Metal back plate and manufacturing process thereof, backlight module and electronic device

Patent metadata

Field	Value
Publication number	US-11966074-B2
Application number	US-202117334429-A
Country	US
Kind code	B2
Filing date	May 28, 2021
Priority date	Sep 29, 2020
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

The present disclosure provides a metal back plate and a manufacturing process thereof, a backlight module and an electronic device. The metal back plate is used for the backlight module. The metal back plate includes a first area and a second area. The grain size of the metal material in the first area is larger than the grain size of the metal material in the second area. The first area is formed with a first opening.

First claim

What is claimed is:

1. A metal back plate for a backlight module, comprising:
a first area and a second area, wherein grain size of a first metal material in the first area is larger than a grain size of a second metal material in the second area, and the first area is formed with a first opening that penetrates in a thickness direction of the metal back plate, and the second area has no openings;
wherein both the first metal material in the first area and the second metal material in the second area comprise an aluminum-magnesium alloy.

2. The metal back plate according to claim 1 , wherein the aluminum-magnesium alloy in the first area comprises an O-state aluminum-magnesium alloy, and the aluminum-magnesium alloy in the second area comprises an H38-state aluminum-magnesium alloy.

3. The metal back plate according to claim 1 , wherein the first area is connected to the second area.

4. The metal back plate according to claim 1 , wherein a ratio of a width of the first area to a width of the second area is in a range of 1:6 to 1:3.

5. A process for manufacturing the metal back plate according to claim 1 , comprising:
obtaining a metal substrate comprising a first section and a second section;
placing the second section in annealing equipment to perform a first annealing treatment, while the first section remains outside the annealing equipment; and
performing a cutting and punching treatment on the metal substrate after the first annealing treatment, such that at least part of the second section forms the second area of the metal back plate, at least part of the first section is used as the first area of the metal back plate, and a first opening is formed in the first area to obtain the metal back plate.

6. The process according to claim 5 , wherein the annealing equipment comprises a salt bath furnace containing potassium nitrate or molten lead at a temperature between 350° C. and 550° C.

7. The process according to claim 5 , wherein the first annealing treatment is performed for 2 s to 180 s.

8. The process according to claim 5 , wherein obtaining the metal substrate comprises:
obtaining an aluminum-magnesium alloy plate; and
performing a hot rolling treatment, a first cold rolling treatment, a second annealing treatment, a second cold rolling treatment, a third annealing treatment, a third cold rolling treatment, a straightening and trimming treatment and a cleaning treatment sequentially on the aluminum-magnesium alloy plate to obtain the metal substrate.

9. The process according to claim 8 , wherein the hot rolling treatment is performed at a temperature of 400° C. to 500° C.

10. The process according to claim 8 , wherein the second annealing treatment is performed at a temperature of 350° C. to 370° C.

11. The process according to claim 8 , wherein the third annealing treatment is performed at a temperature of 380° C. to 450° C.

12. A backlight module, comprising:
a backlight layer comprising a light-emitting surface and a back surface opposite to the light-emitting surface, wherein the backlight layer is formed with a second opening; and
the metal back plate according to claim 1 , arranged on a back side of the backlight layer, wherein the first opening and the second opening are coaxial.

13. The backlight module according to claim 12 , wherein an aperture size of the first opening is smaller than that of the second opening.

14. The backlight module according to claim 12 , wherein an aperture size of the first opening is equal to that of the second opening.

15. The backlight module according to claim 12 , wherein the first opening is sleeved in the second opening.

16. An electronic device, comprising:
a display layer comprising a display surface and a back surface opposite to the display surface;
the backlight module according to claim 12 disposed on the back surface of the display layer, wherein the light-emitting surface of the backlight layer in the backlight module faces the back surface of the display layer; and
a camera module arranged on a side of the backlight module away from the display layer, wherein the camera module is opposite to the first opening of the metal back plate.

17. The electronic device according to claim 16 , wherein at least part of the camera module extends into the first opening.

18. The electronic device according to claim 16 , wherein the camera module is a front camera module.

Assignees

• Beijing Xiaomi Mobile Software Co Ltd

Inventors

• Wang Zheng

Classifications

• G02B6/0081 Primary

  Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging · CPC title

• B23P15/00

  Making specific metal objects by operations not covered by a single other subclass or a group in this subclass · CPC title

• C21D8/02

  during manufacturing of plates or strips (C21D8/12 takes precedence) · CPC title

• C22F1/047

  of alloys with magnesium as the next major constituent · CPC title

• C21D9/46 Primary

  for sheet metals · CPC title