Method of temperature conditioning compute module for cold start

US11960336B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11960336-B2
Application numberUS-202217662334-A
CountryUS
Kind codeB2
Filing dateMay 6, 2022
Priority dateMay 6, 2022
Publication dateApr 16, 2024
Grant dateApr 16, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Example embodiments relate to methods of increasing a temperature of a computer module to start the computer at environmental temperatures below a threshold temperature. An example embodiment includes receiving, at one or more computing components thermally coupled to a main computer via a liquid-cooled plate, a set of program instructions. The method can also include running the set of program instructions on at least one computing component. Running the set of program instructions on the computing component can generate heat that flows to the main computer via the liquid-cooled plate. The method can additionally include detecting, from at least one thermal sensor coupled to the liquid-cooled plate, a temperature reading indicative of a temperature of the main computer. The method can further include determining that the temperature reading has reached a predetermined temperature threshold and based on the temperature reading reaching the predetermined temperature threshold, powering on the main computer.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: receiving, at one or more integrated circuits, a set of program instructions, wherein the one or more integrated circuits are thermally coupled to a main computer via a liquid-cooled plate; running the set of program instructions on at least one integrated circuit of the one or more integrated circuits, wherein the one or more integrated circuits generate heat when running the set of program instructions, and wherein the generated heat flows into the liquid-cooled plate and to the main computer via the liquid-cooled plate; detecting, from at least one thermal sensor coupled to the liquid-cooled plate, a temperature reading indicative of a temperature of the main computer; determining that the temperature reading has reached a predetermined temperature threshold; and based on the temperature reading reaching the predetermined temperature threshold, powering on the main computer. 2. The method of claim 1 , wherein the set of program instructions comprises at least one of an instruction to perform a synthetic workload, an instruction to control switching activity on and off, an instruction to apply greater voltage, or an overclocking instruction. 3. The method of claim 2 , wherein the instruction to perform the synthetic workload comprises an arithmetically intense workload, wherein the instruction to control switching activity on and off comprises switching a clock tree on and off, and wherein the overclocking instruction comprises increasing clocking frequency. 4. The method of claim 1 , further comprising based on the temperature reading reaching the predetermined temperature threshold, running a second set of program instructions. 5. The method of claim 1 , further comprising: determining a desired powering-on time of the main computer; and running the set of program instructions on the at least one integrated circuit for at least a predetermined amount of time before the desired powering-on time of the main computer. 6. The method of claim 1 , further comprising based on the temperature reading reaching a second predetermined temperature threshold, flowing liquid through the liquid-cooled plate. 7. The method of claim 1 , further comprising selecting a portion of the main computer, and detecting from at least one thermal sensor near the portion of the main computer, a temperature of the portion of the main computer. 8. The method of claim 1 , wherein detecting, from at least one thermal sensor coupled to the liquid-cooled plate, the temperature reading indicative of the temperature of the main computer comprises detecting a minimum temperature. 9. The method of claim 1 , further comprising detecting, from a plurality of thermal sensors coupled to the liquid-cooled plate, an average temperature reading indicative of the temperature of the main computer. 10. The method of claim 1 , wherein the set of program instructions are received from a microprocessor, wherein the microprocessor operates below a threshold temperature. 11. A non-transitory, computer-readable medium having instructions stored thereon, wherein the instructions, when executed by a processor, cause the processor to execute a method comprising: receiving, at one or more integrated circuits, a set of program instructions, wherein the one or more integrated circuits are thermally coupled to a main computer via a liquid-cooled plate; running the set of program instructions on at least one integrated circuit of the one or more integrated circuits, wherein the one or more integrated circuits generate heat when running the set of program instructions, and wherein the generated heat flows into the liquid-cooled plate and to the main computer via the liquid-cooled plate; detecting, from at least one thermal sensor coupled to the liquid-cooled plate, a temperature reading indicative of a temperature of the main computer; determining that the temperature reading has reached a predetermined temperature threshold; and based on the temperature reading reaching the predetermined temperature threshold, powering on the main computer. 12. The non-transitory, computer readable medium of claim 11 , wherein the set of program instructions comprises at least one of an instruction to perform a synthetic workload, an instruction to control switching activity on and off, an instruction to apply greater voltage, or an overclocking instruction. 13. The non-transitory, computer readable medium of claim 12 , wherein the instruction to perform the synthetic workload comprises an arithmetically intense workload, wherein the instruction to control switching activity on and off comprises switching a clock tree on and off, and wherein the overclocking instruction comprises increasing clocking frequency. 14. The non-transitory, computer readable medium of claim 11 , further comprising based on the temperature reading reaching a second predetermined temperature threshold, flowing liquid through the liquid-cooled plate. 15. The non-transitory, computer readable medium of claim 11 , further comprising selecting a portion of the main computer, and detecting from at least one thermal sensor near the portion of the main computer, a temperature of the portion of the main computer. 16. The non-transitory, computer readable medium of claim 11 , wherein detecting, from at least one thermal sensor coupled to the liquid-cooled plate, the temperature reading indicative of the temperature of the main computer comprises detecting a minimum temperature. 17. The non-transitory, computer readable medium of claim 11 , further comprising detecting, from a plurality of thermal sensors coupled to the liquid-cooled plate, an average temperature reading indicative of the temperature of the main computer. 18. A computing system comprising: a main computer, wherein the main computer comprises a liquid-cooled plate; a plurality of integrated circuits thermally coupled to the main computer via the liquid-cooled plate; a plurality of thermal sensors coupled to the liquid-cooled plate; and a controller configured to perform a heating routine, wherein the heating routine comprises: receiving, at one or more integrated circuits of the plurality of integrated circuits, a set of program instructions; running the set of program instructions on one or more integrated circuits, wherein the one or more integrated circuits generate heat when running the set of program instructions, and wherein the generated heat flows into the liquid-cooled plate and to the main computer via the liquid-cooled plate; detecting, from at least one thermal sensor coupled to the liquid-cooled plate, a temperature reading indicative of a temperature of the main computer; determining that the temperature reading has reached a predetermined temperature threshold; and based on the temperature reading reaching the predetermined temperature threshold, powering on the main computer. 19. The method of claim 1 , wherein the liquid-cooled plate comprises a first side and a second side, wherein the main computer is thermally coupled to at least one of the first side or the second side of the liquid-cooled plate, and wherein the one or more integrated circuits are coupled to the first side and the second side of the liquid-cooled plate. 20. The method of claim 1 , wherein the set of program instructions is received at the one or more integrated circuits when the main computer is at a temperature of zero degrees Celsius or below, and wherein the at least one integrated circuit begins to run the se

Assignees

Inventors

Classifications

  • G06F1/206Primary

    comprising thermal management · CPC title

  • Clock generators with changeable or programmable clock frequency · CPC title

  • Monitoring of events, devices or parameters that trigger a change in power modality · CPC title

  • G06F1/20Primary

    Cooling means · CPC title

  • Energy efficient computing, e.g. low power processors, power management or thermal management · CPC title

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What does patent US11960336B2 cover?
Example embodiments relate to methods of increasing a temperature of a computer module to start the computer at environmental temperatures below a threshold temperature. An example embodiment includes receiving, at one or more computing components thermally coupled to a main computer via a liquid-cooled plate, a set of program instructions. The method can also include running the set of program…
Who is the assignee on this patent?
Waymo Llc
What technology area does this patent fall under?
Primary CPC classification G06F1/206. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).