Coated metal alloy substrates and process of production thereof

Patent metadata

Field	Value
Publication number	US-11952665-B2
Application number	US-201917298901-A
Country	US
Kind code	B2
Filing date	Jun 11, 2019
Priority date	Jun 11, 2019
Publication date	Apr 9, 2024
Grant date	Apr 9, 2024

Abstract

A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.

First claim

The invention claimed is:

1. A coated metal alloy substrate for an electronic device comprising:
a metal alloy substrate and a passivation layer deposited on the metal alloy substrate;
a porous conductive water borne carbon nanotube layer on the passivation layer; and
an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer, wherein the porous conductive water borne carbon nanotube layer comprises 30 to 75 wt % porous carbon nanotubes and 0.3 to 5.0 wt. % water borne resin, based on the total weight of the porous conductive water borne carbon nanotube layer.

2. The coated metal alloy substrate according to claim 1 , wherein the passivation layer is a transparent passivation layer comprising a chelating agent and a metal ion or chelated metal complex thereof.

3. A coated metal alloy substrate according to claim 2 , wherein the chelating agent is selected from ethylenediaminetetraacetic acid, ethylenediamine, nitrilotriacetic acid, diethylenetriaminepenta(methylenephosphonic acid), nitrilotris(methylenephosphonic acid), 1-hydroxyethane-1,1-diphosphonic acid and phosphoric acid, and the metal ion is selected from an aluminum ion, a nickel ion, a chromium ion, a tin ion, an indium ion, and a zinc ion.

4. The coated metal alloy substrate according to claim 1 , wherein the porous conductive water borne carbon nanotube layer further comprises a component selected from silver nanowire, graphene, aluminium powder and combinations thereof.

5. The coated metal alloy substrate according to claim 1 , wherein the water borne resin is selected from a polyacrylate polymer, a polyamide polymer, a polyester polymer and a polyurethane polymer.

6. The coated metal alloy substrate according to claim 1 , wherein the electrophoretic deposition layer comprises an electrophoretic polymer selected from polyacrylic polymer, polyacrylamide-acrylic copolymer and epoxy-containing polymer.

7. The coated metal alloy substrate according to claim 1 , wherein the metal alloy substrate comprises a metal selected from aluminium, magnesium lithium, titanium, niobium, zinc and alloys thereof.

8. The coated metal alloy substrate according to claim 1 , wherein the metal alloy substrate is an insert moulded metal substrate comprising a plastic insert.

9. The coated metal alloy substrate according to claim 8 , wherein a plastic in the plastic insert is selected from polybutylene terephthalate, polyphenylene sulfide, polyamide, polyphthalamide, acrylonitrile butadiene styrene, polyetheretherketone, polycarbonate and acrylonitrile butadiene styrene with polycarbonate.

10. The coated metal alloy substrate according to claim 1 , wherein the electronic device is selected from a computer, a laptop, a tablet, a workstation, a cell phone, a portable networking device, a portable gaming device and a portable GPS.

11. A process for producing a coated a metal alloy substrate for an electronic device comprising:
applying a passivation layer to a metal alloy substrate;
applying a porous conductive water borne carbon nanotube layer to the passivation layer; and
applying an electrophoretic deposition layer to the porous conductive water borne carbon nanotube layer, wherein the porous conductive water borne carbon nanotube layer comprises 30 to 75 wt % porous carbon nanotubes and 0.3 to 5.0 wt. % water borne resin, based on the total weight of the porous conductive water borne carbon nanotube layer.

12. A process for coating a metal alloy substrate according to claim 11 , wherein the metal alloy substrate bearing the porous conductive water borne carbon nanotube layer is made an electrode of an electrochemical cell, wherein the electrochemical cell has an inert electrode as the counter electrode and an electrolyte comprising the electrophoretic polymer.

13. A process for coating a metal alloy substrate according to claim 12 , wherein a potential difference is applied across the electrodes of the electrochemical cell to deposit the electrophoretic polymer over the passivation layer.

14. An electronic device having a housing, wherein the housing comprises:
a metal alloy substrate;
a passivation layer deposited on the metal alloy substrate;
a porous conductive water borne carbon nanotube layer on the passivation layer; and
an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer, wherein the porous conductive water borne carbon nanotube layer comprises 30 to 75 wt % porous carbon nanotubes and 0.3 to 5.0 wt. % water borne resin, based on the total weight of the porous conductive water borne carbon nanotube layer.

Assignees

• Hewlett Packard Development Co

Inventors

• Wu Kuan-Ting
• Hsieh Hsing-Hung
• Liao Super

Classifications

• C23C28/00 Primary

  Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• C09D5/4411

  Homopolymers or copolymers of acrylates or methacrylates · CPC title

• C09D5/443

  Polyepoxides · CPC title

• C25D13/12

  characterised by the article coated · CPC title