Antenna module and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11967759-B2
Application number	US-202217990778-A
Country	US
Kind code	B2
Filing date	Nov 21, 2022
Priority date	Jul 17, 2019
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

Disclosed is an antenna module including a first printed circuit board (PCB) including a first surface facing a first direction and a second surface facing a second direction opposite the first direction, a second PCB including a third surface facing the first direction spaced from the first PCB and a fourth surface facing the second direction spaced from the first surface, a radio frequency integrated circuit (RFIC) disposed on the first surface, and a connection member comprising a conductive material connecting the first surface to the fourth surface. The at least one first conductive pattern is connected to the RFIC. The at least one third conductive pattern is connected to the RFIC via the connection member. The at least one first conductive pattern and the at least one third conductive pattern at least partially overlap with each other at least partly, when viewed from above the second surface.

First claim

What is claimed is:

1. An electronic device comprising:
a first printed circuit board (PCB);
a second PCB spaced from the first PCB;
at least one first patch antenna element disposed on a first surface of the first PCB;
at least one second patch antenna element disposed on at least one surface of the second PCB;
a radio frequency integrated circuit (RFIC) disposed on a second surface of the first PCB; and
an interposer disposed between at least the first PCB and the second PCB, and configured to electrically connect the RFIC to the at least one second patch antenna.

2. The electronic device of claim 1 ,
wherein a first connection terminal connected to the interposer is disposed on the first PCB, and
wherein a second connection terminal connected to the interposer PCB is disposed on the second PCB.

3. The electronic device of claim 1 , wherein the at least one second patch antenna is configured as an antenna array.

4. The electronic device of claim 1 , comprising a housing including a front plate and a rear plate, and wherein:
the first PCB, the second PCB, and the interposer PCB are disposed in the housing; and
the RFIC is configured to feed the at least one first patch antenna to radiate a beam through the rear plate.

5. The electronic device of claim 1 , comprising a heat radiator configured to radiate heat generated in the second PCB, the heat radiator at least partially disposed in a first partial region of the second PCB.

6. An electronic device, comprising:
a first printed circuit board (PCB);
a second PCB spaced from the first PCB;
at least one radiator disposed on at least one surface of the second PCB;
a radio frequency integrated circuit (RFIC) disposed on at least one of the first PCB and the second PCB;
an interposer PCB disposed between at least the first PCB and the second PCB, and configured to electrically connect the RFIC to the at least one radiator;
a heat radiator configured to radiate heat generated in the second PCB, the heat radiator at least partially disposed in a first partial region of the second PCB;
a ground at least partially disposed in a second partial region of the second PCB, and spaced from the at least one radiator; and
a fillcut interposed between at least the heat radiator and the ground.

7. An electronic device comprising:
a first printed circuit board (PCB);
a second PCB spaced from the first PCB;
a connection member, comprising a connector, connecting the first PCB and the second PCB;
a radio frequency integrated circuit (RFIC) disposed on a first surface of the first PCB;
at least one first patch radiator disposed on a second surface of the first PCB; and
at least one second patch radiator disposed on the second PCB and electrically connected to the RFIC via at least the connection member, wherein the RFIC is configured to feed the at least one first and second patch radiators.

8. The electronic device of claim 7 , wherein the connection member includes a flexible printed circuit board and/or an interposer PCB.

9. The electronic device of claim 7 , wherein the at least one first patch radiator includes a plurality of radiators configured as an antenna array.

10. The electronic device of claim 7 , wherein the at least one second patch radiator includes a plurality of radiators configured as an antenna array.

11. The electronic device of claim 7 , wherein the RFIC is configured to:
feed the at least one first patch radiator to radiate a beam in a first direction; and
feed the at least one second patch radiator to radiate a beam in a second direction different from the first direction.

12. The electronic device of claim 11 , wherein the first direction is substantially perpendicular to the second direction.

13. The electronic device of claim 11 , wherein the first direction is substantially opposite to the second direction.

14. The electronic device of claim 11 , comprising a housing including a front plate, a rear plate, and a side member between at least the front plate and the rear plate, and wherein the RFIC is configured to feed the at least one first patch radiator to radiate a beam in the first direction through the rear plate.

15. The electronic device of claim 14 , wherein the RFIC is configured to feed the at least one second patch radiator to radiate a beam in the second direction through the front plate.

16. The electronic device of claim 14 , wherein the RFIC is configured to feed the at least one second patch radiator to radiate a beam in the second direction through the side member.

17. The electronic device of claim 1 , wherein the RFIC is disposed between the first PCB and the second PCB.

18. The electronic device of claim 7 , wherein the RFIC is disposed between the first PCB and the second PCB.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Soon
• Kim Yeonwoo
• Lee Haekwon
• Lee Woosup
• Na Hyoseok

Classifications

• H10W44/248

  for antennas · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title