Thermally activated retractable EMC protection

Patent metadata

Field	Value
Publication number	US-11968809-B2
Application number	US-202318356385-A
Country	US
Kind code	B2
Filing date	Jul 21, 2023
Priority date	Oct 22, 2021
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

A system and a method of providing electromagnetic compatibility (EMC) protection. A removable component is inserted into an end product. The removable component includes a retractable EMC protection apparatus. In response to the insertion of the removable component a shape memory alloy on the EMC protection apparatus is heated to a temperature above the activation temperature of the shape memory alloy. The shape memory alloy then changes from a first shape to a second shape in response to the heating. In response to the change in the shape of the shape memory alloy an EMC protection component of the EMC protection apparatus is inserted into an enclosure opening of the removable component.

First claim

What is claimed is:

1. A method of providing electromagnetic compatibility (EMC) protection comprising:
inserting a removable component into an end product, the removable component including a retractable EMC protection apparatus;
heating a shape memory alloy on the EMC protection apparatus to a temperature above an activation temperature of the shape memory alloy;
changing, by the shape memory alloy, from a first shape to a second shape; and
in response to changing from a first shape to a second shape, inserting an EMC protection component into an enclosure opening of the removable component to form an EMC seal.

2. The method of claim 1 wherein heating further comprises:
activating a heating pad on the EMC protection apparatus, wherein the heating pad is in contact with the shape memory alloy.

3. The method of claim 1 further comprising:
operating the removable component to generate operating heat; and
wherein the operating heat is sufficient to heat the shape memory alloy to a temperature above the activation temperature.

4. The method of claim 1 further comprising:
wiping the EMC protection device against the enclosure opening and an adjacent surface through the enclosure opening during inserting.

5. The method of claim 1 wherein the EMC protection device is compressed in response to inserting.

6. The method of claim 5 wherein the EMC protection device is compressed between 30% and 70% of an original height of the EMC protection device.

Assignees

• IBM

Inventors

• Werner John S
• Singer Noah
• Connor Samuel R

Classifications

• H05K7/20836 Primary

  Thermal management, e.g. server temperature control · CPC title

• H05K5/00

  Casings, cabinets or drawers for electric apparatus · CPC title

• H05K7/20009

  using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K9/0009

  with provisions to reduce EMI leakage through the joining parts · CPC title

• H05K9/0015 Primary

  Gaskets or seals · CPC title