3D printed ultrasonic probe

Patent metadata

Field	Value
Publication number	US-11981070-B2
Application number	US-202217805106-A
Country	US
Kind code	B2
Filing date	Jun 2, 2022
Priority date	Jun 16, 2021
Publication date	May 14, 2024
Grant date	May 14, 2024

Abstract

An ultrasonic probe and methods of manufacture are provided. The method can include depositing a base layer on a platform. The method can also include depositing a first portion of a first functional layer on the base layer. The method can further include positioning a first surface of an ultrasonic transducer on the first portion of the first functional layer. The transducer can further include a second surface opposite the first surface and opposed first and second sides. The first and second sides can be transverse to the first and second surfaces. The method can additionally include depositing a second portion of the first functional layer on the first and second sides of the transducer. The method can further include depositing a second functional layer upon the second surface of the transducer. The transducer can be encapsulated by the first functional layer and the second functional layer.

First claim

What is claimed is:

1. A method of manufacturing an ultrasonic probe, comprising:
printing a base layer on a platform;
printing a first portion of a first functional layer on the base layer;
positioning a first surface of an ultrasonic transducer on the first portion of the first functional layer, the ultrasonic transducer further including a second surface opposite the first surface and opposed first and second sides, the first and second sides being transverse to the first and second surfaces;
printing a second portion of the first functional layer on the first and second sides of the ultrasonic transducer, the second portion of the first functional layer printed such that it extends along the first and second sides from the first portion of the first functional layer to the second surface; and
printing a second functional layer upon the second portion of the first functional layer and second surface of the ultrasonic transducer, wherein the ultrasonic transducer is encapsulated by the first functional layer and the second functional layer.

2. The method of claim 1 , wherein printing the base layer comprises:
submerging the platform within a tank containing a liquid resin of a base material;
focusing a first light beam within a volume of the base material resin adjacent to a surface of the platform; and
curing the volume of base material resin in response to exposure to the first light beam to form the base layer.

3. The method of claim 2 , wherein printing the first portion of the first functional layer comprises:
submerging the platform and the base layer within the tank containing a liquid resin of a first functional material;
focusing a second light beam within a first volume of the first functional material adjacent to a surface of the base layer; and
curing the first volume of the first functional material resin in response to exposure to second light beam to form the first portion of the first functional layer.

4. The method of claim 3 , wherein printing the second portion of the first functional layer comprises:
submerging the platform, the base layer, the ultrasonic transducer, and the first portion of the first functional layer within the tank containing a liquid resin of the first functional material;
focusing the second light beam within a second volume of the first functional material adjacent to the first and second sides of the transducer; and
curing the second volume of the first functional material resin in response to exposure to the second light beam to form the second portion of the first functional layer.

5. The method of claim 4 , wherein printing the second functional layer comprises:
submerging the platform, the base layer, the ultrasonic transducer, and the first and second portions of the first functional layer within the tank containing a liquid resin of the second functional material;
focusing a third light beam within a third volume of the second functional material adjacent to the second surface of the transducer; and
curing the third volume of the second functional material resin in response to exposure to the fourth light beam to form the second functional layer on the second surface of the transducer.

6. The method of claim 1 , further comprising printing a first portion of a housing on at least a portion of free surfaces of the base layer, the ultrasonic transducer, and the first and second functional layers.

7. The method of claim 6 , wherein printing a first housing portion comprises:
submerging the platform, the base layer, the ultrasonic transducer, and the first and second portions of the first functional layer within the tank containing a liquid resin of a housing material;
focusing a fourth light beam within a first volume of the housing material adjacent to at least a portion of free surfaces of the base layer, the ultrasonic transducer, and the first and second functional layers; and
curing the first volume of the housing material in response to exposure to the fourth light beam to form the first housing portion.

8. The method of claim 6 , further comprising:
positioning a printed circuit board (PCB) on the second functional layer; and
electrically connecting the PCB to the ultrasonic transducer.

9. The method of claim 8 , further comprising further comprising printing a second housing portion on at least a portion of the base layer, the first and second functional layers, the transducer, the first housing portion, and the PCB.

10. The method of claim 9 , wherein printing the second housing portion comprises:
submerging the platform, the base layer, the ultrasonic transducer, the first and second functional layers, the PCB, and the first housing portion within the tank containing the liquid resin of the housing material;
focusing the fourth light beam within a second volume of the housing material resin adjacent to free surfaces of the base layer, the ultrasonic transducer, the first and second functional layers, the PCB, and the first housing portion; and
curing the housing material resin in response to exposure to the fourth light to form the second housing portion.

11. The method of claim 10 , wherein the PCB is encapsulated by the first housing portion and the second housing portion.

12. The method of claim 1 , wherein the first functional material comprises an acoustic matching material configured to provide acoustic impedance matching between the ultrasonic transducer and a target.

13. The method of claim 1 , wherein the second functional material comprises a damping material configured to attenuate ultrasonic signals emitted by the ultrasonic transducer by a predetermined amount.

14. The method of claim 8 , wherein electrically connecting the PCB to the ultrasonic transducer comprises printing one or more electrically conductive pathways between the ultrasonic transducer and the PCB prior to printing the second housing portion.

Assignees

• Baker Hughes Holdings Llc

Inventors

• Hoemske Benjamin

Classifications

• B29C64/135 Primary

  the energy source being concentrated, e.g. scanning lasers or focused light sources · CPC title

• B29C64/245

  Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

• B29K2995/0001

  having particular acoustical properties · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title