Thermoplastic encapsulated thermal imaging systems and methods

Patent metadata

Field	Value
Publication number	US-11981060-B2
Application number	US-202117504460-A
Country	US
Kind code	B2
Filing date	Oct 18, 2021
Priority date	Oct 18, 2021
Publication date	May 14, 2024
Grant date	May 14, 2024

Abstract

Various techniques are provided to enclose at least a portion of a thermal imaging system in a thermoplastic material to create a waterproof thermal imaging system and encapsulate associated electrical components. In one example, a method includes placing at least a portion of a thermal imaging system comprising a plurality of exposed electronic components into a mold. The method also includes injecting a thermoplastic material into the mold to deposit the thermoplastic material onto the electronic components and encapsulate the electronic components in an overmolded solid enclosure formed by the thermoplastic material. Additional methods and systems are also provided.

First claim

What is claimed is:

1. A method comprising:
placing at least a portion of a thermal imaging system comprising a plurality of exposed electronic components into a mold; and
injecting a thermoplastic material into the mold to deposit the thermoplastic material onto the electronic components and encapsulate the electronic components in an overmolded solid enclosure formed by the thermoplastic material.

2. The method of claim 1 , wherein:
the thermal imaging system further comprises a heatsink configured to dissipate heat associated with the electronic components;
at least a portion of the heatsink is exposed to an external environment following the injecting; and
the thermoplastic material seals the heatsink to the overmolded solid enclosure.

3. The method of claim 1 , wherein the thermal imaging system further comprises an optical assembly and a thermal imager that are not encapsulated by the thermoplastic material.

4. The method of claim 3 , wherein the optical assembly and the thermal imager are disposed in a first portion of the thermal imaging system, wherein the overmolded solid enclosure formed by the thermoplastic material provides a second portion of the thermal imaging system, wherein the thermoplastic material seals the second portion to the first portion.

5. The method of claim 4 , wherein the overmolded solid enclosure formed by the thermoplastic material reduces an internal air volume of the thermal imaging system and is waterproof to permit the electronic components of the second portion to be operated without a breathable vent.

6. The method of claim 1 , wherein the thermal imaging system further comprises a connector configured to interface between at least one of the electronic components and an external device, wherein the injecting comprises encapsulating a portion of the connector by the thermoplastic material in the overmolded solid enclosure to secure the connector to the thermal imaging system.

7. The method of claim 1 , wherein the injecting is performed at a pressure less than 50 bars to prevent the electronic components from being displaced during the injecting.

8. The method of claim 1 , wherein the thermoplastic material is at least one of a polyamide and/or a polyolefin to provide greater thermal conductivity and greater electrical insulation than air.

9. The method of claim 1 , wherein the thermoplastic material permits the electronic components to be operated over a temperature range of at least −40 degrees C. to at least +85 degrees C.

10. The method of claim 1 , wherein the thermal imaging system is configured to be mounted to a vehicle.

11. The method of claim 1 , further comprising removing the thermal imaging system from the mold and testing the thermal imaging system.

12. A method comprising:
inserting exposed electronic components of a camera and associated circuit boards of the camera into a frame of the camera, wherein the camera is a thermal camera;
after the inserting, placing at least a portion of the camera into a thermoplastic mold; and
injecting thermoplastic material into the thermoplastic mold to encapsulate the electronic components in an overmolded solid enclosure formed by the thermoplastic material.

13. The method of claim 12 , wherein the frame is provided by a heatsink configured to dissipate heat associated with the electronic components.

14. The method of claim 13 , wherein at least part of the heatsink is exposed to an external environment following the injecting.

15. The method of claim 12 , wherein the thermoplastic material is injected in a heated state.

16. The method of claim 12 , wherein the camera comprises a connector configured to interface between at least one of the electronic components and an external device, wherein the injecting comprises encapsulating a portion of the connector by the thermoplastic material in the overmolded solid enclosure to secure the connector to the camera.

17. The method of claim 16 , wherein the connector is a Fakra coaxial connector.

18. The method of claim 12 , wherein the camera is waterproof.

19. The method of claim 12 , further comprising removing the camera from the mold and testing the camera.

Assignees

• Teledyne Flir Commercial Systems Inc

Inventors

• Tremblay Marcel
• Dispenza Jace

Classifications

• B29C45/14778 Primary

  the article consisting of a material with particular properties, e.g. porous, brittle · CPC title

• B29C45/0001

  characterised by the choice of material · CPC title

• B29C45/14639 Primary

  for obtaining an insulating effect, e.g. for electrical components · CPC title

• B29K2077/00

  Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material · CPC title

• B29L2031/30

  Vehicles, e.g. ships or aircraft, or body parts thereof {(vanes or blades B29L2031/08, air bags B29L2022/027)} · CPC title