Method and apparatus for controlling stress variation in a material layer formed via pulsed DC physical vapor deposition

Patent metadata

Field	Value
Publication number	US-11961722-B2
Application number	US-202218074496-A
Country	US
Kind code	B2
Filing date	Dec 4, 2022
Priority date	Apr 20, 2017
Publication date	Apr 16, 2024
Grant date	Apr 16, 2024

Abstract

A method and apparatus are for controlling stress variation in a material layer formed via pulsed DC physical vapour deposition. The method includes the steps of providing a chamber having a target from which the material layer is formed and a substrate upon which the material layer is formable, and subsequently introducing a gas within the chamber. The method further includes generating a plasma within the chamber and applying a first magnetic field proximate the target to substantially localise the plasma adjacent the target. An RF bias is applied to the substrate to attract gas ions from the plasma toward the substrate and a second magnetic field is applied proximate the substrate to steer gas ions from the plasma to selective regions upon the material layer formed on the substrate.

First claim

What is claimed is:

1. An apparatus for controlling stress variation in a material layer formed via pulsed DC physical vapour deposition, the apparatus comprising:
a chamber for housing a target from which the material layer is formed and a substrate upon which the material layer is formable, the chamber comprising an inlet for introducing a gas into the chamber;
a platen disposed in the chamber, wherein the platen defines a recess at an outer surface of the platen that is exposed to the chamber;
a plasma generating arrangement for generating a plasma within the chamber, wherein the plasma generating arrangement includes an anode ring disposed in the chamber;
a DC power supply configured to apply pulsed DC power between the target and the anode ring;
a voltage source for applying an RF bias voltage to the substrate that generates an electric field directed substantially perpendicular to the substrate;
a first magnetic field generating arrangement configured to in use generate a first magnetic field proximate the target for localising the plasma adjacent the target; and
a second magnetic field generating arrangement disposed in the recess of the platen extending in a direction substantially parallel with a plane of a flat surface of the substrate for generating in use a second magnetic field proximate the substrate that does not substantially interact with any other magnetic fields remote from the platen to steer gas ions from the plasma to selective regions upon the material layer formed on the substrate, wherein the second magnetic field generating arrangement comprises a plurality of magnets configured as an array, and wherein the plurality of magnets are disposed in elongate channels that extend across an upper surface of a cassette in a parallel configuration,
wherein the gas ions steered by the second magnetic field are substantially unaffected by the first magnetic field, and wherein an ion density of the plasma where the electric field and the second magnetic field are perpendicularly oriented is increased compared to where the electric field and the second magnetic field are not perpendicularly oriented.

2. The apparatus according to claim 1 , wherein the second magnetic field generating arrangement is disposed at a side of the substrate which is opposite a side of the substrate facing the plasma.

3. The apparatus according to claim 1 , further comprising means for rotating the second magnetic field generating arrangement relative to the substrate.

4. The apparatus according to claim 1 , wherein the means for rotating the second magnetic field comprises a spindle rotationally coupled with the cassette.

5. The apparatus according to claim 4 , wherein the spindle and cassette are rotationally driven via a motor.

6. The apparatus according to claim 1 , wherein the plurality of magnets are arranged in an array having rotational symmetry.

7. The apparatus according to claim 6 , wherein, in use, a centre of the array is configured to extend adjacent a centre of the substrate.

8. The apparatus according to claim 6 , wherein north-south axes of the magnets of the array extend substantially parallel to each other.

9. The apparatus according to claim 6 , wherein the north-south axes extend substantially perpendicular to the substrate.

10. The apparatus according to claim 1 , wherein a magnetic pole disposed adjacent the substrate is the same for each magnet.

11. The apparatus according to claim 1 , wherein magnetic poles disposed adjacent the substrate for adjacent magnets of the array are different poles.

12. The apparatus according to claim 1 , wherein the material layer is compacted using the plasma such that the stress variation in a center of the substrate is within 400 MPa of a periphery of the substrate.

13. The apparatus according to claim 1 , wherein the target and the platen are coaxial.

14. The apparatus according to claim 1 , wherein the target and the substrate are coaxial.

15. The apparatus according to claim 1 , wherein the first magnetic field generating arrangement is disposed outside of the chamber.

16. The apparatus according to claim 1 , wherein a magnetic pole alternates between a north pole and a south pole across an outermost edge of the cassette for the plurality of magnets.

17. The apparatus according to claim 1 , wherein the chamber houses only one of the target.

Assignees

• Spts Technologies Ltd
• Spts Technologies Ltd

Inventors

• Wilby Anthony
• Burgess Steve
• Moncrieff Ian
• Widdicks Clive
• Haymore Scott
• Hyndman Rhonda

Classifications

• H10P14/69391

  the material containing aluminium, e.g. Al2O3 · CPC title

• H10P14/6329

  using physical ablation of a target, e.g. physical vapour deposition or pulsed laser deposition · CPC title

• H10P14/44

  Physical vapour deposition [PVD] · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• C23C14/54

  Controlling or regulating the coating process · CPC title