Heater apparatus-integrated bezel for a computing device

Patent metadata

Field	Value
Publication number	US-11968808-B2
Application number	US-202217576742-A
Country	US
Kind code	B2
Filing date	Jan 14, 2022
Priority date	Jan 14, 2022
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

A computing device includes a bezel and an enclosure. The bezel includes a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure.

First claim

What is claimed is:

1. A computing device, comprising:
a bezel, wherein the bezel comprises a heater apparatus;
an environmental control component; and
an enclosure, wherein the enclosure comprises a plurality of hardware components,
wherein the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure,
wherein the environmental control component alters a characteristic of the volume of air, wherein the characteristic of the volume of air comprises at least one selected from a group consisting of an airflow direction of the volume of air, a humidity level of the volume of air, and a temperature level of the volume of air.

2. The computing device of claim 1 , wherein the heater apparatus comprises a heater.

3. The computing device of claim 2 , wherein the heater apparatus comprises a heat sink, wherein the heat sink, when heated by the heater, transfers thermal energy to the volume of air entering the enclosure.

4. The computing device of claim 1 , wherein a first end of a connector is affixed to the bezel and a second end of the connector is located in the enclosure, wherein the bezel receives power via the connector.

5. The computing device of claim 4 , wherein the connector is a blind-mate power connector or a magnetic power connector.

6. The computing device of claim 1 , further comprising:
a heater control component configured to control the bezel.

7. The computing device of claim 6 , further comprising:
a temperature sensor operatively connected to the heater control component and configured to detect a temperature within the enclosure,
wherein the heater control component is configured to control the bezel based on the temperature within the enclosure.

8. The computing device of claim 6 , further comprising:
a temperature sensor, located within the bezel, operatively connected to the heater control component and configured to detect a temperature within the bezel,
wherein the heater control component is configured to control the bezel based on the temperature within the bezel.

9. The computing device of claim 6 , wherein the heater control component is located within the enclosure.

10. An information handling system, comprising:
a cabinet housing a plurality of computing devices;
the plurality of computing devices, wherein each of the computing devices comprises:
a bezel, wherein the bezel comprises a heater apparatus;
an environmental control component; and
an enclosure, wherein the enclosure comprises a plurality of hardware components, wherein the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure,
wherein the environmental control component alters a characteristic of the volume of air, wherein the characteristic of the volume of air comprises at least one selected from a group consisting of an airflow direction of the volume of air, a humidity level of the volume of air, and a temperature level of the volume of air.

11. The information handling system of claim 10 , wherein the heater apparatus comprises a heater.

12. The information handling system of claim 11 , wherein the heater apparatus comprises a heat sink, wherein the heat sink, when heated by the heater, transfers thermal energy to the volume of air entering the enclosure.

13. The information handling system of claim 10 , wherein a first end of a connector is affixed to the bezel and a second end of the connector is located in the enclosure, wherein the bezel receives power via the connector.

14. The information handling system of claim 13 , wherein the connector is a blind-mate power connector or a magnetic power connector.

15. The information handling system of claim 10 , wherein each of the computing devices further comprises:
a heater control component configured to control the bezel.

16. The information handling system of claim 15 , wherein each of the computing devices further comprises:
a temperature sensor operatively connected to the heater control component and configured to detect a temperature within the enclosure,
wherein the heater control component is configured to control the bezel based on the temperature within the enclosure.

17. The information handling system of claim 15 , wherein each of the computing devices further comprises:
a temperature sensor, located within the bezel, operatively connected to the heater control component and configured to detect a temperature within the bezel,
wherein the heater control component is configured to control the bezel based on the temperature within the bezel.

18. The information handling system of claim 15 , wherein the heater control component is located within the enclosure.

19. A method for heating at least a volume of air entering a computing device, comprising:
determining a heating condition of the computing device, wherein the computing device comprises at least a bezel, an environmental control component, and an enclosure, wherein the bezel comprises a heater apparatus,
wherein the bezel is affixed to a frontside of the enclosure and configured to heat at least the volume of air entering the computing device,
wherein the environmental control component alters a characteristic of the volume of air, wherein the characteristic of the volume of air comprises at least one selected from a group consisting of an airflow direction of the volume of air, a humidity level of the volume of air, and a temperature level of the volume of air; and

in response to determination, initiating heating of at least the volume of air entering the computing device using the heater apparatus, wherein the heater apparatus comprises a heater.

20. The method of claim 19 , wherein the heater apparatus comprises a heat sink, wherein the heat sink, when heated by the heater, transfers thermal energy to the volume of air entering the enclosure.

Assignees

• Dell Products Lp

Inventors

• Tunks Eric Michael
• Nikazm Ayedin
• Eiland Richard Mark
• Duncan Tyler Baxter

Classifications

• H05K7/20836 Primary

  Thermal management, e.g. server temperature control · CPC title

• F24H3/02 Primary

  with forced circulation · CPC title

• F24H15/204

  Temperature of the air before heating · CPC title

• H05K7/20736

  within cabinets for removing heat from server blades · CPC title