Electronic component

Patent metadata

Field	Value
Publication number	US-11948743-B2
Application number	US-202217752908-A
Country	US
Kind code	B2
Filing date	May 25, 2022
Priority date	May 31, 2021
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

First claim

What is claimed is:

1. An electronic component comprising:
an electronic element; and
an interposer board; wherein
the electronic element includes:
a rectangular or substantially rectangular multilayer body including dielectric layers and internal electrode layers which are alternately laminated, a pair of multilayer body end surfaces orthogonal or substantially orthogonal to the internal electrode layers, a pair of multilayer body side surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces, and a pair of multilayer body main surfaces orthogonal or substantially orthogonal to the multilayer body end surfaces and the multilayer body side surfaces; and
external electrodes each on a respective one of the pair of multilayer body end surfaces of the multilayer body and connected to the internal electrode layers;

the interposer board includes a pair of board end surfaces, a pair of board side surfaces orthogonal or substantially orthogonal to the board end surfaces, and a pair of board main surfaces orthogonal or substantially orthogonal to the board end surfaces and the board side surfaces;
one of the pair of board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in a vicinity of the interposer board;
the interposer board is an alumina board; and
the pair of board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

2. The electronic component according to claim 1 , wherein the metal layer includes:
a Ni plated layer on an outer periphery of the Cu layer; and
a second Sn plated layer on an outer periphery of the Ni plated layer.

3. The electronic component according to claim 1 , wherein the interposer board includes:
the metal layer including the Cu layer;
a Ni plated layer on an outer periphery of the Cu layer; and
a second Sn plated layer on an outer periphery of the Ni plated layer, on the one of the pair of board main surfaces in the vicinity of the electronic element, in a vicinity of the pair of board end surfaces.

4. The electronic component according to claim 1 , wherein each of the external electrodes and the metal layer on the pair of board end surfaces are covered by a first Sn plated layer.

5. The electronic component according to claim 1 , wherein the interposer board includes a recess in each of the pair of board end surfaces.

6. The electronic component according to claim 1 , wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 2.01 mm to about 2.20 mm, a width between the pair of multilayer body side surfaces is about 1.30 mm to about 1.50 mm, a thickness between the pair of multilayer body main surfaces is about 1.70 mm to about 1.9 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm.

7. The electronic component according to claim 1 , wherein, in the electronic element, a length between the pair of multilayer body end surfaces is about 3.1 mm to about 3.3 mm, a width between the pair of multilayer body side surfaces is about 1.5 mm to about 2.7 mm, a thickness between the pair of multilayer body main surfaces is about 1.5 mm to about 2.7 mm, a thickness of each of the dielectric layers is about 0.4 μm to about 0.8 μm, and a thickness of each of the internal electrode layers is about 0.4 μm to about 0.8 μm.

8. The electronic component according to claim 1 , wherein the electronic element is a capacitor.

9. The electronic component according to claim 1 , wherein each of the dielectric layers includes barium titanate as a main component.

10. The electronic component according to claim 9 , wherein each of the dielectric layers further includes at least one of Mn compounds, Fe compounds, Cr compounds, Co compounds and Ni compounds as a sub-component.

11. The electronic component according to claim 1 , wherein each of the internal electrode layers includes Ni as a main component.

12. The electronic component according to claim 1 , wherein each of the external electrodes includes an electrically conductive resin layer.

13. The electronic component according to claim 12 , wherein each of the external electrodes includes a Ni plated layer on the electrically conductive resin layer.

14. The electronic component according to claim 13 , wherein each of the Ni plated layers extends onto a portion of each of the pair of multilayer main body main surfaces and the pair of multilayer body side surfaces.

15. The electronic component according to claim 12 , wherein
each of the external electrodes includes a Cu electrode layer between the multilayer body end surface and the electrically conductive resin layer; and
each of the external electrodes includes a gap between the Cu electrode layer and the electrically conductive resin layer.

16. The electronic component according to claim 15 , wherein each of the Cu electrode layers extends onto a portion of each of the pair of multilayer main body main surfaces and the pair of multilayer body side surfaces.

17. The electronic component according to claim 12 , wherein each of the electrically conductive resin layers includes a thermosetting resin and a metal component.

18. The electronic component according to claim 17 , wherein the thermosetting resin includes at least one of epoxy resin, phenolic resin, urethane resin, silicone resin, or polyimide resin.

19. The electronic component according to claim 17 , wherein the metal component includes Ag or a metal powder coated with Ag on a surface of the base metal powder.

20. The electronic component according to claim 12 , wherein each of the electrically conductive resin layers extends onto a portion of each of the pair of multilayer main body main surfaces and the pair of multilayer body side surfaces.

Assignees

• Murata Manufacturing Co

Inventors

• Ikeda Mitsuru
• Nishisaka Yasuhiro

Classifications

• H01G2/06 Primary

  specially adapted for mounting on a printed-circuit support · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title