Method for manufacturing resin molded product

Patent metadata

Field	Value
Publication number	US-11969922-B2
Application number	US-202017602287-A
Country	US
Kind code	B2
Filing date	Feb 27, 2020
Priority date	Apr 25, 2019
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.

First claim

What is claimed is:

1. A method for manufacturing a resin molded product, comprising:
providing a resin molding apparatus, wherein the resin molding apparatus comprises:
a molding mold;
one mold wedge mechanism; and
one mold cavity block driving mechanism;

wherein
the molding mold comprises: one mold, and an other mold;
the one mold comprises: one mold cavity frame member, and one mold cavity block;
the one mold cavity block is movable in the one mold cavity frame member in a mold opening/closing direction of the molding mold;
one mold cavity is formed by a surface of the one mold cavity block facing the other mold and an inner surface of the one mold cavity frame member;
the one mold cavity block is moved in the mold opening/closing direction by the one mold cavity block driving mechanism;
a position of the one mold cavity block in the mold opening/closing direction is fixed by the one mold wedge mechanism;

setting a height position of the one mold cavity block by moving the one mold cavity block to a preset height position by the one mold cavity block driving mechanism;
after the one mold cavity block having been moved to the height position in a direction away from the other mold, fixing the one mold cavity block by the one mold wedge mechanism;
injecting a resin into the one mold cavity; and
performing a resin molding by changing a depth of the one mold cavity by the one mold wedge mechanism and the one mold cavity block driving mechanism after injecting the resin;
wherein the one mold wedge mechanism includes:
an upper mold first wedge member;
an upper mold second wedge member;
an upper mold wedge member power transmission member; and
an upper mold wedge member driving mechanism,

wherein the upper mold first wedge member is connected to the upper mold wedge member driving mechanism via the upper mold wedge member power transmission member, and
the upper mold first wedge member is configured to be slid in a taper direction of a tapered surface of the upper mold second wedge member by the upper mold wedge member driving mechanism;
wherein the resin molding apparatus further comprises:
one mold cavity block holding member to which the one mold cavity block driving mechanism is connected; and
an upper mold second wedge member holding member,

wherein the one mold cavity block holding member is raised by the one mold cavity block driving mechanism until the one mold cavity block holding member comes into contact with the upper mold second wedge member holding member, so as to fix the position of the one mold cavity block.

2. The method according to claim 1 , wherein
the resin molding apparatus further comprises a plunger, and has a pot capable of accommodating a resin; and
after fixing the one mold wedge mechanism, injecting the resin in the pot into the one mold cavity by the plunger.

3. The method according to claim 2 , further comprising:
pulling the plunger is out in a direction opposite to an inside of the pot, and the one mold cavity block is movable in a direction away from the other mold, so as to make the one mold wedge mechanism operable.

4. The method according to claim 2 , wherein
after setting the height position of the one mold cavity block, injecting the resin in the pot into the one mold cavity by the plunger, moving the one mold cavity block in a direction away from the other mold, and increasing the depth of the one mold cavity.

5. The method according to claim 1 , wherein
after setting the height position of the one mold cavity block, moving the one mold cavity block in a direction approaching the other mold, and reducing the depth of the one mold cavity.

6. The method according to claim 1 , wherein
the resin molding apparatus further comprises a mold clamping mechanism; and
performing a resin molding in a state that the one mold and the other mold are clamped by the mold clamping mechanism.

7. The method according to claim 1 , further comprising:
providing a mold releasing film for covering a cavity surface of the one mold cavity, and
performing a resin molding in a state that the cavity surface is covered by the mold releasing film and an inside of the one mold cavity is filled with the resin.

8. The method according to claim 1 , wherein
in the resin molding, moving the one mold cavity block in a direction approaching the other mold by the one mold cavity block driving mechanism, and
after operating the one mold wedge mechanism, changing the depth of the one mold cavity by moving the one mold cavity block away from the other mold by the one mold cavity block driving mechanism.

9. The method according to claim 1 , further comprising:
providing an object to be molded in the resin molding, and the object to be molded includes a chip fixed to a substrate,
when injecting the resin into the one mold cavity, disposing the preset height position of the one mold cavity block at a position where the one mold cavity block is away from the chip and does not press the chip.

Assignees

• Towa Corp

Inventors

• Okunishi Yoshito
• Ogawa Fuyuhiko

Classifications

• B29C45/02 Primary

  Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity · CPC title

• B29C33/12

  with incorporated means for positioning inserts, e.g. labels {(positioning reinforcements B29C70/541)} · CPC title

• B29C45/021

  Plunger drives; Pressure equalizing means for a plurality of transfer plungers · CPC title

• B29C45/14065

  Positioning or centering articles in the mould · CPC title

• B29C45/36

  having means for locating or centering cores · CPC title