Heat sink for an electronic component

Patent metadata

Field	Value
Publication number	US-11948856-B2
Application number	US-201816768737-A
Country	US
Kind code	B2
Filing date	Nov 6, 2018
Priority date	Dec 4, 2017
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

Various embodiments include a heat sink comprising: a base plate with an assembly surface for an electronic component; and a cooling structure bonded to the base plate increasing a surface area of the heat sink. The base plate comprises a metal-ceramic composite with a ceramic phase and a metallic phase. The cooling structure comprises a metal. A bond between the cooling structure and the base plate consists of a purely metallic bond between the cooling structure and the metallic phase of the base plate.

First claim

What is claimed is:

1. A method of producing a heat sink for an electronic component, the method comprising:
fabricating a base plate comprising a metal-ceramic composite with a ceramic phase and a metallic phase, wherein the metallic phase comprises a metal alloy with a primary metal and one or more additional metals, wherein a content of the primary metal is greater than a respective content of any of the one or more additional metals;
mounting the electronic component or an interconnect for the electronic component on a first side of the base plate; and
after mounting the electronic component or the interconnect on the base plate, fabricating a cooling structure on a second side opposite the first side of the base plate using an additive manufacturing process, wherein the additive manufacturing process melts the primary metal of the base plate;
wherein the cooling structure comprises the primary metal;
wherein the cooling structure defines a channel for a cooling medium; and
a bond between the cooling structure and the base plate consists of a purely metallic bond formed between the primary metal of the cooling structure and the primary metal of the metallic phase of the base plate as the metallic phase of the base plate solidifies after melting in the additive manufacturing process;
wherein a first coefficient of thermal expansion of the electronic component matches a second coefficient of thermal expansion of the ceramic phase.

2. The method as claimed in claim 1 , further comprising:
inserting the base plate into a system for additively manufacturing the heat sink.

3. The method as claimed in claim 1 , wherein the base plate comprises part of a power electronics module.

4. The method as claimed in claim 1 , wherein the additive manufacturing method includes a selective laser melting method or an electron beam melting method.

Assignees

• Siemens Ag

Inventors

• Reznik Daniel

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/257 Primary

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• Y02P10/25

  Process efficiency · CPC title