Protection film and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11974452-B2
Application number	US-202016843458-A
Country	US
Kind code	B2
Filing date	Apr 8, 2020
Priority date	Sep 19, 2018
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1:

z ≤(5.1 x +57.4)·ln( y )−(14.7 x +140.5),
where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.

First claim

What is claimed is:

1. A protection film for an electronic device, the protection film comprising:
an adhesive layer including a first surface disposed over an electronic device; and
a film layer including a base layer disposed over a second surface of the adhesive layer,
wherein the thickness of the adhesive layer satisfies Inequality 1:
z ≤(5.1 x+ 57.4)·ln( y )−(14.7 x+ 140.5),  (1)

where z is a thickness of the adhesive layer in terms of micrometers, x is a modulus of the base layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers,
a temperature is about −40 ° C. to about 65 ° C.,
the thickness of the adhesive layer is about 25 micrometers or more, and
the protection film is configured such that the first surface of the adhesive layer of the protection film is directly attached to an object having a modulus of 50 gigapascals or more.

2. The protection film of claim 1 , wherein the base layer has a modulus of about 2 gigapascals to about 9 gigapascals.

3. The protection film of claim 1 , wherein the base layer has a thickness of about 25 micrometers to 75 micrometers.

4. The protection film of claim 1 , wherein a first surface of the base layer is disposed over the second surface of the adhesive layer.

5. The protection film of claim 4 , wherein the film layer further comprises a functional layer which is disposed over a second surface of the base layer.

6. The protection film of claim 1 , wherein the adhesive layer comprises a pressure sensitive adhesive, and the pressure sensitive adhesive has a modulus of about 10 megapascals or less at a temperature of −20 degrees Celsius or lower.

7. The protection film of claim 1 , wherein the adhesive layer comprises a first region in which tensile stress acts and a second region in which compressive stress acts.

8. The protection film of claim 7 , wherein the second region is disposed between the first region and the film layer.

9. The protection film of claim 7 , comprising a folding region, wherein the tensile stress of the first region increases as a distance to the folding region decreases, and the compressive stress of the second region increases as the distance to the folding region decreases.

10. An electronic device comprising:
a body;
a protection film layer which includes a base layer disposed over a first surface of the body; and
an adhesive layer disposed between the body and the base layer,
wherein the thickness of the adhesive layer satisfies Inequality 2:
z ≤(5.1 x+ 57.4)·ln( y )−(14.7 x+ 140.5)  (2)

where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of the base layer in terms of gigapascals, and y is a total thickness of the protection film layer in terms of micrometers,
a temperature is about −40 ° C. to about 65 °C,
the thickness of the adhesive layer is about 25 micrometers or more,
the body comprises at least one member, and
the at least one member of the body is disposed directly on a first surface of the adhesive layer opposite to a second surface of the adhesive layer, the second surface of the adhesive layer faces the base layer, and the at least one member of the body has a modulus of 50 gigapascals or more.

11. The electronic device of claim 10 , wherein the base layer has a modulus of about 2 gigapascals to about 9 gigapascals.

12. The electronic device of claim 10 , wherein the protection film layer further comprises a functional layer which is disposed over the base layer.

13. The electronic device of claim 10 , wherein the body comprises a foldable display device, and
wherein the foldable display device comprises at least one folding region, and the protection film is disposed to overlap the at least one folding region.

14. The electronic device of claim 13 , wherein the foldable display device comprises an organic light emitting display panel.

15. The electronic device of claim 14 , wherein the organic light emitting display panel comprises:
a substrate;
an organic light emitting layer which is disposed over the substrate; and
a cover glass which is disposed over the organic light emitting layer,
wherein the cover glass contacts the adhesive layer.

16. The electronic device of claim 15 , wherein the cover glass has a modulus of 50 gigapascals or more.

17. An electronic device comprising:
a foldable display;
a protection film layer which includes a base layer disposed over a first surface of the foldable display; and
an adhesive layer disposed between the foldable display and the base layer,
wherein the base layer has a modulus of about 2 gigapascals to about 9 gigapascals, and the base layer has a thickness of about 25 micrometers to 75 micrometers,
wherein the adhesive layer has a thickness of about 173 micrometers or less,
wherein the foldable display comprises:
a substrate,
a light emitting layer which is disposed between the substrate and the adhesive layer, and
a cover glass which is disposed between the light emitting layer and the adhesive layer, and

wherein the cover glass has a modulus of 50 gigapascals or more.

18. The electronic device of claim 17 , wherein the foldable display comprises at least one folding region, and the protection film is disposed to overlap the at least one folding region.

Assignees

• Samsung Display Co Ltd

Inventors

• Oh Young Eun
• Shin Jai Ku
• Ryou Han Sun
• Ahn So Dam
• Lee Jang Doo

Classifications

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• C09J7/38 Primary

  Pressure-sensitive adhesives [PSA] · CPC title

• H10K77/111

  Flexible substrates · CPC title

• G06F1/1652

  the display being flexible, e.g. mimicking a sheet of paper, or rollable · CPC title

• H10K59/873 Primary

  Encapsulations · CPC title