Wireless communication board and electronic device having same

US11968783B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11968783-B2
Application numberUS-202217653601-A
CountryUS
Kind codeB2
Filing dateMar 4, 2022
Priority dateSep 6, 2019
Publication dateApr 23, 2024
Grant dateApr 23, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the surface mounting technology; and a wire connection connected to the wireless communication part and power supply and connected to the main board by means of a wire, wherein the main board comprises a main processor for controlling the operation of an electronic device.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device comprises: a main board; and a wireless communication board connected to the main board, wherein the main board comprises: a main circuit board; a main processor disposed on the main circuit board and configured to control the electronic device; a communication connection provided on the main circuit board and connected to the wireless communication board; and a main power supply disposed on the main circuit board and configured to supply power to the main processor and the wireless communication board, wherein the wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply disposed on the communication board and configured to supply power to the wireless communication part; a surface mounting pad connected to the wireless communication part and the power supply, formed on the communication board disposed on the main board by surface mounting technology; and a wire connection connected to the wireless communication part and the power supply, provided on the communication board connected to the main board with a wire, and wherein the communication connection of the main board is formed to correspond to one of the surface mounting pad and the wire connection of the wireless communication board. 2. The electronic device of claim 1 , wherein: the communication connection of the main board is formed as a plurality of pads corresponding to a plurality of pads of the surface mounting pad of the wireless communication board, and the wireless communication board is disposed on the communication connection of the main board by surface mounting technology. 3. The electronic device of claim 1 , wherein: the communication connection of the main board includes a connector corresponding to a connector forming the wire connection of the wireless communication board. 4. The electronic device of claim 3 , wherein: the wireless communication board includes a connection wire provided with connectors corresponding to the connector of the main board and the connector of the wireless communication board at both ends thereof and connecting the connector of the main board and the connector of the wireless communication board. 5. The electronic device of claim 4 , wherein: the connector forming the wire connection of the wireless communication board includes a plurality of signal transmission terminals connected to the wireless communication part, and a power terminal and a ground terminal connected to the power supply. 6. The electronic device of claim 1 , wherein: the surface mounting pad of the wireless communication board includes a plurality of signal transmission pads connected to the wireless communication part and a power pad and a ground pad connected to the power supply. 7. The electronic device of claim 1 , wherein: the main board includes a main short-range communication part connected to the main processor, and the communication connection of the main board is connected to the main power supply. 8. The electronic device of claim 7 , wherein: the wireless communication board further comprises a short-range communication part that is connected to the wireless communication part and is configured to wirelessly communicate with the main short-range communication part, the surface mounting pad of the wireless communication board includes a power pad and a ground pad connected to the power supply, and the wire connection of the wireless communication board includes a connector connected to the power supply. 9. The electronic device of claim 8 , wherein the short-range communication part comprises a radio frequency identification RFID, near field communication NFC, and infrared ray communication. 10. The electronic device of claim 1 , wherein the wire connection of the wireless communication board comprises a plurality of contacts and connector couplings provided on an edge of the communication board. 11. The electronic device of claim 10 , wherein: the wireless communication board includes a board insertion connector including a plurality of corresponding contacts that are in contact with the plurality of contacts of the wire connection and corresponding coupling parts coupled to the connector couplings, and wherein the edge of the communication board is inserted into the board insertion connector so that the board insertion connector is connected to the wire connection. 12. The electronic device of claim 1 , wherein the wireless communication part comprises Wi-Fi, Zig bee, Z-wave, and Bluetooth. 13. An electronic device comprises: a main board; and a wireless communication board connected to the main board, wherein the main board comprises: a main circuit board; a main processor disposed on the main circuit board and configured to control the electronic device; a communication connection provided on the main circuit board and connected to the wireless communication board; and a main power supply disposed on the main circuit board and configured to supply power to the main processor and the wireless communication board, wherein the wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply disposed on the communication board and configured to supply power to the wireless communication part; a short-range communication part connected to the wireless communication part and configured to wirelessly transmit and receive a signal to and from a main short-range communication part provided on the main board; a surface mounting pad connected to the power supply, the surface mounting pad disposed on the main board by surface mounting technology; and a wire connection connected to the power supply, the wire connection configured to be connected to the main board by a wire. 14. The electronic device of claim 13 , wherein the surface mounting pad comprises a plurality of pads provided on a surface of the communication board. 15. The electronic device of claim 14 , wherein the plurality of pads comprises signal transmission pads and power supply pads. 16. The electronic device of claim 13 , wherein the communication connection of the main board includes a connector corresponding to a connector forming the wire connection of the wireless communication board. 17. The electronic device of claim 16 , wherein the connector comprises signal transmission terminals and power supply terminals. 18. The electronic device of claim 16 , wherein: the wireless communication board includes a connection wire provided with connectors corresponding to the connector of the main board and the connector of the wireless communication board at both ends thereof and connecting the connector of the main board and the connector of the wireless communication board. 19. The electronic device of claim 13 , wherein the wire connection comprises a plurality of contacts and connector couplings provided on an edge of the communication board. 20. The electronic device of claim 19 , wherein the wireless communication board further comprises a board insertion connector including a plurality of corresponding contacts that are in contact with the plurality of contacts of the wire connection and corresponding coupling parts coupled to the connector couplings, and wherein the edge of the communication board is inserted into the board insertion connector so that the board insertion connector is connected to

Assignees

Inventors

Classifications

  • H05K1/144Primary

    Stacked arrangements of planar printed circuit boards · CPC title

  • connecting to other rigid printed circuits or like structures · CPC title

  • surface mounting terminals · CPC title

  • Coupling device supported only by cooperation with PCB · CPC title

  • Intermediate parts for linking two coupling parts, e.g. adapter (with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94) · CPC title

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What does patent US11968783B2 cover?
A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the …
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/144. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).