Substrate treating apparatus
US-11521881-B2 · Dec 6, 2022 · US
US11948823B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11948823-B2 |
| Application number | US-202218051144-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 31, 2022 |
| Priority date | Sep 20, 2019 |
| Publication date | Apr 2, 2024 |
| Grant date | Apr 2, 2024 |
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A substrate treating apparatus includes a carrier platform, a transport mechanism, and a controller. The carrier platform places a carrier thereon. The carrier includes a plurality of shelves arranged in an up-down direction. The shelves are each configured to place one substrate thereon in a horizontal posture. The transport mechanism is configured to transport a substrate to a carrier placed on the carrier platform. The controller controls the transport mechanism. The transport mechanism includes a hand and a hand driving unit. The hand supports a substrate. The hand driving unit moves the hand. The controller changes a height position of the hand when the hand is inserted between two of the shelves adjacent to each other in the up-down direction, depending on a shape of a substrate taken from or placed on one of the shelves by the transport mechanism.
Opening claim text (preview).
What is claimed is: 1. A substrate treating apparatus, comprising: a mount table; a transport mechanism configured to transport a substrate to the mount table; and a controller configured to control the transport mechanism, wherein the mount table includes a plurality of shelves arranged in an up-down direction, the shelves are each configured to place the substrate thereon in a horizontal posture, the transport mechanism includes: a hand configured to support the substrate and configured to include a suction portion, the suction portion configured to flow gas along a first face of the substrate and configured to suck the substrate without contacting the substrate on any part of the hand; a hand driving unit configured to move the hand; and a suction adjusting unit configured to adjust a flow rate of the gas supplied to the suction portion, and the controller receives, before the hand is inserted between two of the shelves adjacent to each other in the up-down direction, a detected result which indicates a detected shape of a substrate either taken from one of the shelves by the transport mechanism or placed on one of the shelves by the transport mechanism, and changes a flow rate of the gas to be supplied to the suction portion, depending on the detected shape of the substrate; a plurality of the substrates are classified into, a first substrate that has a recess and does not include a protective plate made of glass, the recess being formed by a main portion of the substrate, located inward of a peripheral portion of the substrate, being recessed from the peripheral portion of the substrate; and a second substrate that does not have the recess, when a substrate taken from or placed on one of the shelves by the transport mechanism corresponds to the first substrate, the controller causes the suction adjusting unit to adjust the flow rate of the gas to be supplied to the suction portion, before the suction portion starts sucking the substrate, to a first flow rate, and when a substrate taken from or placed on one of the shelved by the transport mechanism corresponds to the second substrate, the controller causes the suction adjusting unit to adjust the flow rate of the gas, supplied to the suction portion when the suction portion starts sucking the substrate, to a second flow rate larger than the first flow rate. 2. The substrate treating apparatus according to claim 1 , wherein the controller changes the flow rate of the gas supplied to the suction portion, depending on a thickness of a main portion of a substrate either taken from one of the shelves by the transport mechanism or placed on one of the shelves by the transport mechanism, the main portion located inward of a peripheral portion of the substrate. 3. The substrate treating apparatus according to claim 2 , wherein the controller increases the flow rate of the gas supplied to the suction portion as the thickness of the main portion of the substrate taken from or placed on one of the shelves by the transport mechanism becomes thicker. 4. The substrate treating apparatus according to claim 1 , wherein the suction portion is configured to flow gas along a top face of the substrate and configured to suck the substrate upward. 5. The substrate treating apparatus according to claim 4 , wherein the hand includes: a base; a first receiver supported on the base and disposed below the substrate sucked by the suction portion, and capable of receiving at least either a back face of the substrate or an edge of the substrate; a second receiver supported on the base and disposed below the substrate sucked by the suction portion, and capable of receiving of at least either the back face of the substrate or the edge of the substrate; and a receiver driving unit configured to cause the second receiver to move with respect to the base so that the second receiver accesses the first receiver and moves away from the first receiver. 6. A substrate treating apparatus, comprising: a mount table; a transport mechanism configured to transport a substrate to the mount table; and a controller configured to control the transport mechanism, wherein the mount table includes a plurality of shelves arranged in an up-down direction, the shelves are each configured to place the substrate thereon in a horizontal posture, the transport mechanism includes: a hand configured to support the substrate and configured to include a suction portion, the suction portion configured to flow gas along a first face of the substrate and configured to suck the substrate without contacting the substrate on any part of the hand; a hand driving unit configured to move the hand; and a suction adjusting unit configured to adjust a flow rate of the gas supplied to the suction portion, and the controller receives, before the hand is inserted between two of the shelved adjacent to each other in the up-down direction, a detected result which indicates a detected shape of a substrate either taken from one of the shelves by the transport mechanism or placed on of the shelves by the transport mechanism, and changes a flow rate of the gas to be supplied to the suction portion, depending on the detected shape of the substrate, a plurality of the substrates are classified into: a first substrate that has a recess and does not include a protective plate made of glass, the recess being formed by a main portion of the substrate, located inward of a peripheral portion of the substrate, being recessed from the peripheral portion of the substrate; and a third substrate that has a recess and includes a protective plate made of glass, when a substrate taken from or placed on one of the shelves by the transport mechanism corresponds to the first substrate, the controller causes the suction adjusting unit to adjust the flow rate of the gas, supplied to the suction portion when the suction portion starts sucking the substrate, to a first flow rate, and when a substrate taken from or placed on one of the shelves by the transport mechanism corresponds to the third substrate, the controller causes the suction adjusting unit to adjust the flow rate of the gas, to be supplied to the suction portion, before the suction portion starts sucking the substrate, to a third flow rate larger than the first flow rate. 7. A substrate treating apparatus, comprising: a mount table; a transport mechanism configured to transport a substrate to the mount table; and a controller configured to control the transport mechanism, wherein the mount table includes a plurality of shelves arranged in an up-down direction, the shelves are each configured to place the substrate thereon in a horizontal posture, the transport mechanism includes: a hand configured to support the substrate and configured to include a suction portion, the suction portion configured to flow gas along a first face of the substrate and configured to suck the substrate without contacting the substrate on any part of the hand; a hand driving unit configured to move the hand; and a suction adjusting unit configured to adjust a flow rate of the gas supplied to the suction portion, and the controller receives, before the hand is inserted between two of the shelved adjacent to each other in the up-down direction, a detected result which indicates a detected shape of a substrate either taken from one of the shelves by the transport mechanism or placed on of the shelves by the transport mechanism, and changes a flow rate of the gas to be supplied to the suction portion, depending on the detected shape of the substrate, a plurality of the substrates are classified into— a first substrate having a first predetermined shape; and a second substrate having a second predetermined shape; and t
Storage means · CPC title
surrounding a central transfer chamber · CPC title
using vacuum or suction, e.g. Bernoulli chucks · CPC title
the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title
Mechanical parts of transfer devices · CPC title
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