Headphones with increased back volume

Patent metadata

Field	Value
Publication number	US-11985463-B2
Application number	US-202318197672-A
Country	US
Kind code	B2
Filing date	May 15, 2023
Priority date	Nov 20, 2017
Publication date	May 14, 2024
Grant date	May 14, 2024

Abstract

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

First claim

What is claimed is:

1. An earpiece suitable for use with headphones, the earpiece comprising:
an earpiece housing defining an interior volume having a central region surrounded by an annular region, the earpiece housing including a cover plate disposed over the central region and having a plurality of apertures formed there through;
an array of capacitive sensors disposed within the interior volume and coupled to the cover plate;
an annular earpad coupled to the earpiece housing and surrounding the plurality of apertures formed through the cover plate; and
an acoustic driver disposed within the interior volume and aligned to emit sound through the plurality of apertures formed in the cover plate.

2. The earpiece set forth in claim 1 wherein the array of capacitive sensors extends across the plurality of apertures.

3. The earpiece set forth in claim 2 wherein the array of capacitive sensors has a plurality of openings formed there through, each opening in the plurality of openings being aligned with one of the apertures in the plurality of apertures.

4. The earpiece set forth in claim 1 wherein the array of capacitive sensors is configured to detect a pattern formed by one or more physical features.

5. The earpiece set forth in claim 1 wherein the array of capacitive sensors is configured to, when the earpiece is worn over a human ear, detect whether the earpiece is worn over a left ear or a right ear.

6. The earpiece set forth in claim 1 wherein the array of capacitive sensors is configured to, when the earpiece is worn over a human ear, detect contours of the ear.

7. The earpiece set forth in claim 1 , wherein the array of capacitive sensors defines multiple openings that allow audio waves generated by an acoustic driver to exit the earpiece housing through the multiple openings.

8. The earpiece set forth in claim 1 further comprising a frame disposed within the interior volume and coupling the acoustic driver to the earpiece housing.

9. The earpiece set forth in claim 1 further comprising one or more proximity sensors arranged to, when the earpiece is worn by a user, emit infrared light towards an ear of the user.

10. An earpiece suitable for use with headphones, the earpiece comprising:
an earpiece housing defining an interior volume having a central region surrounded by an annular region, the earpiece housing including a cover plate disposed over the central region and having a plurality of apertures formed there through;
an array of capacitive sensors coupled to the cover plate and arranged in a grid pattern that extends across the plurality of apertures, the array of capacitive sensors having a plurality of openings formed there through, each opening in the plurality of openings being aligned with one of the apertures in the plurality of apertures;
an annular earpad coupled to the earpiece housing and surrounding the plurality of apertures formed through the cover plate; and
an acoustic driver disposed within the interior volume and aligned to emit sound through the plurality of apertures formed in the cover plate and through the openings of the array of capacitive sensors.

11. The earpiece set forth in claim 10 wherein the array of capacitive sensors is configured to, when the earpiece is worn over a human ear, detect whether the earpiece is worn over a left ear or a right ear.

12. The earpiece set forth in claim 10 wherein the array of capacitive sensors is configured to, when the earpiece is worn over a human ear, detect contours of the ear.

13. Headphones comprising:
a headband having first and second opposing ends;
a first earpiece coupled to the first end of the headband; and
a second earpiece coupled to the second end of the headband;
wherein each of the first and second earpieces comprises:
an earpiece housing defining an interior volume having a central region surrounded by an annular region, the earpiece housing including a cover plate disposed over the central region and having a plurality of apertures formed there through;
an array of capacitive sensors disposed within the interior volume and coupled to the cover plate;
an annular earpad coupled to the earpiece housing and surrounding the plurality of apertures formed through the cover plate; and
an acoustic driver disposed within the interior volume and aligned to emit sound through the plurality of apertures formed in the cover plate.

14. The headphones set forth in claim 13 wherein, in each of the first and second earpieces, the array of capacitive sensors extends across the plurality of apertures.

15. The headphones set forth in claim 14 wherein, in each of the first and second earpieces, the array of capacitive sensors has a plurality of openings formed there through, each opening in the plurality of openings being aligned with one of the apertures in the plurality of apertures.

16. The headphones set forth in claim 13 wherein, in each of the first and second earpieces, the array of capacitive sensors is configured to, when the earpiece is worn over a human ear, whether the earpiece is worn over a left ear or a right ear.

17. The headphones set forth in claim 13 wherein, in each of the first and second earpieces, the array of capacitive sensors is configured to, when the earpiece is worn over a human ear, detect contours of the ear.

18. The headphones set forth in claim 13 wherein, in each of the first and second earpieces, the array of capacitive sensors defines multiple openings that allow audio waves generated by an acoustic driver to exit the earpiece housing through the multiple openings.

19. The headphones set forth in claim 13 further comprising one or more proximity sensors arranged to, when the earpiece is worn by a user, emit infrared light towards an ear of the user.

20. The headphones set forth in claim 13 wherein, in each of the first and second earpieces, the array of capacitive sensors is arranged in a grid pattern that extends across the plurality of apertures.

Assignees

• Apple Inc

Inventors

• Siahaan Edward
• Bloom Daniel R
• Leblanc Jason J
• Qian Phillip

Classifications

• H04R1/1008 Primary

  Earpieces of the supra-aural or circum-aural type · CPC title

• H04R1/1033 Primary

  Cables or cables storage, e.g. cable reels (cord reels per se H02G11/02; arrangements for storing and repeatedly paying-out and re-storing lengths of conductors or cables B65H75/34; extensible conductors or cables, e.g. self-coiling cords H01B7/06) · CPC title

• H04R1/1041

  Mechanical or electronic switches, or control elements (switches in general H01H) · CPC title

• H04R1/105

  Earpiece supports, e.g. ear hooks (for stereophonic headphones H04R5/0335) · CPC title

• H04R1/1066

  Constructional aspects of the interconnection between earpiece and earpiece support (earpiece support for monophonic headphones H04R1/105; earpiece support for stereophonic headphones H04R5/0335) · CPC title