Organic polymer film and manufacturing method thereof

US11969752B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11969752-B2
Application numberUS-202117555289-A
CountryUS
Kind codeB2
Filing dateDec 17, 2021
Priority dateDec 19, 2020
Publication dateApr 30, 2024
Grant dateApr 30, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention discloses an organic polymer film and a manufacturing method thereof. The organic polymer film is mainly manufactured by the following steps. Firstly, the step (A) provides a xylene precursor and a substrate, and the step (B) places the substrate inside of a plasma equipment. After that, the step (C) evacuates the plasma equipment while introducing a carrier gas which carries vapor of the xylene precursor, and the step (D) turns on a pulse power supply system of the plasma equipment, generating a short pulse for plasma ignition. Finally, the step (E) forms the organic polymer film on the substrate. In the aforementioned steps, the frequency of the short pulse plasma is between 1 Hz˜10,000 Hz, and the pulse period of the short pulse plasma is between 1 μs˜60 μs.

First claim

Opening claim text (preview).

What is claimed is: 1. A manufacturing method of an organic polymer film, comprising: (A) providing a xylene precursor and a substrate; (B) placing the substrate inside of a plasma equipment; (C) evacuating the plasma equipment while introducing a carrier gas which carries vapor of the xylene precursor; (D) turning on a pulse power supply system of the plasma equipment, generating a short pulse for plasma ignition; and (E) forming the organic polymer film on the substrate; wherein frequency of the short pulse plasma is between 1 Hz-10,000 Hz; wherein pulse period of the short pulse plasma is between 1 μs and 60 μs; wherein the xylene precursor is selected from the group consisting of the 1,2-Bis(trifluoromethyl)benzene, 1,3-Bis(trifluoromethyl)benzene, and 1,4-Bis(trifluoromethyl)benzene. 2. The manufacturing method of the organic polymer film as claimed in claim 1 , wherein the substrate is polymer material or metal. 3. The manufacturing method of the organic polymer film as claimed in claim 1 , wherein the plasma equipment of the step (B) comprises: a chamber; a gas inlet, connected with the chamber; a gas outlet, connected with the chamber; and wherein the pulse power supply system comprises: an upper electrode and a lower electrode; wherein the upper electrode and the lower electrode are configured inside the chamber; wherein the substrate is placed onto the lower electrode. 4. The manufacturing method of the organic polymer film as claimed in claim 1 , wherein the carrier gas is Ar. 5. The manufacturing method of the organic polymer film as claimed in claim 1 , wherein the frequency of the short pulse plasma is 1,000 Hz. 6. The manufacturing method of the organic polymer film as claimed in claim 1 , wherein the xylene precursor is the 1,4-Bis(trifluoromethyl)benzene. 7. The manufacturing method of the organic polymer film as claimed in claim 6 , wherein the pulse period of the short pulse plasma is 20 μs. 8. The manufacturing method of the organic polymer film as claimed in claim 1 , wherein power of the short pulse plasma is 50 W.

Assignees

Inventors

Classifications

  • B05D1/62Primary

    Plasma-deposition of organic layers (plasma deposition in general C23C14/00, C23C16/00) · CPC title

  • Polyxylylenes · CPC title

  • DC powered · CPC title

  • controlling of the discharge by modulation of energy · CPC title

  • Gas control, e.g. control of the gas flow · CPC title

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What does patent US11969752B2 cover?
The present invention discloses an organic polymer film and a manufacturing method thereof. The organic polymer film is mainly manufactured by the following steps. Firstly, the step (A) provides a xylene precursor and a substrate, and the step (B) places the substrate inside of a plasma equipment. After that, the step (C) evacuates the plasma equipment while introducing a carrier gas which carr…
Who is the assignee on this patent?
Univ Feng Chia
What technology area does this patent fall under?
Primary CPC classification B05D1/62. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 30 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).