Antenna-integrated type communication module and manufacturing method for the same
US-2018205155-A1 · Jul 19, 2018 · US
US11955709B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11955709-B2 |
| Application number | US-202217862919-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 12, 2022 |
| Priority date | Jul 13, 2021 |
| Publication date | Apr 9, 2024 |
| Grant date | Apr 9, 2024 |
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An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, a first circuit board including a first core layer having a first surface and a second surface opposite to each other, a signal wiring extending on the first surface of the first core layer to be electrically connected to the antenna unit, and a first via structure penetrating through the first core layer, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the antenna unit and the first via structure.
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What is claimed is: 1. An antenna package, comprising: an antenna device comprising an antenna dielectric layer and an antenna unit disposed on the antenna dielectric layer; a first circuit board comprising: a first core layer having a first surface and a second surface opposite to each other, the first core layer being different from the antenna dielectric layer; a signal wiring extending on the first surface of the first core layer to be electrically connected to the antenna unit; and a first via structure penetrating through the first core layer; and a first connector mounted on the second surface of the first core layer, the first connector comprising a first terminal electrically connected to the antenna unit through the first via structure. 2. The antenna package of claim 1 , wherein one end portion of the signal wiring is bonded to the antenna unit, and the other end portion of the signal wiring is electrically connected to the first terminal of the first connector through the first via structure. 3. The antenna package of claim 1 , wherein the first connector further comprises a first barrier structure that is separated from the first terminal and surrounds a periphery of the first connector. 4. The antenna package of claim 3 , wherein the first connector further comprises a first insulator disposed within the first barrier structure to fix the first terminal, and a plurality of the first terminals arranged to be spaced apart from each other on the first insulator to form a double-column structure. 5. The antenna package of claim 4 , wherein the first insulator includes a low-k material having a dielectric constant in a range from 2 to 3.5. 6. The antenna package of claim 1 , further comprising: a second circuit board comprising a second core layer and a connection wiring; a second connector mounted on one surface of the second core layer to be coupled to the first connector, the second connector comprising a second terminal electrically connected to the first terminal; and an antenna driving integrated circuit chip mounted on the other surface of the second core layer to be electrically connected to the second connector through the connection wiring. 7. The antenna package of claim 6 , wherein the second circuit board further comprises a second via structure penetrating through the second core layer; and the connection wiring extends on the other surface of the second core layer to be electrically connected to the second terminal through the second via structure. 8. The antenna package of claim 6 , wherein the second connector further comprises a second barrier structure that is separated from the second terminal and surrounds a periphery of the second connector. 9. The antenna package of claim 8 , wherein the second connector further comprises a second insulator disposed within the second barrier structure to fix the second terminal; and a plurality of the second terminals arranged to be spaced apart from each other on the second insulator to form a double-column structure. 10. The antenna package of claim 9 , wherein the second insulator includes a low-k material having a dielectric constant in a range from 2 to 3.5. 11. An image display device, comprising: a display panel; and the antenna package of claim 1 disposed on the display panel.
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