density detection windows in a target layout, a region in which the metal wiring density is greater than a preset density threshold can be quickly positioned in the target layout, thereby improving the layout correction efficiency; then a power fill mesh in a target metal density detection window in which the metal wiring density is greater than the preset density threshold is cropped multiple times, until the metal wiring density in each of the metal density detection windows is less than or equal to the preset density threshold, such that sufficient power fill meshes are retained in the target layout while the metal wiring density of the target layout is less than or equal to the preset density threshold.

First claim

The invention claimed is:

1. A method for adjusting metal wiring density, comprising:
detecting metal wiring density in each of metal density detection windows in a target layout;
when there is a target metal density detection window in which the metal wiring density is greater than a preset density threshold among the metal density detection windows, cropping a power fill mesh in the target metal density detection window;
returning to detect the metal wiring density in each of the metal density detection windows in the target layout, until the metal wiring density in each of the metal density detection windows in the target layout is less than or equal to the preset density threshold;
wherein before the detecting metal wiring density in each of metal density detection windows in a target layout, the method for adjusting metal wiring density further comprises:
adding power fill meshes to an initial layout, to form the target layout, wherein the initial layout comprises initial metal wires;

when the metal wiring density in each of the metal density detection windows in the target layout is less than or equal to the preset density threshold, detecting whether there is a blank gap between cropped power fill meshes in the target layout and ends of the initial metal wires in the target layout; and
when there is the blank gap between the cropped power fill meshes in the target layout and the ends of the initial metal wires in the target layout, adding the power fill meshes to the blank gap.

2. The method for adjusting metal wiring density of claim 1 , wherein the cropping a power fill mesh in the target metal density detection window comprises:
cropping edges of the power fill mesh in the target metal density detection window based on a preset cropping size value.

3. The method for adjusting metal wiring density of claim 2 , wherein the cropping edges of the power fill mesh in the target metal density detection window based on a preset cropping size value comprises:
cropping the edges of the power fill mesh in the target metal density detection window as a whole from outside to inside according to the preset cropping size value.

4. The method for adjusting metal wiring density of claim 1 , wherein the preset density threshold is an upper limit, of the metal wiring density, set by a processing technology corresponding to the target layout.

5. The method for adjusting metal wiring density of claim 1 , wherein the returning to detect the metal wiring density in each of the metal density detection windows in the target layout, until the metal wiring density in each of the metal density detection windows in the target layout is less than or equal to the preset density threshold comprises:
returning to detect the metal wiring density in each of the metal density detection windows in the target layout after cropping;
when there is the target metal density detection window in which the metal wiring density is greater than the preset density threshold among the metal density detection windows, cropping the power fill mesh in the target metal density detection window, and continuing to detect the metal wiring density in each of the metal density detection windows in the target layout after cropping; and
when there is no target metal density detection window in which the metal wiring density is greater than the preset density threshold among the metal density detection windows, stopping detecting the metal wiring density in each of the metal density detection windows in the target layout, and outputting the target layout after latest cropping as a qualified layout.

6. The method for adjusting metal wiring density of claim 5 , wherein the returning to detect the metal wiring density in each of the metal density detection windows in the target layout after cropping comprises:
returning to detect the metal wiring density in the target metal density detection window after latest cropping.

7. The method for adjusting metal wiring density of claim 1 , wherein before the detecting metal wiring density in each of metal density detection windows in a target layout, the method for adjusting metal wiring density further comprises:
creating a plurality of metal density detection windows which do not overlap each other, in the target layout.

8. An electronic device, comprising: at least one processor and a memory, wherein
the memory stores computer executable instructions; and
the at least one processor executes the computer executable instructions stored by the memory, such that the at least one processor performs the method for adjusting metal wiring density of claim 1 .

9. A non-transitory computer readable storage medium, wherein the non-transitory computer readable storage medium stores computer executable instructions, wherein when the computer executable instructions are executed by a processor, the method for adjusting metal wiring density of claim 1 is implemented.

10. An apparatus for adjusting metal wiring density, comprising:
a detection module, configured to detect metal wiring density in each of metal density detection windows in a target layout; and
a processing module, configured to:
add power fill meshes to an initial layout, to form the target layout, wherein the initial layout comprises initial metal wires;
when there is a target metal density detection window in which the metal wiring density is greater than a preset density threshold among the metal density detection windows, crop a power fill mesh in the target metal density detection window;
return to run the detection module, until the metal wiring density in each of the metal density detection windows in the target layout is less than or equal to the preset density threshold;
when the metal wiring density in each of the metal density detection windows in the target layout is less than or equal to the preset density threshold, detect whether there is a blank gap between cropped power fill meshes in the target layout and ends of the initial metal wires in the target layout; and
when there is the blank gap between the cropped power fill meshes in the target layout and the ends of the initial metal wires in the target layout, add the power fill meshes to the blank gap.

11. The apparatus for adjusting metal wiring density of claim 10 , wherein the processing module is configured to:
crop edges of the power fill mesh in the target metal density detection window based on a preset cropping size value.

12. The apparatus for adjusting metal wiring density of claim 11 , wherein the processing module is configured to:
crop the edges of the power fill mesh in the target metal density detection window as a whole from outside to inside according to the preset cropping size value.

13. The apparatus for adjusting metal wiring density of claim 10 , wherein the preset density threshold is an upper limit, of the metal wiring density, set by a processing technology corresponding to the target layout.

14. The apparatus for adjusting metal wiring density of claim 10 , wherein the processing module is configured to:
when there is the target metal density detection window in which the metal wiring density is greater than the preset density threshold among the metal density detection windows, crop the power fill mesh in the target metal density detection window, and return to run the detection module; and
when there is no target metal density detection window in which the metal wiring density is greater than the preset density threshold among the metal density detection windows, stop running the detection module, and output the target layout after latest cropping as a qualified layou

Assignees

• Changxin Memory Tech Inc

Inventors

• Chen Chuanjiang
• Tang Li
• Bai Li
• Zhao Kang

Classifications

• H10W20/427

  Power or ground buses · CPC title

• G06F30/394 Primary

  Routing (G06F30/396 takes precedence) · CPC title

• G06F30/392

  Floor-planning or layout, e.g. partitioning or placement · CPC title

• G06F30/3953 Primary

  detailed · CPC title

• G06F2115/12

  Printed circuit boards [PCB] or multi-chip modules [MCM] · CPC title