Thermosensitive deformation apparatus

Patent metadata

Field	Value
Publication number	US-11955205-B2
Application number	US-201013375167-A
Country	US
Kind code	B2
Filing date	May 21, 2010
Priority date	Jun 11, 2009
Publication date	Apr 9, 2024
Grant date	Apr 9, 2024

Abstract

A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.

First claim

The invention claimed is:

1. A thermosensitive deformation apparatus comprising:
a high-temperature bimetal plate made of a two-layered cladding material consisting of
a single high thermal expansion layer made of austenitic stainless steel, and
a single low thermal expansion layer made of a thermosensitive magnetic metal having a Curie point and pressure-bonded directly to said single high thermal expansion layer, wherein a thermal expansion coefficient of the single high thermal expansion layer is higher than a thermal expansion coefficient of the single low thermal expansion layer; and
a fixing member fixing an end of the high-temperature bimetal plate,
wherein opposite end of the high-temperature bimetal plate is a free end which is not fixed,
wherein a range of an operating temperature is over both a high temperature range of not less than said Curie point and a low temperature range of less than said Curie point, wherein an upper limit of operating temperatures in said high temperature range of not less than said Curie point is at least 500° C.,
wherein said high-temperature bimetal plate is formed to bend resulting from a deformation by rising temperature,
wherein a bending coefficient in said high temperature range of not less than said Curie point is smaller than a bending coefficient in said low temperature range of less than said Curie point,
a range of said operating temperatures in said high temperature range of not less than said Curie point is larger than a range of operating temperatures in said low temperature range of less than said Curie point, and
a thickness of said single low thermal expansion layer is larger than a thickness of said single high thermal expansion layer.

2. The thermosensitive deformation apparatus according to claim 1 , wherein said Curie point of said thermosensitive magnetic metal of said low thermal expansion layer is at least 100° C. and not more than 400° C., and said upper limit of said operating temperatures in said high temperature range of not less than said Curie point is at least 500° C. and not more than 700° C.

3. The thermosensitive deformation apparatus according to claim 1 , wherein said thermosensitive magnetic metal of said low thermal expansion layer is a Ni—Fe alloy.

4. The thermosensitive deformation apparatus according to claim 3 , wherein said thermosensitive magnetic metal of said low thermal expansion layer is a Ni—Fe alloy containing at least 32 mass % and not more than 45 mass % of Ni.

5. The thermosensitive deformation apparatus according to claim 4 , wherein said thermosensitive magnetic metal of said low thermal expansion layer is formed by adding at least one of Nb, Cr, Al, Si, and Ti to said Ni—Fe alloy.

6. The thermosensitive deformation apparatus according to claim 5 , wherein said thermosensitive magnetic metal of said low thermal expansion layer is formed by adding at least 2 mass % and not more than 8 mass % of Nb to said Ni—Fe alloy.

7. The thermosensitive deformation apparatus according to claim 6 , wherein said thermosensitive magnetic metal of said low thermal expansion layer is formed by adding 6 mass % of Nb to a Ni—Fe alloy containing 36 mass % of Ni.

8. The thermosensitive deformation apparatus according to claim 6 , wherein said thermosensitive magnetic metal of said low thermal expansion layer is formed by adding 2 mass % of Nb to a Ni—Fe alloy containing 36 mass % of Ni.

9. The thermosensitive deformation apparatus according to claim 1 , wherein a thermal expansion coefficient of said low thermal expansion layer in said high temperature range of not less than said Curie point is smaller than a thermal expansion coefficient of said high thermal expansion layer and larger than a thermal expansion coefficient of said low thermal expansion layer in said low temperature range of less than said Curie point.

10. The thermosensitive deformation apparatus according to claim 9 , wherein said thermal expansion coefficient of said low thermal expansion layer in said high temperature range of not less than said Curie point is at least twice said thermal expansion coefficient of said low thermal expansion layer in said low temperature range of less than said Curie point.

11. The thermosensitive deformation apparatus according to claim 1 , wherein a thermal expansion coefficient of said low thermal expansion layer in said low temperature range of less than said Curie point is not more than 50% of a thermal expansion coefficient of said high thermal expansion layer.

Assignees

• Oda Yoshimitsu
• Ishio Masaaki
• Proterial Ltd

Inventors

• Oda Yoshimitsu
• Ishio Masaaki

Classifications

• G12B1/02 Primary

  Compound strips or plates, e.g. bimetallic · CPC title

• B32B15/011

  all layers being formed of iron alloys or steels · CPC title

• C22C38/08

  containing nickel {(C22C38/105 takes precedence)} · CPC title

• C22C38/12

  containing tungsten, tantalum, molybdenum, vanadium, or niobium · CPC title

• C22C38/40

  with nickel · CPC title