Systems and methods for laser diode array having integrated microchannel cooling

Patent metadata

Field	Value
Publication number	US-11962129-B2
Application number	US-202117227132-A
Country	US
Kind code	B2
Filing date	Apr 9, 2021
Priority date	Apr 9, 2021
Publication date	Apr 16, 2024
Grant date	Apr 16, 2024

Abstract

The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.

First claim

What is claimed is:

1. A laser diode system comprising:
at least one substrate having a laser diode emitter supported on a surface of the at least one substrate, the laser diode emitter emitting a laser beam from a facet at one end of the laser diode emitter, along an axis parallel to the surface of the at least one substrate;
a cooling subsystem disposed in contact with the surface of the at least one substrate of the laser diode emitter, and being independent of the substrate the cooling subsystem including a plurality of cooling fins spaced laterally of the substrate and forming a plurality of elongated cooling channels for circulating a cooling fluid therethrough to cool the laser diode emitter and the at least one substrate supporting the laser diode emitter; and
wherein the cooling fluid also flows over the facet of the laser diode emitter.

2. The system of claim 1 , further comprising:
a container for containing the laser diode emitter and the cooling subsystem; and
wherein the container is filled with the cooling fluid to fully submerge the laser diode emitter such that the facet is below an upper level of the cooling fluid.

3. The system of claim 2 , wherein the cooling channels are configured such that the cooling fluid flows over the facet first, and then through each of the cooling channels.

4. The system of claim 1 , wherein the elongated channels each run a full length of the at least one substrate of the laser diode emitter.

5. The system of claim 4 , wherein the cooling fins are in contact with an emitter-side of the substrate, and wherein the at least one substrate helps to form the cooling channels.

6. The system of claim 1 , wherein the cooling subsystem includes a base portion in contact with the substrate of the laser diode emitter, and the cooling fins project from the base portion and parallel to a major length of the laser diode emitter.

7. The system of claim 6 , wherein the base portion and the cooling fins comprise a single monolithic component.

8. The system of claim 7 , wherein the base portion is bonded to an emitter-side of the substrate.

9. The system of claim 6 , wherein the cooling channels each form a U-shape within the base portion.

10. The system of claim 1 , wherein the cooling fins each have a thickness of between about 10 microns and 50 microns.

11. The system of claim 1 , wherein the cooling channels each have a thickness of between about 10 microns and 100 microns.

12. The system of claim 1 , wherein the cooling subsystem is manufactured as a single monolithic section from at least one of Silicon, Silicon-Carbide, Copper-Tungsten, Copper-Diamond, or Gallium Arsenide.

13. A laser diode system comprising:
a laser diode substrate having a plurality of laser diode emitters supported on the laser diode substrate, and a facet at one end of each one of said plurality of said laser diode emitter from which a laser beam is emitted;
a cooling subsystem in contact with the plurality of laser diode emitters and including a base portion and a plurality of cooling fluid flow channels formed by a plurality of elongated fins projecting outwardly from the base portion, the plurality of elongated fins being sufficient in number to span substantially a full width of all of the plurality of laser diode emitters and being laterally spaced apart from the laser diode substrate;
the plurality of cooling fluid flow channels configured to circulate a cooling fluid therethrough to cool the plurality of laser diode emitters and the laser diode substrate on which the plurality of laser diode emitters is mounted; and
wherein the cooling fluid flows over the facet of each one of the plurality of laser diode emitters.

14. The system of claim 13 , wherein the base portion is in contact with the substrate of each of the plurality of laser diode emitters.

15. The system of claim 14 , wherein the base portion and the plurality of elongated fins are formed from at least one of Silicon, Silicon Carbide, Tungsten-Copper, Copper-Diamond, or Gallium Arsenide.

16. The system of claim 13 , wherein each one of the plurality of elongated fins project perpendicularly away from the substrates of the plurality of laser diode emitters.

17. The system of claim 16 , further comprising projecting fingers which project between each pair of adjacent cooling fins, which increase an area of contact with the cooling fluid flowing between each said pair of adjacent cooling fins.

18. The system of claim 13 , wherein a tip of each one of the plurality of elongated fins is in contact with the substrates of the plurality of laser diode emitters.

19. The system of claim 18 , wherein each of the tips are mechanically and electrically coupled to the substrate, and the substrate helps to form the plurality of cooling fluid flow channels.

20. A method for cooling a laser diode system, the method comprising:
providing a substrate, a laser diode emitter supported on a surface of the substrate, and a facet at one end of the laser diode emitter from which a laser beam is emitted;
arranging a cooling subsystem in contact with the surface of the substrate of the laser diode emitter;
flowing a cooling fluid through elongated channels formed between fins of the cooling subsystem, where the fins project from a base portion of the cooling subsystem and are spaced laterally apart from the substrate; and
wherein the cooling fluid flows over the facet of the at least one laser diode emitter and into the elongated channels.

21. The method of claim 20 , further comprising placing the base portion of the cooling subsystem against the surface of the substrate.

22. A laser diode system comprising:
a substrate having a laser diode emitter supported on a surface of the substrate, the laser diode emitter emitting a laser beam from a facet at one end of the laser diode emitter, along an axis parallel to the surface of the substrate;
a cooling subsystem disposed in contact with the surface of the substrate of the laser diode emitter, the cooling subsystem including a plurality of cooling elements projecting outwardly and helping to at least partially define a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter and the substrate supporting the laser diode emitter, and the plurality of elongated channels further being laterally spaced apart from the substrate; and
wherein the cooling fluid also flows over the facet of the laser diode emitter.

Assignees

• L Livermore Nat Security Llc
• Univ Colorado State Res Found

Inventors

• Kotovsky Jack
• Baxamusa Salmaan H
• Frye Clint D
• Ladner Ian Seth
• Spinka Thomas M
• Funaro Devin Joseph
• Hobby David Ryan
• Anderson Caleb Del
• Bandhauer Todd

Classifications

• H01S5/4025 Primary

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S5/02423 Primary

  Liquid cooling, e.g. a liquid cools a mount of the laser · CPC title

• H01S5/405

  Two-dimensional arrays · CPC title

• H01S5/02492

  CuW heat spreaders · CPC title