Acrylic resin, producing method thereof, resin composition set, heat storage material, and article

US11965048B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11965048-B2
Application numberUS-201917261877-A
CountryUS
Kind codeB2
Filing dateJun 27, 2019
Priority dateJul 25, 2018
Publication dateApr 23, 2024
Grant dateApr 23, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2): [in the formula (1), R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group having 12-30 carbon atoms] [in the formula (2), R 3 and R 5 each independently represent a hydrogen atom or a methyl group, and R 4 represents a divalent organic group].

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat storage material-lining a cured product of a mixture containing a first liquid and a second liquid in a resin composition set, wherein the resin composition set comprises: the first liquid containing an oxidizing agent and the second liquid containing a reducing agent, wherein at least one of the first liquid and the second liquid contains an acrylic resin, the acrylic resin contains a first structural unit represented by the following Formula (1) and a second structural unit represented by the following Formula (2): [in the formula, R 1 represents a hydrogen atom or a methyl group and R 2 represents an alkyl group having 12 to 30 carbon atoms] [in the formula, R 3 and R 5 each independently represent a hydrogen atom or a methyl group, and R 4 represents a group represented by the following Formulae (5) or (8)] [in the formula, R 10 , R 11 , R 16 and R 17 each independently represent a divalent hydrocarbon group, and * represents a bond]. 2. The heat storage material according to claim 1 , wherein the alkyl group represented by R 2 is a tetradecyl group, a hexadecyl group, an octadecyl group, a docosyl group, a tetracosyl group, a hexacosyl group, or an octacosyl group. 3. The heat storage material according to claim 1 , wherein a content of the first structural unit is 70 parts by mass or more and 98 parts by mass or less, with respect to 100 parts by mass of all structural units constituting the acrylic resin. 4. The heat storage material according to claim 3 , wherein a content of the second structural unit is 2 parts by mass or more and 20 parts by mass or less, with respect to 100 parts by mass of all structural units constituting the acrylic resin. 5. An article, comprising: a heat source; and the heat storage material according to claim 1 that is provided so that the heat storage material is in thermal contact with the heat source.

Assignees

Inventors

Classifications

  • Polymers of unsaturated carboxylic acids or derivatives thereof · CPC title

  • C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate · CPC title

  • C12-(meth)acrylate, e.g. lauryl (meth)acrylate · CPC title

  • C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate · CPC title

  • of polyhydric alcohols or phenols {, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate} · CPC title

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Frequently asked questions

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What does patent US11965048B2 cover?
An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2): [in the formula (1), R 1 represents a hydrogen atom or a methyl group, and R 2 r…
Who is the assignee on this patent?
Showa Denko Materials Co Ltd, Resonac Corp
What technology area does this patent fall under?
Primary CPC classification C08F290/126. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).