Hermetically sealed optically transparent wafer-level packages and methods for making the same
US-2021028077-A1 · Jan 28, 2021 · US
Hollow package and method for manufacturing same
US11955394B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11955394-B2 |
| Application number | US-201917413728-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2019 |
| Priority date | Dec 27, 2018 |
| Publication date | Apr 9, 2024 |
| Grant date | Apr 9, 2024 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A hollow package ( 103 ) includes a substrate ( 109 ), an element ( 111 ), a partition wall ( 113 ), and a top plate ( 115 ) and has one or more closed hollow parts ( 117 ) that are covered by the substrate ( 109 ), the partition wall ( 113 ), and the top plate ( 115 ), and the substrate ( 109 ), the partition wall ( 113 ), and the top plate ( 115 ) are sealed with a cured product of a sealing resin composition. The top plate ( 115 ) and the partition wall ( 113 ) are composed of an organic material, and the thickness of the top plate ( 115 ), the thickness of the partition wall ( 113 ), the width of the partition wall, and the maximum width of the hollow part ( 117 ) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a hollow package, the method comprising the following steps 1 and 2: (step 1) providing one or more closed hollow parts by forming a partition wall and a top plate that are comprised of at least one organic material on a substrate; and (step 2) compression-molding a sealing resin composition at a low pressure of 0.1 MPa or more and less than 5.0 MPa to resin-seal the substrate, the partition wall, and the top plate, wherein the step 1 includes a step of mounting one or more elements selected from the group consisting of a semiconductor element, a MEMS component, and an electronic component on the substrate so that the one or more elements are disposed in the one or more closed hollow parts, and the sealing resin composition contains: (A) an epoxy resin containing one or more epoxy resins selected from the group consisting of an epoxy resin containing two epoxy groups in a molecule and an epoxy resin containing three or more epoxy groups in a molecule; and (B) an inorganic filler. 2. The method for manufacturing a hollow package according to claim 1 , wherein the organic material is a photosensitive dry film resist. 3. The method for manufacturing a hollow package according to claim 2 , wherein the organic material is a negative photosensitive dry film resist. 4. The method for manufacturing a hollow package according to claim 3 , wherein the organic material is the negative photosensitive dry film resist containing a photoacid generator and an epoxy resin. 5. The method for manufacturing a hollow package according to claim 1 , wherein the component (A) contains one or more epoxy resins selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin. 6. The method for manufacturing a hollow package according to claim 2 , wherein the component (A) contains one or more epoxy resins selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin. 7. The method for manufacturing a hollow package according to claim 3 , wherein the component (A) contains one or more epoxy resins selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin. 8. The method for manufacturing a hollow package according to claim 4 , wherein the component (A) contains one or more epoxy resins selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin. 9. A method for manufacturing a hollow package, the method comprising: forming a partition wall and a top plate that are comprised of at least one organic material on a substrate, thereby providing an assembly of the substrate, the partition wall, and the top plate, the assembly having one or more closed hollow parts and compression-molding a sealing resin composition surrounding the assembly of the substrate, the partition wall, and the top plate at a low pressure of 0.1 MPa or more and less than 5.0 MPa to resin-seal the assembly of the substrate, the partition wall, and the top plate, wherein one or more elements selected from the group consisting of a semiconductor element, a MEMS component, and an electronic component are mounted on the substrate so that the one or more elements are disposed in the one or more closed hollow parts, and the sealing resin composition contains: (A) an epoxy resin containing one or more epoxy resins selected from the group consisting of an epoxy resin containing two epoxy groups in a molecule and an epoxy resin containing three or more epoxy groups in a molecule; and (B) an inorganic filler. 10. The method for manufacturing a hollow package according to claim 9 , wherein the organic material is a photosensitive dry film resist. 11. The method for manufacturing a hollow package according to claim 10 , wherein the organic material is a negative photosensitive dry film resist. 12. The method for manufacturing a hollow package according to claim 11 , wherein the organic material is the negative photosensitive dry film resist containing a photoacid generator and an epoxy resin. 13. The method for manufacturing a hollow package according to claim 10 , wherein the component (A) contains one or more epoxy resins selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin. 14. The method for manufacturing a hollow package according to claim 11 , wherein the component (A) contains one or more epoxy resins selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin. 15. The method for manufacturing a hollow package according to claim 12 , wherein the component (A) contains one or more epoxy resins selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.
Assignees
Inventors
Classifications
Manufacture or treatment · CPC title
Encapsulations, e.g. protective coatings · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
by a substrate and the encapsulations · CPC title
Containers comprising an insulating or insulated base · CPC title
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Frequently asked questions
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- What does patent US11955394B2 cover?
- A hollow package ( 103 ) includes a substrate ( 109 ), an element ( 111 ), a partition wall ( 113 ), and a top plate ( 115 ) and has one or more closed hollow parts ( 117 ) that are covered by the substrate ( 109 ), the partition wall ( 113 ), and the top plate ( 115 ), and the substrate ( 109 ), the partition wall ( 113 ), and the top plate ( 115 ) are sealed with a cured product of a sealing …
- Who is the assignee on this patent?
- Sumitomo Bakelite Co, Nippon Kayaku Kk, Towa Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W74/473. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).