Steel for a mold and mold

US11952640B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11952640-B2
Application numberUS-202318111381-A
CountryUS
Kind codeB2
Filing dateFeb 17, 2023
Priority dateFeb 24, 2022
Publication dateApr 9, 2024
Grant dateApr 9, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a steel for a mold including: on % by mass basis, 0.55%≤C≤0.70%; 0.30%≤Si≤0.60%; 0.55%≤Mn≤1.2%; 5.7%≤Cr≤6.9%; 1.2%≤Mo+W/2≤1.6%; 0.55%≤V≤0.79%; and 0.005%≤N≤0.1%, with the remainder being Fe and inevitable impurities including, Al≤0.020%, Ni≤0.20%, S≤0.0015%, and Cu≤0.10%, and satisfying P1≥24 and 4.9≤P2≤7.3, P1 and P2 being a value obtained based on the following formula (1) and (2), respectively, P1=45−13.6[Si]−7.0([Mo]+[W]/2)−12.9[Ni] (1), P2=7.4[V]+15.8[N]+38.6[Al] (2) in which [M] represents a content of an element M in % by mass basis, and relates to a mold including the steel for a mold.

First claim

Opening claim text (preview).

What is claimed is: 1. A steel for a mold, having a composition consisting of, on % by mass basis: 0.55%≤C≤0.70%; 0.30%≤Si≤0.60%; 0.55%≤Mn≤1.2%; 5.7%≤Cr≤6.9%; 1.2%≤Mo+W/2≤1.6%; 0.55%≤V≤0.79%; 0.005%≤N≤0.1%, Nb≤0.5%; Zr≤0.5%; Ta≤0.5%; and Co≤1.0%, with the remainder being Fe and inevitable impurities satisfying, on % by mass basis, Al≤0.020%, Ni≤0.20%, S≤0.0015%, and Cu≤0.10%, and satisfying P1≥24 and 4.9≤P2≤7.3, P1 being a value obtained based on the following formula (1) and P2 being a value obtained based on the following formula (2), P1=45−13.6[Si]−7.0([Mo]+[W]/2)−12.9[Ni]  (1) P2=7.4[V]+15.8[N]+38.6[Al]  (2) in the formulae (1) and (2), [M] represents a content of an element M in % by mass basis, wherein in a state after quenching and tempering, the steel has a hardness at room temperature of 58 HRC or more and 61 HRC or less, and a thermal conductivity at room temperature of 20 W/(m·K) or more, and in a state after quenching, the steel has a crystal grain size of 5 or more in terms of a grain size number defined in JIS G 0551:2020. 2. The steel for a mold according to claim 1 , further satisfying, on % by mass basis, at least one kind selected from the group consisting of: 0.01%≤Nb≤0.5%; 0.01%≤Zr≤0.5%; and 0.01%≤Ta≤0.5%. 3. The steel for a mold according to claim 1 , further satisfying, on % by mass basis, 0.10%≤Co≤1.0%. 4. The steel for a mold according to claim 1 , wherein in a state after quenching and tempering, the steel has a grain size of a crystallized carbide of less than 25 km. 5. A mold comprising the steel for a mold according to claim 1 . 6. The mold according to claim 5 , wherein the mold is a hot stamping mold. 7. The steel for a mold according to claim 1 , further satisfying, on % by mass basis, 0.55%≤C≤0.63%. 8. The steel for a mold according to claim 1 , further satisfying, on % by mass basis, 0.005%≤N≤0.0244%.

Assignees

Inventors

Classifications

  • C21D9/00Primary

    Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor · CPC title

  • Hardening (C21D1/02 takes precedence); Quenching with or without subsequent tempering (quenching devices C21D1/62) · CPC title

  • containing Cr and Ni · CPC title

  • containing Mn · CPC title

  • containing Co · CPC title

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What does patent US11952640B2 cover?
The present invention relates to a steel for a mold including: on % by mass basis, 0.55%≤C≤0.70%; 0.30%≤Si≤0.60%; 0.55%≤Mn≤1.2%; 5.7%≤Cr≤6.9%; 1.2%≤Mo+W/2≤1.6%; 0.55%≤V≤0.79%; and 0.005%≤N≤0.1%, with the remainder being Fe and inevitable impurities including, Al≤0.020%, Ni≤0.20%, S≤0.0015%, and Cu≤0.10%, and satisfying P1≥24 and 4.9≤P2≤7.3, P1 and P2 being a value obtained based on the followin…
Who is the assignee on this patent?
Daido Steel Co Ltd
What technology area does this patent fall under?
Primary CPC classification C21D9/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).