Nerve cuff electrodes fabricated using over-molded LCP substrates

US11951301B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11951301-B2
Application numberUS-202217807349-A
CountryUS
Kind codeB2
Filing dateJun 16, 2022
Priority dateOct 31, 2016
Publication dateApr 9, 2024
Grant dateApr 9, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrode lead, comprising: an elongated lead body having a proximal end and a distal end; a lead connector including a planar connector substrate disposed at a proximal end of the lead body, at least one connector pad carried by the connector substrate, at least one rigid connector contact having an arcuate surface affixed to the connector substrate and electrically coupled respectively to the at least one connector pad, and a cylindrical, rigid, electrical insulator at least partially encapsulating the connector substrate and the at least one connector contact, such that only the arcuate surface of each of the at least one connector contact is exposed; an electrode carrying structure disposed at a distal end of the lead body; at least one electrode contact carried by the electrode carrying structure; and at least one electrical conductor extending through the lead body between the at least one connector contact and the at least one electrode contact. 2. The electrode lead of claim 1 , wherein the arcuate surface of each of the at least one connector contact conforms with an outer surface of the electrical insulator. 3. The electrode lead of claim 1 , wherein the electrical insulator is composed of an epoxy or polyurethane. 4. The electrode lead of claim 1 , wherein each of the at least one connector contact has an arc length of 180 degrees or less. 5. The electrode lead of claim 1 , wherein each of the at least one connector contact has an arc length greater than 180 degrees. 6. The electrode lead of claim 1 , wherein each of the at least one connector contact is disk-shaped. 7. The electrode lead of claim 1 , wherein each of the at least one connector contact is half-moon shaped. 8. The electrode lead of claim 1 , wherein each of the at least one connector contact has a notch in which the connector substrate is disposed. 9. The electrode lead of claim 1 , wherein the lead body is planar. 10. The electrode lead of claim 1 , wherein the electrode carrying structure is planar. 11. The electrode lead of claim 10 , wherein the electrode carrying structure comprises a biologically compatible, elastic, electrically insulative cuff body affixed to the distal end of the lead body, the cuff body configured for being circumferentially disposed around a nerve, wherein the at least one electrode contact is affixed to the cuff body. 12. The electrode lead of claim 11 , wherein the at least one electrode contact is configured for being on an inner surface of the cuff body when circumferentially disposed around a nerve. 13. The electrode lead of claim 12 , wherein the electrode carrying structure comprises a biologically compatible, elastic, electrically insulative paddle body affixed to the distal end of the lead body. 14. The electrode lead of claim 1 , further comprising an outer layer of insulative material composed of one of silicone, polyurethane, polyether polyurethane, polycarbonate polyurethane, parylene, perfluoroalkoxy alkanes (PFA), and polytetrafluoroethylene (PTFE). 15. The electrode lead of claim 1 , wherein the connector substrate is a planar dielectric substrate. 16. The electrode lead of claim 15 , wherein the planar dielectric substrate is composed of liquid crystal polymer (LCP). 17. The electrode lead of claim 15 , wherein each of the at least one electrical conductor is an electrically conductive trace embedded within the planar dielectric substrate. 18. The electrode lead of claim 17 , wherein the at least one electrode contact comprises three electrode contacts in a tripolar electrode arrangement. 19. The electrode lead of claim 1 , wherein the lead connector is configured for being inserted into a corresponding connector of a neurostimulator.

Assignees

Inventors

Classifications

  • A61N1/0556Primary

    Cuff electrodes · CPC title

  • Details of casing-lead connections · CPC title

  • Electromyography [EMG] · CPC title

  • Anchoring or fixation means therefor · CPC title

  • Implantable neurostimulators for stimulating central or peripheral nerve system · CPC title

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Frequently asked questions

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What does patent US11951301B2 cover?
An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into…
Who is the assignee on this patent?
The Alfred E Mann Foundation For Scient Research
What technology area does this patent fall under?
Primary CPC classification A61N1/0556. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Apr 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).