Display device with conductive structure and perforated light-shielding layer in same layer

Patent metadata

Field	Value
Publication number	US-11960180-B2
Application number	US-202017256192-A
Country	US
Kind code	B2
Filing date	Apr 22, 2020
Priority date	Apr 26, 2019
Publication date	Apr 16, 2024
Grant date	Apr 16, 2024

Abstract

A display panel, a display apparatus, and a manufacturing method are disclosed. The display panel includes a base substrate having a first through hole; a conductive structure located on the base substrate and at least partially covering the first through hole; and a display structure including a first display structure, a control line, and a second display structure that are arranged in layers on a side of the base substrate where the conductive structure is located, wherein the first display structure has a second through hole, and the control line is electrically connected to the conductive structure by passing through the second through hole.

First claim

What is claimed is:

1. A display panel, comprising:
a base substrate, having a first through hole;
a conductive structure, located on the base substrate and at least partially covering the first through hole, wherein the conductive structure comprises a plurality of block structures, to facilitate connection to a plurality of contacts on a control integrated circuit (IC);
a display structure, comprising a first display structure, a control line, and a second display structure that are arranged in layers on a side of the base substrate where the conductive structure is located, wherein the first display structure has a second through hole, and the control line is electrically connected to the conductive structure by passing through the second through hole;
a fingerprint recognition assembly, comprising a perforated light-shielding layer and a fingerprint recognition sensor, wherein the conductive structure and the perforated light-shielding layer are structures located in a same layer, and the fingerprint recognition sensor is located on a side, distal from the display structure, of the perforated light-shielding layer; wherein the perforated light-shielding layer is provided with a plurality of apertures, and light emitted by the display structure and then reflected by a touch object passes through the plurality of apertures and is sensed by the fingerprint recognition sensor; and
a base layer located between the conductive structure and the first display structure, wherein the base layer has a third through hole in communication with the second through hole of the first display structure, and the control line is electrically connected to the conductive structure by passing through the second through hole and the third through hole;
wherein the first through hole, the second through hole, and the third through hole are coaxial;
the base substrate comprises a first polyimide structure layer and a first silicon oxide barrier layer that are arranged in layers along a direction close to the display structure, and the first through hole passes through the first polyimide structure layer and the first silicon oxide barrier layer;
the base layer comprises a second polyimide structure layer and a second silicon oxide barrier layer that are arranged in layers along the direction close to the display structure, and the third through hole passes through the second polyimide structure layer and the second silicon oxide barrier layer; and
the conductive structure and the perforated light-shielding layer are disposed between the first silicon oxide barrier layer and the second polyimide structure layer.

2. The display panel according to claim 1 , wherein a material of the conductive structure and a material of the perforated light-shielding layer comprise metal.

3. The display panel according to claim 1 , wherein the conductive structure is located within a display region of the display panel.

4. The display panel according to claim 1 , wherein the first display structure comprises a buffer layer and an active layer.

5. The display panel according to claim 4 , wherein a material of the buffer layer comprises silicon nitride or silicon oxide.

6. The display panel according to claim 1 , wherein the second display structure comprises a driving circuit layer, an organic light-emitting layer, and a package layer that are sequentially arranged along a direction away from the first display structure.

7. The display panel according to claim 1 , wherein an orthographic projection of the first through hole onto the base substrate is located within an area formed from an orthographic projection of the conductive structure onto the base substrate.

8. The display panel according to claim 1 , wherein the conductive structure is located within a display region of the display panel;
the first display structure comprises a buffer layer and an active layer, the second display structure comprises a driving circuit layer, an organic light-emitting layer, and a package layer that are sequentially arranged along a direction away from the first display structure; and
an orthographic projection of the first through hole onto the base substrate is located within an area formed from an orthographic projection of the conductive structure onto the base substrate.

9. A method of manufacturing a display panel, comprising:
providing a base substrate;
forming a conductive structure on the base substrate, wherein the conductive structure comprises a plurality of block structures, to facilitate connection to a plurality of contacts on a control integrated circuit (IC);
forming a display structure on the base substrate on which the conductive structure has been formed, wherein the display structure comprises a first display structure, a control line, and a second display structure that are arranged in layers on a side of the base substrate where the conductive structure is located, the first display structure comprises a second through hole, and the control line is electrically connected to the conductive structure by passing through the second through hole;
forming a first through hole in the base substrate, wherein the conductive structure at least partially covers the first through hole; and
forming a base layer between the conductive structure and the first display structure, wherein the base layer has a third through hole in communication with the second through hole of the first display structure, and the control line is electrically connected to the conductive structure by passing through the second through hole and the third through hole;
wherein forming the conductive structure on the base substrate comprises:
forming the conductive structure and a perforated light-shielding layer on the base substrate by a same patterning process, wherein the display panel comprises a fingerprint recognition assembly comprising the perforated light-shielding layer and a fingerprint recognition sensor, and the fingerprint recognition sensor is located on a side, distal from the display structure, of the perforated light-shielding layer; and wherein the perforated light-shielding layer is provided with a plurality of apertures, and light emitted by the display structure and then reflected by a touch object passes through the plurality of apertures and is sensed by the fingerprint recognition sensor;
wherein the first through hole, the second through hole, and the third through hole are coaxial;
the base substrate comprises a first polyimide structure layer and a first silicon oxide barrier layer that are arranged in layers along a direction close to the display structure, and the first through hole passes through the first polyimide structure layer and the first silicon oxide barrier layer;
the base layer comprises a second polyimide structure layer and a second silicon oxide barrier layer that are arranged in layers along the direction close to the display structure, and the third through hole passes through the second polyimide structure layer and the second silicon oxide barrier layer; and
the conductive structure and the perforated light-shielding layer are disposed between the first silicon oxide barrier layer and the second polyimide structure layer.

10. The method according to claim 9 , wherein forming the first through hole in the base substrate comprises:
forming the first through hole in the base substrate by a laser drilling process.

11. A display device, comprising a control integrated circuit (IC) and a display panel, wherein the display panel comprises:
a base substrate comprising a first through hole;
a conductive structure located on the base substrate and at least partially covering the first through hole, wherein the

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Chunyang
• Tian Hongwei
• Li Dong
• Li Liangjian

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title