Chemical supply apparatus, method for removing particles from chemical, nozzle unit, and substrate treating apparatus

Patent metadata

Field	Value
Publication number	US-11981995-B2
Application number	US-202017086061-A
Country	US
Kind code	B2
Filing date	Oct 30, 2020
Priority date	Oct 31, 2019
Publication date	May 14, 2024
Grant date	May 14, 2024

Abstract

A chemical supply apparatus includes an evaporation unit disposed downstream of a chemical supply source to vaporize supplied chemical thereto, a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the vaporized chemical while the vaporized chemical passes through the filter unit, a liquefaction unit disposed downstream of the filter unit to liquefy the vaporized chemical, and a chemical storage tank disposed downstream of the liquefaction unit to store the liquefied chemical therein, wherein an electrode is disposed between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change electrical properties of the chemical or the particles.

First claim

What is claimed is:

1. A chemical supply apparatus comprising:
an evaporation unit disposed downstream of a chemical supply source to vaporize supplied chemical thereto;
a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the vaporized chemical while the vaporized chemical passes through the filter unit;
a liquefaction unit disposed downstream of the filter unit to liquefy the vaporized chemical;
a chemical storage tank disposed downstream of the liquefaction unit to store the liquefied chemical therein; and
an electrode disposed at least in the evaporation unit,
wherein the electrode electrically reacts with the chemical or particles in the chemical to change electrical properties of the chemical or the particles.

2. The chemical supply apparatus of claim 1 , wherein the electrical reaction between the electrode and the chemical or the particles includes a reduction reaction of the particles.

3. The chemical supply apparatus of claim 1 , wherein the electrical reaction between the electrode and the chemical or the particles includes polarization of the particles.

4. The chemical supply apparatus of claim 3 , wherein the particles include nonpolar particles.

5. The chemical supply apparatus of claim 1 , wherein the electrode is further disposed in the filter unit.

6. The chemical supply apparatus of claim 1 , wherein the electrode is further disposed in the liquefaction unit.

7. The chemical supply apparatus of claim 1 , wherein the electrode is further disposed at a front end of the filter unit.

8. The chemical supply apparatus of claim 1 , wherein the evaporation unit includes a first evaporation unit and a second evaporation unit, wherein each of the first evaporation unit and the second evaporation unit includes the electrode.

9. The chemical supply apparatus of claim 1 , wherein the particles include metal particles.

10. A nozzle unit comprising:
a body having a supply channel defined therein through which chemical is supplied; and
an electrode received in the supply channel,
wherein the electrode is connected to a ground line or a power supply,
wherein the electrode is embodied as a disk extending in a perpendicular manner to a length direction of the supply channel and holes or slits are formed in the disk and in a flow path direction to allow the chemical to pass therethrough.

11. The nozzle unit of claim 10 , wherein the nozzle unit further comprises a controller,
wherein the controller is configured to enable or disable connection between the electrode and the ground line and connection between the electrode and the power supply.

12. The nozzle unit of claim 10 , wherein the power supply applies a negative voltage to the electrode.

13. A substrate treating apparatus comprising:
an evaporation unit disposed downstream of a chemical supply source to vaporize supplied chemical thereto;
a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the vaporized chemical while the vaporized chemical passes through the filter unit;
a liquefaction unit disposed downstream of the filter unit to liquefy the vaporized chemical;
a chemical storage tank disposed downstream of the liquefaction unit to store the liquefied chemical therein;
an electrode disposed at least in the evaporation unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change electrical properties of the chemical or the particles;
a container having a treating space defined therein;
a support unit disposed in the treating space to support a substrate thereon; and
a nozzle unit disposed downstream of the liquefaction unit and in fluid communication with the liquefaction unit, wherein the nozzle unit supplies the chemical onto the substrate supported on the support unit,
wherein the nozzle unit includes:
a body having a supply channel defined therein through which the chemical is supplied; and
an other electrode received in the supply channel,
wherein the other electrode of the nozzle unit is connected to a ground line or a power supply.

14. The substrate treating apparatus of claim 13 , wherein the nozzle unit further comprises a controller,
wherein the controller is configured to enable or disable connection between the other electrode and the ground line and connection between the electrode and the power supply.

15. The substrate treating apparatus of claim 13 , wherein the power supply applies a negative voltage to the other electrode.

Assignees

• Semes Co Ltd

Inventors

• Hong Yong Hoon
• Yoon Dohyeon
• Kim Heehwan
• Lee Ji Young
• Kim Young Su

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P14/6534

  by exposure to a liquid · CPC title