Low shrinkage, fast drying spackling or joint compound

US11976006B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11976006-B2
Application numberUS-202117157049-A
CountryUS
Kind codeB2
Filing dateJan 25, 2021
Priority dateMar 6, 2020
Publication dateMay 7, 2024
Grant dateMay 7, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Spackling and joint compounds with lower shrinkage, better sanding, and fast drying. Methods for repairing walls and ceiling in which the present spackling compound is applied to a variety of substrates, including wallboard, plaster and/or wood. Methods for finishing seams in wall construction in which the spackling/joint compound is used for finishing the seams.

First claim

Opening claim text (preview).

What is claimed is: 1. A spackling compound which comprises: 20-50% w/w calcium carbonate by total weight of the spackling compound, 5-20% w/w hollow glass microspheres by total weight of the spackling compound, 0.5-10% w/w of a binder by total weight of the spackling compound, 0.1-5% w/w of a humectant by total weight of the spackling compound, 0.1-3% w/w of a polyacid dispersant by total weight of the spackling compound, wherein the polyacid dispersant is a homopolymer or co-polymer of acrylic, methacrylic, crotonic and/or maleic acids and has a molecular weight in the range from 1,500 to 20,000 Daltons, and a rheology-modifying additive, and wherein the rheology-modifying additive includes 0.1-5% w/w of a cellulosic thickener and 8-20% w/w of a rheology-modifying clay by total weight of the spackling compound; and wherein when mixed with water, the spackling compound comprises water in an amount from 20% w/w to 50% w/w by total weight of the spackling compound. 2. The spackling compound of claim 1 , wherein the rheology-modifying additive further comprises one or more of the following: an associative thickener, a non-associative synthetic thickener, an oil-based thixotrope, or any combination thereof. 3. The spackling compound of claim 1 , wherein the spackling compound is a ready-mixed paste. 4. The spackling compound of claim 1 , wherein the hollow glass microspheres are a mixture of particles with a particle size distribution with a particle median size by volume in the range from 40 to 70 microns. 5. The spackling compound of claim 1 , wherein the hollow glass microspheres are a mixture of particles having a minimum true density of at least 0.1 g/cc. 6. The spackling compound of claim 1 , wherein the spackling compound comprises one or more of the following rheology-modifying clays: kaolinite, attapulgite, bentonite, illite, sepiolite or any combination thereof. 7. The spackling compound of claim 1 , wherein the cellulosic thickener which comprises one or more of the following: methyl cellulose, methyl hydroxyethyl cellulose, hydroxyethyl cellulose, hydroxypropyl methyl cellulose, hydroxypropyl cellulose, or any mixture thereof. 8. The spackling compound of claim 1 , wherein the spackling compound comprises the cellulosic thickener in an amount in the range from 0.1% w/w to 5% w/w by total weight of the spackling compound, including water. 9. The spackling compound of claim 1 , wherein the spackling compound further comprises one or more of the following compounds: a hydrophobically modified polyurethane (HEUR), a hydrophobically modified polyether (HMPE), a styrene-maleic anhydride terpolymer (SMAT), a hydrophobically modified alkali swellable acrylic emulsion (HASE), hydrophobically modified ethoxylated aminoplast polymer (HEAT), an alkali swellable acrylic emulsion (ASE), an oil-based thixotrope, or any combination thereof. 10. The spackling compound of claim 1 , wherein the spackling compound comprises one or more of the following binders: starch, polyvinyl alcohol, acrylic binder, styrene-acrylic binder, vinyl acrylic binder, or any combination thereof. 11. The spackling compound of claim 1 , wherein the spackling compound is further characterized by one or more of the following features: a) the humectant comprises one or more of the following: glycerol, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, di-propylene glycol, and/or tri-propylene glycol, or any combination thereof; and b) the spackling compound further comprises one or more of the following: a pigment, a biocide/preservative, a defoamer, a surfactant, fibers, a dryness indicator, a pH adjuster/stabilizer, and/or any combination thereof. 12. The spackling compound of claim 1 , wherein the rheology-modifying clay is used in the same amount as hollow glass microspheres. 13. A method for patching a surface, the method comprising applying to the surface the spackling compound of claim 1 . 14. The method of claim 13 , wherein the surface is wallboard, plaster, cementitious surface and/or wood. 15. The method of claim 13 , wherein method further comprises sanding, coating with a primer and/or painting the patched surface. 16. A method for finishing a joint between two adjacent panels, the method comprising filling the joint with the spackling compound of claim 1 and/or applying the spackling compound of claim 1 as a top-coat.

Assignees

Inventors

Classifications

  • C04B14/28Primary

    of calcium · CPC title

  • Clay {(sepiolite C04B14/042; grog C04B18/025)} · CPC title

  • porous, e.g. foamed glass · CPC title

  • Cellulosic materials (cellulosic waste materials, e.g. sawdust, rice husks, C04B18/24) · CPC title

  • Acrylates · CPC title

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What does patent US11976006B2 cover?
Spackling and joint compounds with lower shrinkage, better sanding, and fast drying. Methods for repairing walls and ceiling in which the present spackling compound is applied to a variety of substrates, including wallboard, plaster and/or wood. Methods for finishing seams in wall construction in which the spackling/joint compound is used for finishing the seams.
Who is the assignee on this patent?
Knauf Gips Kg
What technology area does this patent fall under?
Primary CPC classification C04B14/28. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 07 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).