Sintered material, connection structure, composite particle, joining composition, and method for manufacturing sintered material

Patent metadata

Field	Value
Publication number	US-11961815-B2
Application number	US-201816485558-A
Country	US
Kind code	B2
Filing date	Feb 20, 2018
Priority date	Feb 20, 2017
Publication date	Apr 16, 2024
Grant date	Apr 16, 2024

Abstract

A sintered material excellent in thermal stress and bonding strength; a connection structure containing the sintered material; a composition for bonding with which the sintered material can be produced; and a method for producing the sintered material. The sintered material has a base portion, buffer portions, and filling portions. The buffer portions and filling portions are dispersed in the base portion. The base portion is a metal sintered body, each buffer portion is formed from a pore and/or material that is not the same as the sintered body, and each filling portion is formed from particles and/or fibers. The sintered material satisfies A>B. A is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material. B is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material from which the filling portions are removed.

First claim

The invention claimed is:

1. A sintered material comprising
1) a base portion, the base portion being a metal sintered body,
2) one or more buffer portions, and
3) one or more filling portions,
wherein the one or more buffer portions and the one or more filling portions are dispersed in the base portion,
wherein each of the one or more buffer portions is formed from at least one of a pore and a material that is not the same as that of the metal sintered body,
wherein each of the one or more filling portions is formed from at least one of particles and fibers,
wherein the sintered material has a value of A that is 0.2 or more,
wherein A is a kurtosis of volume distribution of the base portion in a three-dimensional image of an entirety of the sintered material,

wherein each of the one or more filling portions is formed from a composite having a structure in which a colloid catalyst or a sintering accelerator is placed on base particles,
wherein the base particles are resin particles or organic-inorganic hybrid particles,
wherein the base particles have a 10% K value of 10 N/mm 2 or more and 3000 N/mm 2 or less, and
wherein the base particles have a coefficient of variation (CV value) of the particle diameter of 40% or less, and

wherein each of the one or more filing portions is present so that a part or all of the surface thereof is in contact with the base portion through chemical bonding.

2. The sintered material according to claim 1 , wherein the content of the filling portions is 0.01 wt % or more and 10 wt % or less.

3. The sintered material according to claim 1 , wherein the closest distance between the filling portions is 1 μm or more and 10 μm or less.

4. A connection structure comprising the sintered material according to claim 1 in a connection part.

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Nomoto Hiroyuki
• Sasadaira Masao

Classifications

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07341

  Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title