Invisible microphone assembly for a vehicle
US-2021204044-A1 · Jul 1, 2021 · US
Microphone assembly and headlining assembly
US11956580B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11956580-B2 |
| Application number | US-202217706236-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 28, 2022 |
| Priority date | Apr 2, 2021 |
| Publication date | Apr 9, 2024 |
| Grant date | Apr 9, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the microphone element.
First claim
Opening claim text (preview).
What is claimed is: 1. A headlining assembly comprising a microphone assembly comprising: a circuit board; a microphone element connected to the circuit board; an external connection interface connected to the circuit board; a lower housing that fixes the circuit board and has a hole formed to expose a part of a back side of the circuit board or a sound receiving part of the microphone element; and an upper housing that is fixed to the lower housing and is formed to cover a front side of the circuit board, the microphone element, and the external connection interface, and the headlining assembly further comprising a headlining, wherein the headlining includes: a substrate having a front side bonded to a back side of the microphone assembly with an adhesive layer; and a skin covering a back side of the substrate, wherein neither the substrate nor the skin has holes.
Assignees
Inventors
Classifications
- H04R1/04Primary
Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title
Special constructions of mouthpieces · CPC title
Acoustic transducers and sound field adaptation in vehicles · CPC title
- H04R19/016Primary
for microphones · CPC title
Microphones (H04R19/01 takes precedence) · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11956580B2 cover?
- A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the …
- Who is the assignee on this patent?
- Hosiden Corp
- What technology area does this patent fall under?
- Primary CPC classification H04R1/04. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).