Ceramic matrix composite component and method of producing the same

US11987533B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11987533-B2
Application numberUS-201816181932-A
CountryUS
Kind codeB2
Filing dateNov 6, 2018
Priority dateJun 13, 2016
Publication dateMay 21, 2024
Grant dateMay 21, 2024

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

First claim

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What is claimed is: 1. A method of producing a ceramic matrix composite component, comprising: a silicon carbide layer coating step of coating bonding surfaces of a first substrate and a second substrate, each formed of a silicide-containing ceramic matrix composite, with silicon carbide layers; and a brazing step of brazing the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate by heating and thereby melting a brazing filler metal, in a form of powder, formed of a silicon-containing alloy, wherein the silicon carbide layer coating step includes filling and sealing voids in the bonding surface of the first substrate and voids in the bonding surface of the second substrate with silicon carbide powder, before coating the bonding surfaces with the silicon carbide layers, and sealing portions are formed of the silicon carbide, the voids in the bonding surface of the first substrate and the voids in the bonding surface of the second substrate are voids in spaces between woven fiber bundles, and in the brazing step, an average particle size of the brazing filler metal is 45 μm or less, and the average particle size is measured by a laser diffraction scattering method. 2. The method of producing a ceramic matrix composite component according to claim 1 , wherein the silicon carbide layer coating step includes filling and sealing the voids in the bonding surface of the first substrate and the voids in the bonding surface of the second substrate with silicon carbide powder by immersing the first substrate and the second substrate in slurry containing the silicon carbide powder while applying ultrasonic vibration to the slurry, before coating the bonding surfaces with the silicon carbide layers. 3. The method of producing a ceramic matrix composite component according to claim 1 , wherein an average particle size of the silicon carbide powder is 3 μm or greater but 5 μm or less. 4. The method of producing a ceramic matrix composite component according to claim 1 , wherein the brazing filler metal is a silicon-containing eutectic alloy. 5. The method of producing a ceramic matrix composite component according to claim 1 , wherein in the silicon carbide layer coating step, the silicon carbide layers are formed by chemical vapor infiltration. 6. The method of producing a ceramic matrix composite component according to claim 1 , wherein in the brazing step, the brazing filler metal is heated at a temperature equal to or greater than a melting point of the silicon-containing alloy, but less than a crystal grain coarsening temperature of reinforcing fiber in the ceramic matrix composite. 7. The method of producing a ceramic matrix composite component according to claim 1 , wherein in the brazing step, the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate are butted up against each other with a gap provided in between, and the gap is filled with the brazing filler metal by making the brazing filler metal, as melted, flow into the gap from outside of the gap. 8. The method of producing a ceramic matrix composite component according to claim 1 , wherein in the brazing step, the brazing is performed by applying the brazing filler metal to at least one of surfaces of the silicon carbide layers coating the bonding surfaces of the first substrate and the second substrate, and thereafter butting up the surfaces of the silicon carbide layers against each other. 9. The method of producing a ceramic matrix composite component according to claim 1 , the ceramic matrix composite includes three-dimensional woven fabric obtained by sewing two-dimensional woven fabric with Z threads, and the voids in the bonding surface of the first substrate and the voids in the bonding surface of the second substrate include voids in surfaces orthogonal to a surface of the two-dimensional woven fabric. 10. The method of producing a ceramic matrix composite component according to claim 1 , wherein an average particle size of the silicon carbide powder is 3 μm or greater and 4 μm or less. 11. The method of producing a ceramic matrix composite component according to claim 1 , wherein the silicon carbide layer coating step includes filling and sealing the voids in the bonding surface of the first substrate and the voids in the bonding surface of the second substrate with silicon carbide powder by immersing the first substrate and the second substrate in slurry consisting of the silicon carbide powder and a solvent, before coating the bonding surfaces with the silicon carbide layers. 12. The method of producing a ceramic matrix composite component according to claim 1 , wherein in the brazing step, a pasty brazing filler metal obtained by mixing the brazing filler metal and a binder including a solvent is used. 13. The method of producing a ceramic matrix composite component according to claim 12 , wherein a ratio of the binder/the brazing filler metal is 1/20 or less. 14. The method of producing a ceramic matrix composite component according to claim 1 , wherein the brazing filler metal is a Si-Ti eutectic alloy. 15. The method of producing a ceramic matrix composite component according to claim 1 , wherein the brazing filler metal is a Si-Y eutectic alloy. 16. The method of producing a ceramic matrix composite component according to claim 1 , wherein the brazing filler metal is a Si-Hf eutectic alloy. 17. The method of producing a ceramic matrix composite component according to claim 1 , wherein a gap between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate is 10 μm to 1000 μm. 18. The method of producing a ceramic matrix composite component according to claim 2 , wherein the silicon carbide layer coating step includes: defoaming the slurry, and applying the ultrasonic vibration to the slurry after immersing and leaving the first substrate and the second substrate stand in the defoamed slurry. 19. The method of producing a ceramic matrix composite component according to claim 2 , wherein a frequency of the ultrasonic vibration is 23 kHz or more and 28 kHz or less.

Assignees

Inventors

Classifications

  • C04B37/003Primary

    by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts · CPC title

  • B23K1/19Primary

    taking account of the properties of the materials to be soldered · CPC title

  • characterised by the material treated · CPC title

  • Silicon carbide · CPC title

  • Ceramics · CPC title

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What does patent US11987533B2 cover?
A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the…
Who is the assignee on this patent?
Ihi Corp
What technology area does this patent fall under?
Primary CPC classification C04B37/003. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 21 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).